Long wafer boat and preparation process

Abstract

The invention provides a long wafer boat. The long wafer boat comprises a baffle plate and a placing column, wherein a wafer slot is arranged in the placing column. The two ends of the placing columnare connected to the baffle plate. Both the baffle plate and the placing column are made of silicon carbide. The baffle plate is connected with the placing column by mortise and tenon. The wafer slotis used for storing wafers, and the excellent characteristics of silicon carbide are used to make the wafer boat smaller in deformation, smaller in thermal change and better in thermal conductivity. Alarger load capacity can be set to improve the preparation efficiency and yield of the load wafer during high temperature preparation. The invention also provides a preparation process of the long wafer boat. The preparation process comprises the following steps: A. performing wire cutting on the crude baffle plate, and processing the baffle plate outline and the mortise by wire cutting; B. cutting the two end faces of the placing column, and performing wire cutting on the wafer slot; C. performing wire cutting on two ends of the placing column, and processing two ends of the placing column by wire cutting and / or electric spark to form the tenon; and D. assembling the baffle plate and the placing column.

Description

technical field [0001] The invention relates to the field of electronic semiconductors, in particular to a crystal growth boat and a preparation process. Background technique [0002] During the manufacturing process of semiconductor wafers, the wafers are placed on a wafer boat, and then the wafer boat is placed in a furnace tube for batch manufacturing. For wafers, the quality and quantity of wafers produced by one device in the same period greatly affect the yield rate and manufacturing cost of semiconductor wafers. The large-volume crystal boat greatly improves the efficiency of the wafer, but at the same time, it puts forward higher requirements for the material of the wafer boat. The wafer boat made of ordinary materials has a large thermal expansion coefficient, which will affect the shape of the wafer. At the same time, the increase in temperature Speed ​​and temperature maintenance are also the key factors for preparing high-quality wafers, and wafer boats made of ...

AI Technical Summary

Problems solved by technology

However, silicon carbide is brittle, and its cutting and drilling are easy to cause damage, and it cannot be processed by conventional welding. It is difficult to use silicon carbide to burn the long crystal boat as a whole.

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