Die bond solder paste for LED packaging and preparing method of die bond solder paste

A technology of LED packaging and solid crystal, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of chip and board surface wear and hardness, and achieve excellent performance, low cost, and good storage performance.

Active Publication Date: 2019-09-06
江苏博蓝锡威金属科技有限公司
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High thermal conductivity is obtained by using high thermal conductivity particles to improve the heat dissipation capacity of LED chips. However, high thermal conductivity particles are inorganic substances with high hardness, which may cause wear on chips and board surfaces.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Die bond solder paste for LED packaging and preparing method of die bond solder paste
  • Die bond solder paste for LED packaging and preparing method of die bond solder paste
  • Die bond solder paste for LED packaging and preparing method of die bond solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The solid crystal solder paste is composed of Sn96.5Ag3Cu0.5 alloy powder and flux with a mass ratio of 85:15;

[0038] The flux includes the following components in mass percentage: lactic acid-glycolic acid copolymer 10%, sodium bicarbonate 3%, phosphoric acid monoester 4%, water-soluble silicone oil 4%, polyaniline 2%, hydrogenated rosin resin 20%, moisturizing Wetting agent 6%, amide modified hydrogenated castor oil 6% and solvent 45%.

[0039] Wetting agent is composed of isononyl isononanoate and low molecular weight hydrogenated polyisobutylene in a mass ratio of 9:4;

[0040] The solvent is composed of methyl pentynol, N,N-dimethylacetamide, and glycol phenyl ether in a mass ratio of 2:1.5:4.

[0041] The preparation steps of solid crystal solder paste:

[0042] S1: Mix hydrogenated rosin resin, lactic acid-glycolic acid copolymer, phosphoric acid monoester, polyaniline, and solvent, stir evenly, and heat until the materials are completely melted to obtain mixed liquid I...

Embodiment 2

[0047] The solid crystal solder paste is composed of Sn82.5Bi17Cu0.5 alloy powder and flux with a mass ratio of 90:10;

[0048] The flux includes the following components in mass percentage: lactic acid-glycolic acid copolymer 15%, sodium bicarbonate 3%, phosphoric acid monoester 3%, water-soluble silicone oil 5%, polyaniline 3%, disproportionated rosin resin 10%, moisturizing Wetting agent 5%, amide modified hydrogenated castor oil 6% and solvent 50%.

[0049] Wetting agent is composed of isononyl isononanoate and low molecular weight hydrogenated polyisobutylene in a mass ratio of 7:2;

[0050] The solvent is composed of methyl pentynol, N,N-dimethylacetamide, and ethylene glycol phenyl ether in a mass ratio of 4:3:6.

[0051] The preparation steps of solid crystal solder paste:

[0052] S1: Mix the disproportionated rosin resin, lactic acid-glycolic acid copolymer, phosphoric acid monoester, polyaniline, and solvent, stir evenly, and heat until the materials are completely melted to...

Embodiment 3

[0057] The solid crystal solder paste is composed of Sn80.3Ag3Cu1Bi15Sb0.7 alloy powder and flux with a mass ratio of 85:15;

[0058] The flux includes the following components in mass percentage: lactic acid-glycolic acid copolymer 10%, sodium bicarbonate 2%, phosphate monoester 6%, water-soluble silicone oil 3%, polyaniline 1%, polymerized rosin 15%, wetting Agent 8%, hydrogenated castor oil 5% and solvent 50%.

[0059] Wetting agent is composed of isononyl isononanoate and low molecular weight hydrogenated polyisobutylene in a mass ratio of 10:5;

[0060] The solvent is composed of methyl pentynol, N,N-dimethylacetamide, and glycol phenyl ether in a mass ratio of 3:2:5.

[0061] Refer to Example 1 for the preparation steps of solid crystal solder paste.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses die bond solder paste for LED packaging and a preparing method of the die bond solder paste. The die bond solder paste is composed of tin-based alloy powder and scaling powderwith the mass ratio of (85-90): (10-15), and the tin-based alloy powder is one of a Sn96.5Ag3Cu0.5 alloy, a Sn82.5Bi17Cu0.5 alloy, a Sn80.3Ag3Cu1Bi15Sb0.7 alloy and a Sn96.5Ag3.5 alloy. The scaling powder comprises following components including lactic acid-glycollic acid copolymer, sodium bicarbonate, phosphomonoester, water soluble silicone oil, polyaniline, resin, a wetting agent, a thixotropicagent and a solvent. The die bond solder paste has good printing performance, excellent weldability, low postwelding residues and corrosion resistance, high heat conductivity and good storage performance, and the LED packaging reliability is obviously improved.

Description

Technical field [0001] The invention relates to the technical field of LED packaging, in particular to a solid crystal solder paste for LED packaging and a preparation method thereof. Background technique [0002] In the packaging of power LED devices, the chip bonding material plays a very important role in the heat transfer process from the chip to the heat sink. However, the current chip bonding material has become a bottleneck in the heat dissipation channel of high-power LEDs, so low thermal resistance, Chip bonding materials with good heat dissipation are the key to packaging technology. [0003] LED chip packaging generally can be packaged in four ways: thermally conductive adhesive, conductive silver paste, solder paste, and tin-gold alloy eutectic welding. Among them, the thermal conductivity of thermally conductive adhesive and conductive silver paste is poor and cannot meet LED chip packaging. Although the thermal conductivity of tin-gold alloy is good, it contains prec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/363B23K35/40H01L33/56
CPCB23K35/26B23K35/262B23K35/36B23K35/3612B23K35/40H01L33/56
Inventor 何雪连
Owner 江苏博蓝锡威金属科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap