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Preparation and deformation method of high-strength and high-conductivity copper-selenium multi-component alloy material

A multi-element alloy and alloy rod technology, applied in the direction of conductive materials, conductive materials, metal/alloy conductors, etc., can solve the problems of low softening temperature, limited tellurium resources, research and development and application restrictions, etc., to improve the hardness and strength of alloys, Effect of improving structure and cutting performance, excellent cutting performance

Inactive Publication Date: 2019-12-03
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Industrial pure copper has good electrical and thermal conductivity, and good plasticity. Therefore, industrial pure copper is widely used in electrical and thermal equipment. However, with the rapid development of industrial technology, industrial pure copper has low strength and low softening temperature. Such shortcomings limit its application, which requires the development of new high-strength and high-conductivity copper alloys. The copper alloys currently developed mainly include copper-zirconium, copper-chromium, copper-cadmium, copper-silver, and copper-magnesium alloys. , great impact on the environment, poor electrical conductivity and many other reasons, these alloys have not been used in a wide range
[0003] The addition of tellurium endows pure copper with special properties such as arc resistance and electric corrosion resistance. The application number is 02113262.3, and the name is "a tellurium-copper alloy material with high strength, high conductivity, and high arc extinguishing". The application number is 02133772.1, and the name is "Copper alloy materials for catenary wires" shows that the addition of the third component - magnesium, improves the strength of copper-tellurium alloys, but the conductivity is low, the highest is only 76% IACS, "Handbook of Commonly Used Metal Materials at Home and Abroad "(Compiled by Xi'an Standardization Information Research Institute) discloses free-cutting copper-tellurium-phosphorus alloys with grades C14500 and C14510, but their strength is only 260 MPa, and they do not have the comprehensive properties of high strength and high conductivity, arc resistance and easy cutting. index
At the same time, due to the use of high-purity tellurium as raw materials for these alloys, the resources of tellurium are limited, resulting in limited research and development and application. Therefore, it is urgent to develop and develop new high-conductivity and heat-conducting materials.

Method used

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  • Preparation and deformation method of high-strength and high-conductivity copper-selenium multi-component alloy material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 1. Ingredients

[0020] According to 0.6 w% of selenium, 0.05 w% of phosphorus, and the balance of copper, the selenium is added as a copper-selenium master alloy;

[0021] 2. Melting and pouring

[0022] First put industrial pure copper in the vacuum induction furnace, vacuumize, argon protection, heat to 1140--1150 ℃, so that the pure copper is melted, then add copper-selenium master alloy and phosphorus to continue smelting, the temperature is controlled at 1180- -1200 ℃, so that the alloying elements are evenly distributed in the molten copper. After complete melting, keep it warm for 10-15 minutes. After the melting is completed, pour it and quickly cool it into a billet.

[0023] 3. Deformation process

[0024] After the billet was hot-extruded into a copper rod with a diameter of φ10 mm, it was extruded by the Equal Channel Radial Extrusion Process (ECAP). The deformation was performed twice, and the direction of the sample was rotated by 90° between adjacent p...

Embodiment 2

[0027] 1. Ingredients

[0028] 0.5 w% of selenium, 0.02 w% of lithium, and copper balance are used for ingredients, wherein selenium and lithium are respectively added as copper-selenium master alloy and copper-lithium master alloy;

[0029] 2. Melting and pouring

[0030] First, put industrial pure copper in the vacuum induction furnace, vacuumize, protect with argon, and heat to 1140--1150 ℃ to melt the pure copper, then add copper-selenium master alloy and copper-lithium master alloy respectively, and continue smelting. Control the temperature at 1180--1200°C, so that the alloying elements are evenly distributed in the molten copper, and keep it warm for 10--15 minutes after complete melting. After the melting is completed, pour it and quickly cool it into a billet.

[0031] 3. Deformation process

[0032] After the billet was hot-extruded into a copper rod with a diameter of φ10 mm, it was extruded by the Equal Channel Radial Extrusion Process (ECAP), with 4 deformation ...

Embodiment 3

[0035] 1. Ingredients

[0036] According to 0.25 w% of selenium, 0.25 w% of tellurium, 0.02 w% of lithium, and copper balance ingredients, wherein selenium, tellurium, and lithium are respectively added as copper-selenium master alloy, copper-tellurium master alloy, and copper-lithium master alloy;

[0037] 2. Melting and pouring

[0038] First, put industrial pure copper in the vacuum induction furnace, vacuumize, argon protection, heat to 1140--1150 ℃, so that the pure copper is melted, and then add copper-selenium master alloy, copper-tellurium master alloy, copper-lithium master alloy respectively , continue smelting, the temperature is controlled at 1180--1200 ℃, so that the alloying elements are evenly distributed in the molten copper, and after complete melting, keep warm for 10--15 minutes. After the smelting is completed, pour it and quickly cool it into a billet.

[0039] 3. Deformation process

[0040] After the billet was hot-extruded into a copper rod with a dia...

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Abstract

The invention discloses a preparation and deformation method of a high-strength and high-conductivity copper-selenium multi-component alloy material, and belongs to the field of novel alloy material processing. The alloy comprises the following components: 0.15-0.6% of selenium, 0-0.25% of tellurium, 0.02-0.1% of a trace additive element and the balance of copper, wherein the trace additive element is one or two kinds of lithium, phosphorous and rare earth; by adopting a vacuum induction furnace, the method comprises the following steps: carrying out burdening, vacuumizing, argon protection, alloy smelting, pouring and quick cooling to obtain a casting blank, and adding selenium, tellurium, lithium and rare earth as intermediate alloys; carrying out hot extrusion on the casting blank to form a copper rod with the diameter phi of 10mm; adopting an equal-channel radial extrusion process (ECAP) for extrusion molding, wherein the deformation passes are 2-8, the sample direction between theadjacent passes is rotated by 90 degrees, the high-strength and high-conductivity alloy bar is obtained, the conductivity can reach 88-95% IACS, the Vickers hardness can reach 150-171 HV, and according to the national standard GB3771-83, the hardness and strength of the copper alloy are converted into 506-583 MPa.

Description

technical field [0001] The invention belongs to the field of processing novel copper alloy materials, and in particular relates to a preparation and deformation method of a high-strength and high-conductivity copper-selenium multi-element alloy material. Background technique [0002] Industrial pure copper has good electrical and thermal conductivity, and good plasticity. Therefore, industrial pure copper is widely used in electrical and thermal equipment. However, with the rapid development of industrial technology, industrial pure copper has low strength and low softening temperature. Such shortcomings limit its application, which requires the development of new high-strength and high-conductivity copper alloys. The copper alloys currently developed mainly include copper-zirconium, copper-chromium, copper-cadmium, copper-silver, and copper-magnesium alloys. , impact on the environment, electrical conductivity can not meet the requirements and many other reasons, so that th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/03C22C1/10B21C23/02H01B1/02
CPCC22C9/00C22C1/1036B21C23/002B21C23/02H01B1/026C22C1/1047
Inventor 朱达川廖鑫焦林
Owner SICHUAN UNIV