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TFT substrate and its preparation method, display device

A substrate and substrate substrate technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as unevenness, side etching, and fast etching of copper film layers, so as to prevent damage and prevent side Eclipse effect

Active Publication Date: 2022-05-27
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] At present, in the preparation process of thin-film transistor array substrates, the source and drain metals mostly use copper / molybdenum Cu / Mo film layer or copper / molybdenum titanium Cu / MoTi film layer. In this structure, due to the consideration of molybdenum Mo residue or different types of cupric acid Such problems will lead to faster etching of the copper film layer, and the line width deviation (CD bias) generally exceeds 1.5um, which cannot meet the etching of the copper film layer with a thinner line width; at the same time, it is also prone to copper / molybdenum Cu / Mo side etching; The unevenness of the formed sidewall (sidewall) leads to problems such as passivation layer or gate insulation layer piercing

Method used

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  • TFT substrate and its preparation method, display device
  • TFT substrate and its preparation method, display device
  • TFT substrate and its preparation method, display device

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preparation example Construction

[0040] In addition, the present invention provides a method for preparing a TFT substrate, comprising the steps of: depositing a metal material on a base substrate; patterning the metal material to form a gate; forming a gate insulation on the base substrate layer to cover the patterned gate; an active layer is formed on the gate insulating layer and located above the gate; a first metal layer, a first metal layer, a A second metal layer and a third metal layer, wherein the first metal layer is made of metal material, the second metal layer is made of nickel or nickel alloy, and the third metal layer is made of copper material ; and patterning the first metal layer, the second metal layer, the third metal layer and the active layer by applying glue, exposing and etching to form patterned source electrodes, drain electrodes and active layers.

[0041] Further, after the step of forming the patterned source electrode, drain electrode and active layer, the method further includes...

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Abstract

The invention discloses a TFT substrate, a preparation method thereof, and a display device, which can make the line width of the copper film layer in the back channel etching-indium gallium zinc oxide type TFT substrate thinner, so that it can be applied to higher resolution At the same time, the molybdenum film layer as the bottom layer of the channel is dry-etched by NF3 and O2 etching gases to prevent the indium gallium zinc oxide film layer from being damaged.

Description

technical field [0001] The present invention relates to the technical field of display, and in particular, to a TFT substrate, a preparation method thereof, and a display device. Background technique [0002] Liquid Crystal Display (LCD) has many advantages such as thin body, power saving, no radiation, etc., and has been widely used, such as: mobile phone, personal digital assistant (PDA), digital camera, computer screen or notebook computer screen etc. [0003] Organic Light-Emitting Diode (OLED) display, also known as organic electroluminescent display, is an emerging flat panel display device, due to its simple preparation process, low cost, low power consumption, high luminous brightness, It has a wide range of working temperature adaptation, light and thin volume, fast response speed, easy to achieve color display and large-screen display, easy to achieve matching with integrated circuit drivers, easy to achieve flexible display and other advantages, so it has broad a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/82
CPCH01L27/1214H01L27/1259
Inventor 章仟益
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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