Brazing method of high-volume-fraction silicon carbide particle reinforced aluminum matrix composite material and aluminum-silicon alloy

Abstract

The invention discloses a brazing method of a high-volume-fraction silicon carbide particle reinforced aluminum matrix composite material and an aluminum-silicon alloy. The brazing method includes thefollowing steps that S1, the to-be-welded surfaces of the silicon carbide particle reinforced aluminum matrix composite material and the aluminum-silicon alloy are subjected to surface clearing; S2,ceramic powder is prearranged on the to-be-welded surface of the aluminum-silicon alloy after treatment in the S1; S3, a brazing filler metal is placed between the to-be-welded surfaces of the aluminum-silicon alloy and the silicon carbide particle reinforced aluminum matrix composite material to form a to-be-welded part; and S4, under the protective atmosphere, the to-be-welded part is heated up,kept warm and pressurized to 5-20 MPa, and continuous heat preservation and pressure maintaining are conducted, and then the to-be-welded part is furnace-cooled to the room temperature. According tothe brazing method, oxide films on the surfaces of the silicon carbide particle reinforced aluminum matrix composite material and the aluminum-silicon alloy are broken by using the hard ceramic powderto assist the metal brazing filler metal, the brazing filler metal is fully wetted and spreads on the surfaces of the silicon carbide particle reinforced aluminum matrix composite material and the aluminum-silicon alloy, and metallurgical bonding of the connection surface of the silicon carbide particle reinforced aluminum matrix composite material and the aluminum-silicon alloy is induced.

Description

technical field [0001] The invention relates to the technical field of connection methods for aluminum-based composite materials, in particular to a brazing method for high-volume silicon carbide particle-reinforced aluminum-based composite materials and aluminum-silicon alloys. Background technique [0002] With the development of microelectronic devices and semiconductor integrated circuits in the direction of high reliability, high integration, high density and light weight, the number of microelectronic components is increasing, the degree of integration is getting higher and higher, and the heat generation density is higher. Thermal requirements for component enclosures are becoming increasingly stringent. Traditional electronic packaging housing materials such as Kovar, W / Cu, and Mo / Cu alloys cannot meet the performance requirements due to their large specificities and low thermal conductivity. High volume fraction (vol.%, 40% to 80%) silicon carbide particles reinforc...

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Problems solved by technology

[0005] The invention provides a brazing method of high volume fraction silicon carbide particle reinforced aluminum matrix composite material and aluminum silicon alloy to solve the problems caused by the brazing of aluminum silicon alloy and high volume fraction silicon carbide particle reinforced aluminum matrix composite material. The restriction of the surface oxide film leads to poor performance of solder joints and technical problems that cannot meet the requirements of electronic packaging shells

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