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A method for preparing metal silicon based on intermediate frequency smelting and recycling diamond wire cutting silicon mud

A technology of diamond wire cutting and metal silicon, which is applied in the direction of non-metal elements, chemical instruments and methods, silicon compounds, etc., can solve the problems of waste of silicon mud resources in diamond wire cutting, facilitate slag removal, reduce dust emissions, and maintain The effect of long-term drying

Active Publication Date: 2021-10-22
刘亮
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to provide a method for preparing metallic silicon based on intermediate frequency smelting and recycling diamond wire cutting silicon mud, so as to solve the problem of resource waste of diamond wire cutting silicon mud in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The method for preparing metal silicon based on intermediate frequency smelting and recycling diamond wire cutting silicon mud described in this embodiment includes the following steps:

[0029] (1) Add CaO desiccant to diamond wire cutting silicon mud according to the mass ratio of 1:100, add cornstarch according to the mass ratio of 1:25, add water according to the mass ratio of 1:10, stir well, and then put the The silica mud mixture is granulated, and the silica mud particles with a particle size of 4-10mm in diameter and 4-10mm in height are obtained for use;

[0030] (2) placing the above-mentioned granulated silica mud particles in a tumble dryer to dry, so that the moisture content is reduced to below 10%;

[0031] (3) Put the graphite electrode rod (1m-2m in height, 30cm-50cm in diameter) into the central position of the intermediate frequency electric furnace, then continue to fill the dried silica mud particles to about 1 / 3 of the height of the intermediate f...

Embodiment 2

[0035] The method for preparing metal silicon based on intermediate frequency smelting and recycling diamond wire cutting silicon mud described in this embodiment includes the following steps:

[0036] (1) Add CaO desiccant to diamond wire cutting silica mud according to the mass ratio of 1:200, add cornstarch and glass fiber (1:1) according to the mass ratio of 1:100, and add water according to the mass ratio of 1:100, Stir well, and then granulate the stirred silica mud mixture to obtain silica mud particles with a diameter of 4-10mm and a height of 4-10mm, and set aside;

[0037] (2) placing the above-mentioned granulated silica mud particles in a tumble dryer to dry, so that the moisture content is reduced to below 10%;

[0038] (3) Lay the dried silicon mud particles in the intermediate frequency electric furnace, first lay about 10cm thickness on the bottom of the furnace, and then put metal magnesium (the mass ratio of the metal magnesium to the silicon mud particles is...

Embodiment 3

[0042] The method for preparing metal silicon based on intermediate frequency smelting and recycling diamond wire cutting silicon mud described in this embodiment includes the following steps:

[0043] (1) Add CaO desiccant to diamond wire cutting silicon mud according to the mass ratio of 1:100, add glass fiber according to the mass ratio of 1:60, add water according to the mass ratio of 1:50, stir well, and then mix The silica mud mixture is granulated, and the silica mud particles with a particle size of 4-10mm in diameter and 4-10mm in height are obtained for use;

[0044] (2) placing the above-mentioned granulated silica mud particles in a tumble dryer to dry, so that the moisture content is reduced to below 10%;

[0045] (3) Lay the dried silicon mud particles in the intermediate frequency electric furnace, first lay about 10cm thickness on the bottom of the furnace, and then put metal magnesium (the mass ratio of the metal magnesium to the silicon mud particles is 1:15)...

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Abstract

The invention belongs to the technical field of diamond wire cutting silicon mud recovery, and in particular relates to a method for preparing metallic silicon based on intermediate frequency smelting and recovery of diamond wire cutting silicon mud. The method for preparing metal silicon based on intermediate frequency smelting and reclaiming diamond wire cutting silicon mud according to the present invention uses commercially available silicon mud as raw material, and mixes and granulates by adding appropriate proportions of CaO desiccant, binder and water, and then dries. The steps of drying and intermediate frequency electric furnace smelting realize the recovery of silicon from diamond wire cutting silicon mud, and add graphite electrode rods and / or metal magnesium and other heat-conducting media for melting during the smelting process to save energy and increase recovery. The role of efficiency greatly reduces production time and cost, improves the recovery rate of resources, and lays a solid foundation for mass production.

Description

technical field [0001] The invention belongs to the technical field of diamond wire cutting silicon mud recovery, and in particular relates to a method for preparing metallic silicon based on intermediate frequency smelting and recovery of diamond wire cutting silicon mud. Background technique [0002] Diamond wire cutting technology uses electroplating or resin bonding methods to attach diamond abrasives to the surface of steel wires, and directly acts on the diamond wires to produce grinding on the surface of silicon rods or silicon ingots to achieve the purpose of cutting. Compared with the traditional mortar cutting technology, diamond wire slicing can first reduce the amount of silicon consumed per unit of production, thereby greatly reducing the silicon cost and depreciation of silicon wafers. This is also the most important reason for diamond wire slicing to replace mortar slicing. Driving factors; secondly, due to the larger number of pieces produced in a single cut ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B33/021
CPCC01B33/021Y02P20/10
Inventor 刘亮李英刘茂功周成坤赵光星
Owner 刘亮
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