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Preparation method for electronic glass substrate with low thermal shrinkage

A technology of electronic substrate and shrinkage rate, which is applied in the field of preparation of electronic substrate glass with low thermal shrinkage rate, to meet the requirements of high-resolution display, reduce thermal deformation, and reduce thermal shrinkage

Active Publication Date: 2019-10-22
CHINA LUOYANG FLOAT GLASS GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of high-resolution display (≥400PPI), the pixel pitch is not greater than 60μm, and the panel size is gradually developing to G8.5 (2200mm×2500mm). The development of 10ppm will significantly reduce the display quality defects, etc. Therefore, it is particularly important to provide a method for preparing electronic substrate glass with low thermal shrinkage

Method used

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  • Preparation method for electronic glass substrate with low thermal shrinkage
  • Preparation method for electronic glass substrate with low thermal shrinkage
  • Preparation method for electronic glass substrate with low thermal shrinkage

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preparation example Construction

[0024] A method for preparing an electronic substrate glass with a low thermal shrinkage rate according to the present invention, the method specifically includes the following steps:

[0025] The first step is to make silicon dioxide, aluminum oxide, boron oxide, magnesium oxide, calcium oxide, strontium oxide, barium oxide, zirconium dioxide, zinc oxide, cerium oxide and tin oxide into glass according to a predetermined ratio. Batch materials, glass batch materials are melted at high temperature to form alkali-free boroaluminosilicate glass liquid, and then formed by float process. In the stretching zone with float forming tin bath, alkali-free boroaluminosilicate glass is continuously Feed to the surface of the molten metal tin liquid, and when the viscosity of the molten glass reaches 10 5 At Pa·s, it reaches the intermediate state of glass plasticity, and it is thinned by the pulling force of the edge pulling machine in the stretching direction to form a glass ribbon with...

specific Embodiment

[0056] First, the heat shrinkage test method is as follows:

[0057] Heat up at a heating rate of 5°C / min, and the temperature rises to 550°C. After keeping at this temperature for 5 minutes, cool down to room temperature at a cooling rate of 2°C / min. The lowest temperature record after exporting the data is 62.05°C. Choose this temperature The following six absolute shrinkage data, take the average value, according to the heat shrinkage formula: absolute expansion / length before heat treatment * 10 6 , the unit is ppm.

specific Embodiment 1

[0059] SiO 2 : 52.5%, Al 2 o 3 : 25.1%, B 2 o 3 : 3.8%, MgO: 8.11%, CaO: 2.3%, BaO: 2.6%, SrO: 1.1%, ZrO 2 : 1.2%, ZnO: 3.1%, CeO 2 : 0.07%, SnO 2 : 0.12%, the balance is impurities brought by mineral raw materials.

[0060] The above components are used to make glass batch materials, which are melted at a temperature of 1650-1660°C for three hours, and the working temperature is below 1320°C-1380°C. 8 Pa·s start, glass viscosity 10 8 Pa·s-10 11 Within this range of Pa·s, the temperature difference of the qualified plate area along the width direction of the glass plate, that is, the qualified plate area perpendicular to the drawing direction, shall not exceed 2°C, and the cooling rate shall be controlled at 10-15°C / min; Viscosity at 10 11 Pa·s-10 12 In the Pa·s process, the cooling rate in the corresponding temperature range is 15-20°C / min, and the glass viscosity reaches 10 12 At the time of Pa·s, heat preservation T=L / V (L is the width of the zone, V is the pull...

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Abstract

The invention provides a preparation method for an electronic glass substrate with low thermal shrinkage, belonging to the field of glass production. According to the invention, a molding and annealing process is controlled, the composition of the glass substrate is optimized, and the annealing treatment of the glass substrate is controlled by the reasonable molding and annealing process, so the stabilization and compactness of a glass structure and inhibition of contraction are realized, the purpose of reducing the thermal contraction of the glass substrate is achieved, and the heat shrinkagerate of glass is smaller than the shrinkage rate of conventional electronic glass and is no more than 10 ppm; the electronic glass substrate has low shrinkage rate, small deformation rate and improved thermal stability; glass with high thermal stability can be obtained and meets the requirement for high resolution displaying, etc.; and the method is suitable for large-scale promotion and application.

Description

technical field [0001] The invention relates to the field of glass production, in particular to a method for preparing electronic substrate glass with low thermal shrinkage rate. Background technique [0002] As known, TFT-LCD is widely used in small terminal display devices such as mobile phones, watches, cameras, navigators, LCD TVs, computer monitors, and large-size multimedia due to its advantages of light weight, high definition, low energy consumption, and good environmental performance. Monitors and other large equipment and various digital multimedia products. [0003] With the continuous development of display devices, people are increasingly pursuing high-resolution and high-quality images, and have higher requirements for the size and response time of thin-film transistor (TFT) display screens. Low-temperature polysilicon (LTPS) technology has relatively high High electron mobility (1,000 times higher than amorphous silicon technology), and allows the manufacture...

Claims

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Application Information

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IPC IPC(8): C03C3/095C03B25/00C03B18/06C03B18/18
CPCC03C3/095C03B25/00C03B18/06C03B18/18
Inventor 谢军李红霞司敏杰田芳郭卫朱云峰王自强郎明路延彬
Owner CHINA LUOYANG FLOAT GLASS GROUP
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