Texturing additive for diamond wire polycrystalline silicon wafers and texturing etching solution for diamond wire polycrystalline silicon wafers
A polycrystalline silicon wafer and diamond wire technology, applied in the field of diamond wire polycrystalline silicon wafer texturing etching solution, can solve the problems of inability to large-scale promotion, limited promotion of corrosion effect, increased process cost, etc., so as to improve solar conversion efficiency and reduce The effect of reflectivity and cost reduction per kilowatt-hour
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Embodiment 1
[0014] Adopt the technical scheme provided by the present invention to carry out the step of making texture to diamond wire polysilicon wafer as follows:
[0015] S1: Preparation of diamond wire polysilicon wafer texturing additives: Take a small amount of pure water with a resistivity of 18MΩ, and while stirring, add Jimmy’s quaternary ammonium salt cationic surfactant for pre-dissolution. At the same time, take another small amount of pure water with a resistivity of 18MΩ, and add tartaric acid and isomeric alcohol ether for pre-dissolution while stirring. Finally, the two solutions are mixed to prepare additives. The mass of the active ingredients added is calculated according to the final concentration: the concentration of Jimmy’s quaternary ammonium salt cationic surfactant is 0.5%, the tartaric acid is 5%, and the isomeric alcohol ether is 2%.
[0016] S2: Preparation of acid corrosion solution: the preparation ratio of acid corrosion solution is HF:H 2 O: HNO 3 =1:1...
Embodiment 2
[0020] S1: Preparation of additives for diamond wire polysilicon wafer texturing: Take a small amount of pure water with a resistivity of 18MΩ, and add citric acid while stirring. At the same time, another small amount of pure water with a resistivity of 18 MΩ was taken, and polyethylene glycol and quaternary ammonium salt cationic surfactant were added while stirring. In the finally obtained additive, citric acid is 3%, the concentration of quaternary ammonium cationic surfactant is 0.5%, and polyethylene glycol is 1%.
[0021] S2: Preparation of acidic corrosion solution: the preparation ratio of acidic corrosion solution is HF: H2O: HNO 3 =1:1.8:3.0. Among them, HF is commercially available electronic grade hydrofluoric acid with a concentration of 49%, and H 2 O is 18MΩ electronic grade pure water, HNO 3 It is commercially available electronic grade nitric acid with a concentration of 68%.
[0022] S3: Texturing processing: adding an appropriate amount of silicon wafer...
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