Fenton-assisted composite rod micro-ultrasonic spheres to prepare hemispherical concave mold array

Abstract

The invention discloses a method for preparing a hemispherical concave die array by using Fenton-assisted composite rod micro-ultrasonic spheres. A variable-amplitude rod, a micro-ultrasonic generatorand a tool head are involved in the method, wherein the upper end of the variable-amplitude rod is connected with the micro-ultrasonic generator, the lower end of the variable-amplitude rod is connected with the replaceable tool head. The method comprises the following steps that multiple layers of coatings or a layer of coating coats the bottom of the tool head, if the coating material is diamond, the coating on the bottom of the tool head is ground by using a diamond grinding wheel, the surface of the coating is ground into a plane, then polishing is carried out on the surface of the coating by adopting a chemical mechanical polishing method, then a micro-hemispherical concave die array is machined within the thickness range of the coating at the bottom of the tool head, the depth of each concave die is smaller than the thickness of the coating, and the diameter of each hemispherical concave die is larger than or equal to the diameter of each sphere used for ultrasonic emission. According to the method, the machining efficiency of the hemispherical concave die array is greatly improved, the consistency of the circumferential radius of each concave die and the consistency of thegeometrical shapes among different concave dies are ensured, and the machined concave dies can be polished by adopting a flexible body chemical reagent so as to realize the nanoscale surface roughness.

Description

technical field [0001] The invention relates to the field of ultra-precision machining, in particular to a method for preparing a hemispherical concave mold array from a Fenton-assisted composite rod micro-ultrasonic sphere. Background technique [0002] Hemispherical resonant gyroscope is a kind of Gothic vibrating gyroscope, which has many advantages such as high precision and long life, and is widely used in high-precision fields such as national defense and aerospace. However, macro-scale hemispherical resonant gyroscopes are large in size, high in mass, high in energy consumption, highly dependent on ultra-precision processing technology, and high in manufacturing costs. Micro hemispherical gyroscope. [0003] Compared with ordinary mechanical gyroscopes and macro-scale hemispherical resonant gyroscopes, micro-hemispherical MEMS gyroscopes are small in size, light in weight, and low in energy consumption, but their accuracy is currently not up to the inertial navigatio...

AI Technical Summary

Problems solved by technology

[0006] But so far, there is no processing method and device that can meet the processing accuracy and processing efficiency requirements of the silicon carbide hard and brittle micro-semi-ring die. The main difficulty lies in the high hardness and high brittleness of the raw material of silicon carbide wafers, and the high processing cost. It is difficult to control the precision and has a great wear effect on the processing device

[0007] In addition, although micro-EDM processing, micro-milling processing, micro-ultrasonic layered processing and other processing methods are new 3D structure processing methods, they still cannot get rid of the problems of low processing efficiency, low yield, high cost or being restricted by silicon carbide materials. Difficult to process due to chemical properties

[0008] In summary, there is currently no feasible method and device for processing high-quality MEMS gyroscope micro-semi-ring dies, and there has been no report on the development of a MEMS hemispherical resonant gyroscope with inertial-level precision.

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