Diamond grinding disc and preparation method thereof
A diamond and diamond cutter head technology, which is applied in the field of diamond grinding discs and its preparation, can solve the problems of low construction efficiency, increased consumption of abrasive tools, repair and rework, etc., and achieve stability and grinding accuracy, good sharpness, and good stability Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0025] In the present invention, the diamond cutter head is formed by cold pressing and hot pressing of mixed powder composed of a metal bond containing tungsten carbide, diamond particles, graphite particles and metal halide additives. As an example, the preparation method may include the following steps: (1) preparing a metal bond containing tungsten carbide, diamond particles, graphite particles, and metal halide additives, and mixing them to obtain a mixed powder; (2) placing the mixed powder in The tool bit blank is obtained by cold pressing in the mold; (3) Hot pressing and sintering the tool bit blank at a temperature of 780-850°C and a pressure of 200-300 kg / cm 2 And hot press sintering is carried out in an oxygen-poor atmosphere. The oxygen-poor atmosphere refers to an atmosphere containing 1-20% air and the balance nitrogen. Hot press sintering is carried out in an oxygen-poor atmosphere. On the one hand, some graphite particles can be oxidized to form pores, which ca...
Example Embodiment
[0039] Example 1
[0040] Take 3.2kg of copper powder, 3.2kg of iron, 0.8kg of nickel, 2kg of tungsten carbide, and 0.8kg of tin into the mixing barrel and mix for 30 minutes, then add 0.08kg of graphite particles and CoCl 2 0.02kg, diamond 0.15kg, continue to mix for 2 hours, pour the powder into the mold for cold pressing, hot pressing sintering, hot pressing sintering temperature is 850℃, pressure 220kg / cm 2 , The holding time is 5 minutes, the sintering atmosphere includes 10v% air, the balance is N 2 . Grind the cutter head with the abrasive belt, put the cutter head and the silver solder plate on the corresponding base position according to the requirements of the drawing, adjust the welding position and heat the silver solder plate to weld the cutter head and the substrate together, and then use 600N / mm 2 The strength standard tests the welding strength of each diamond cutter head. After welding, the dry diamond grinding wheel is sandblasted to remove the oxide scale on the ...
Example Embodiment
[0041] Example 2
[0042] Take 2.5kg of copper powder, 4.1kg of iron, 1.5kg of nickel, 1.5kg of tungsten carbide, and 0.4kg of tin into the mixing barrel and mix for 30 minutes, then add 0.08kg of graphite particles and LaF 3 0.03kg, diamond 0.15kg, continue mixing for 2 hours, pour the powder into the mold for cold pressing, hot pressing sintering, hot pressing sintering temperature is 850℃, pressure 220kg / cm 2 , The holding time is 5 minutes, the sintering atmosphere includes 20v% air, the balance is N 2 . Grind the cutter head with the abrasive belt, put the cutter head and the silver solder plate on the corresponding base position according to the requirements of the drawing, adjust the welding position and heat the silver solder plate to weld the cutter head and the substrate together, and then use 600N / mm 2 The strength standard tests the welding strength of each diamond cutter head. After welding, the dry diamond grinding wheel is sandblasted to remove the oxide scale on the...
PUM
Property | Measurement | Unit |
---|---|---|
Particle size | aaaaa | aaaaa |
Particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap