A kind of preparation method and battery of full back contact IBC battery based on laser diffusion
A technology of full back contact and laser diffusion, applied in the field of solar cells, can solve the problems of complex preparation process of IBC cells, unsuitable for low-cost mass production, and high cost.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0037] Such as figure 1 As shown, this embodiment provides a method for preparing a full back contact IBC battery based on laser diffusion, comprising the following steps:
[0038] S1: Alkali texturing: select an N-type monocrystalline silicon wafer, and use hot alkali to make texturing on both sides, so that the front and back of the N-type monocrystalline silicon wafer form a textured layer;
[0039] S2: P diffusion: double-sided or single-sided P diffusion of N-type single crystal silicon wafers with phosphorus source to form FSF on the front side of N-type single crystal silicon wafers;
[0040] S3: Edge isolation: Use a mixed solution of HF and HN03 to remove the back and edge junctions of the N-type single crystal silicon wafer, and only keep the front diffusion layer and the PSG layer above the diffusion layer as the next step of single-side polishing mask;
[0041] S4: Single-side polishing: polishing the back of the N-type monocrystalline silicon wafer with NaOH wit...
Embodiment 2
[0058] Such as figure 1 As shown, this embodiment provides a method for preparing a full back contact IBC battery based on laser diffusion, comprising the following steps:
[0059] S1: Alkali texturing: select an N-type monocrystalline silicon wafer, and use hot alkali to make texturing on both sides, so that the front and back of the N-type monocrystalline silicon wafer form a textured layer;
[0060] S2: P diffusion: double-sided or single-sided P diffusion of N-type single crystal silicon wafers with phosphorus source to form FSF on the front side of N-type single crystal silicon wafers;
[0061] S3: Edge isolation: Use a mixed solution of HF and HN03 to remove the back and edge junctions of the N-type single crystal silicon wafer, and only keep the front diffusion layer and the PSG layer above the diffusion layer as the next step of single-side polishing mask;
[0062] S4: Single-side polishing: polishing the back of the N-type monocrystalline silicon wafer with NaOH wit...
Embodiment 3
[0079] Such as figure 1 As shown, this embodiment provides a method for preparing a full back contact IBC battery based on laser diffusion, comprising the following steps:
[0080] S1: Alkali texturing: select an N-type monocrystalline silicon wafer, and use hot alkali to make texturing on both sides, so that the front and back of the N-type monocrystalline silicon wafer form a textured layer;
[0081] S2: P diffusion: double-sided or single-sided P diffusion of N-type single crystal silicon wafers with phosphorus source to form FSF on the front side of N-type single crystal silicon wafers;
[0082] S3: Edge isolation: Use a mixed solution of HF and HN03 to remove the back and edge junctions of the N-type single crystal silicon wafer, and only keep the front diffusion layer and the PSG layer above the diffusion layer as the next step of single-side polishing mask;
[0083] S4: Single-side polishing: polishing the back of the N-type monocrystalline silicon wafer with NaOH wit...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com