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Low-temperature curable packaging adhesive film

A technology for encapsulating adhesive films and films, applied in the direction of adhesives, film/sheet adhesives, adhesive types, etc., which can solve the problems of module power attenuation, long packaging time, slow curing speed, etc., and achieve curing speed. Fast, low decay, the effect of improving curing speed

Inactive Publication Date: 2019-12-03
CHANGZHOU SVECK PHOTOVOLTAIC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing speed of the existing EVA adhesive film is slow, resulting in a longer packaging time, and the existing EVA adhesive film has poor heat and humidity resistance, which will accelerate the power attenuation of the module after long-term use

Method used

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  • Low-temperature curable packaging adhesive film

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Experimental program
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Effect test

preparation example Construction

[0022] The preparation method of the fast-curing encapsulating adhesive film in the present invention adopts a conventional preparation method.

[0023] The present invention will be further described in conjunction with specific embodiment now.

Embodiment 1

[0025] A fast-curing encapsulating adhesive film, the mass parts of which are composed as follows: 100 parts of modified ethylene-vinyl acetate-based copolymer, 0.8 part of boron trifluoride ethylamine, 0.3 part of silicon carbide, 0.1 part of film toughening agent, anti- 0.4 part of oxidizing agent, 0.1 part of co-crosslinking agent.

[0026] Among them, the modified ethylene-vinyl acetate-based copolymer is a multi-component blended modified copolymer, and the multi-component blended modified copolymer is a blend of ethylene-vinyl acetate-based copolymer and polyethylene, and its mass ratio is 1:1 .

[0027] Wherein, the modified ethylene-vinyl acetate-based copolymer is a mixture of ethylene-vinyl acetate-based copolymer, SIS elastomer, and thermoplastic polyurethane, and its mass ratio is 1:0.2:1.

[0028] Among them, the average particle size of silicon carbide is 200-300 mesh.

[0029] Among them, the film toughening agent is selected from liquid polysulfide rubber.

...

Embodiment 2

[0033] A fast-curing encapsulation adhesive film, the mass parts of which are composed as follows: 100 parts of modified ethylene-vinyl acetate-based copolymer, 0.9 part of boron trifluoride ethylamine, 0.4 part of silicon carbide, 0.15 part of film toughening agent, anti- 0.5 part of oxidizing agent, 0.2 part of co-crosslinking agent.

[0034] Wherein, the modified ethylene-vinyl acetate-based copolymer is a mixture of ethylene-vinyl acetate-based copolymer, SIS elastomer, and thermoplastic polyurethane, and its mass ratio is 1:0.2:1.

[0035] Among them, the average particle size of silicon carbide is 200-300 mesh.

[0036] Among them, liquid acrylate rubber is selected as the film toughening agent.

[0037] Among them, the antioxidant includes a primary antioxidant and an auxiliary antioxidant, the mass ratio of the primary antioxidant to the auxiliary antioxidant is 1:0.4, the primary antioxidant is selected from butyl hydroxyanisole, and the auxiliary antioxidant is sele...

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Abstract

The invention relates to the technical field of photovoltaic adhesive films, and particularly relates to a rapid curing packaging adhesive film. The rapid curing packaging adhesive film comprises thefollowing components in parts by mass: 100 parts of a modified ethylene-vinyl acetate based copolymer, 0.8-1.2 parts of boron trifluoride ethylamine, 0.3-0.8 part of silicon carbide, 0.1-0.3 part of an adhesive film toughening agent, 0.4-0.8 part of an antioxidant and 0.1-0.4 part of an assistant crosslinker. According to the invention, the boron trifluoride ethylamine is adopted as a curing agent, so that when the temperature is 120 DEG C or above, fast curing can be realized, heat is released at the same time, the electrical property is good, and the curing speed of the packaging adhesive film can be obviously improved. Meanwhile, the boron trifluoride ethylamine can generate more ether bonds when being cured with epoxy resin, so that toughness and adhesive force of the product are improved. The curing speed is high, and the whole packaging time of a component can be controlled within 11 minutes. Moreover, the packaging adhesive film has excellent yellowing resistance and better optical performance, and the yellowing degree is far lower than the yellowing degree of other products at home and abroad in a high-temperature high-humidity environment. In a long-term aging test, extremely low attenuation of light transmittance can be ensured.

Description

technical field [0001] The invention relates to the technical field of photovoltaic adhesive films, in particular to a fast-curing packaging adhesive film. Background technique [0002] EVA film has good flexibility, impact strength, environmental stress cracking resistance and good optical properties in a wide temperature range, low temperature resistance and non-toxic characteristics. It is not sticky at room temperature, and when heated to a certain temperature in a molten state, the crosslinking agent in it decomposes to generate free radicals, triggering the bonding between EVA molecules, making it bond and solidify with crystalline silicon cells, glass, and TPT backplanes , The three-layer material becomes one and the cured component will no longer flow in the sun, the battery will no longer move, and basically no thermal expansion and contraction will occur. However, the curing speed of the existing EVA adhesive film is slow, resulting in a long packaging time, and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J123/06C09J175/04C09J11/04C09J11/08C09J11/06C09J7/30
CPCC09J123/0853C09J123/06C09J175/04C09J11/04C09J11/08C09J11/06C09J7/30C08L2205/035C08L2312/00C09J2423/04C09J2475/00C08L23/06C08L81/04C08K3/34C08K5/13C08K5/55C08L23/0853
Inventor 吕松
Owner CHANGZHOU SVECK PHOTOVOLTAIC NEW MATERIAL