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Urushiol-modified phenolic resin, and preparation method and application thereof

A technology of phenolic resin and urushiol, which is applied in the field of adhesives to achieve the effects of good bonding performance, simple operation and lower temperature

Pending Publication Date: 2019-08-09
MINJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN105368355A discloses a boron-modified phenolic resin adhesive, which improves its toughness; Chinese patent CN104031220B discloses a synthesis method of an alkylphenolic resin, which improves its softening point and toughness; Chinese patent CN107722204A discloses a The synthesis method of viscosity-increasing alkylphenolic resin improves its bonding strength; Chinese patent CN 109438912A treats sepiolite fiber with butyl titanate ethanol mixture, and cooperates with hydroxy (meth)acrylate to strengthen the internal bond of the composite material. Combined force can effectively absorb impact energy, and enhance the mechanical strength of phenolic resin through the reasonable coordination of various raw materials; Chinese patent CN 108084380A discloses a phenolic resin that can be used for high-temperature UV-curable coatings containing vinyl ether side chains; Chinese patent CN 106133018A discloses the method for preparing phenolic resin from an alkylphenol composition; Chinese patent CN 108129622A discloses a kind of alkylation modified phenolic resin, which improves the bonding performance of phenolic adhesive; Brittle, or improve its bonding strength, but its curing temperature is still high, usually curing at 180°

Method used

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  • Urushiol-modified phenolic resin, and preparation method and application thereof
  • Urushiol-modified phenolic resin, and preparation method and application thereof
  • Urushiol-modified phenolic resin, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Embodiment 1 Preparation of Urushiol Modified Phenolic Resin Adhesive D1

[0061] Preparation of a1 urushiol modified phenolic resin

[0062] Add 48.0 grams of phenol, 74.0 grams of 37wt% formaldehyde solution and 2.5 grams of strong ammonia water in a three-necked flask equipped with a stirrer, a reflux condenser, and a thermometer, heat up to 60°C, and react for 3 hours under stirring; Add 6.0 grams of urushiol and 2.8 grams of 37wt% formaldehyde solution therein, continue to stir and react at 60° C. for 2 hours, and distill off water under reduced pressure to obtain urushiol-modified phenolic resin.

[0063] Preparation of b1 urushiol modified phenolic resin adhesive

[0064] In the there-necked flask equipped with mechanical stirrer and spherical condenser, add 50 grams of urushiol modified phenolic resin, 10 grams of tetraethyl silicate, 12 grams of 15wt% polyvinyl butyral ethanol solution and the raw material of 28 grams of absolute ethanol were mixed and stirre...

Embodiment 2

[0066] The preparation of embodiment 2 urushiol modified phenolic resin adhesive D2

[0067] Preparation of a1 urushiol modified phenolic resin

[0068] Add 39.7 grams of phenol, 61.2 grams of 37wt% formaldehyde solution and 2.5 grams of strong ammonia water in a three-necked flask equipped with a stirrer, a reflux condenser, and a thermometer, heat up to 80°C, and react for 2 hours under stirring; Add 3.6 grams of urushiol and 3.0 grams of 37wt% formaldehyde solution therein, continue to stir and react at 80° C. for 1 hour, and distill off water under reduced pressure to obtain urushiol-modified phenolic resin.

[0069] Preparation of b1 urushiol modified phenolic resin adhesive

[0070] In the there-necked flask equipped with mechanical stirrer and spherical condenser, add 70 grams of urushiol modified phenolic resin, 5 grams of tetraethyl silicate, 5 grams of 15wt% polyvinyl butyral ethanol solution and 20 grams of absolute ethanol were mixed and stirred evenly to obtain ...

Embodiment 3

[0072] Example 3 Preparation of urushiol-modified phenolic resin adhesive D3

[0073] Preparation of a1 urushiol modified phenolic resin

[0074] Add 41.6 grams of phenol, 65.8 grams of 37wt% formaldehyde solution and 2.8 grams of strong ammonia water in a three-necked flask equipped with a stirrer, a reflux condenser, and a thermometer, heat up to 90° C., and react for 1 hour under stirring; Add 12.4 grams of urushiol and 5.2 grams of 37wt% formaldehyde solution therein, continue to stir and react at 90° C. for 0.3 hours, and distill off water under reduced pressure to obtain urushiol-modified phenolic resin.

[0075] Preparation of b1 urushiol modified phenolic resin adhesive

[0076] In the there-necked flask equipped with mechanical stirrer and spherical condenser, add 20 grams of urushiol modified phenolic resin, 15 grams of tetraethyl silicate, 15 grams of 15wt% polyvinyl butyral ethanol solution and the raw material of 50 grams of dehydrated alcohol, mix and stir even...

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Abstract

The present invention discloses a urushiol-modified phenolic resin. The urushiol-modified phenolic resin is prepared from a material containing phenol, formaldehyde and urushiol under an alkaline condition. The urushiol-modified phenolic resin effectively reduces the curing temperature of phenolic resin and improves the toughness of the phenolic resin adhesive. The urushiol-modified phenolic resinhas a good bonding performance applied to metal bonding; and a preparation method of the urushiol-modified phenolic resin has the advantages of simplicity in operation, and wide sources of the raw materials.

Description

technical field [0001] The application relates to an urushiol-modified phenolic resin and its preparation method and application, belonging to the technical field of adhesives. Background technique [0002] Phenolic resin is a general term for resins formed by phenols and aldehydes under the action of catalysts. Phenolic resin is one of the main types of glue widely used in the field of wood processing and metal bonding. Especially in the production of water-resistant and weather-resistant wood products, phenolic resin has special significance. Phenolic resin adhesive has the characteristics of good heat resistance, high bonding strength, good aging resistance, excellent electrical insulation, cheap and easy to use; but it has high rigidity, certain brittleness, easy cracking, and long curing time , The defect of high curing temperature has a certain negative effect on its use. Chinese patent CN105368355A discloses a boron-modified phenolic resin adhesive, which improves ...

Claims

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Application Information

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IPC IPC(8): C08G8/24C09J161/06C09J129/14C09J11/06
CPCC08G8/24C09J161/06C09J11/06C08L29/14C08K5/5415
Inventor 夏建荣林棋张于弛薛涵与周礼安
Owner MINJIANG UNIV
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