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Heat conduction insulating adhesive tape and preparation method thereof

A technology of thermal insulation and thermal conductive adhesive, which is applied in the directions of adhesives, adhesive types, film/sheet adhesives, etc. Effects of stability and service life, short process flow, high thermal conductivity

Inactive Publication Date: 2020-01-17
GUANGZHOU SHIYUAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies and defects in the prior art, the present invention provides a heat-conducting insulating tape, which comprehensively realizes the high insulation and high thermal conductivity of the tape, so as to solve the problem of poor heat dissipation performance of the film material tape in the existing heat-conducting tape, cloth base The technical problem of poor insulation performance of the tape

Method used

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  • Heat conduction insulating adhesive tape and preparation method thereof
  • Heat conduction insulating adhesive tape and preparation method thereof
  • Heat conduction insulating adhesive tape and preparation method thereof

Examples

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Effect test

Embodiment 1

[0030] In this embodiment, the present invention provides a thermally conductive insulating adhesive tape, which includes a substrate layer, a thermally conductive adhesive layer, and a release film layer arranged in sequence from bottom to top. Wherein the substrate layer is a non-woven fabric substrate; the thermally conductive adhesive layer includes the following raw materials in parts by weight: 100 parts of adhesive, 125 parts of nano thermal conductive filler, 2 parts of heat stabilizer, 3 parts of antioxidant, plasticizer 5 parts of agent, 1.5 parts of coupling agent and 40 parts of solvent, wherein in the present embodiment, the adhesive is silicone adhesive, the nano thermal conductive filler is nano ceramic powder thermal conductive filler, and the plasticizer is phthalate Diisooctyl formate, the solvent used is xylene, and the coupling agent is a silane coupling agent.

Embodiment 2

[0032] In this embodiment, the present invention provides a thermally conductive insulating adhesive tape, which includes a substrate layer, a thermally conductive adhesive layer, and a release film layer arranged in sequence from bottom to top. Wherein the substrate layer is a non-woven substrate; the thermally conductive adhesive layer includes the following raw materials in parts by weight: 120 parts of adhesive, 140 parts of nano thermal conductive filler, 1.5 parts of thermal stabilizer, 2.5 parts of antioxidant, plasticizing 6 parts of agent, 2 parts of coupling agent and 45 parts of solvent, wherein in the present embodiment, the adhesive is acrylic adhesive, the nano thermally conductive filler is nano ceramic fiber thermally conductive filler, and the plasticizer is phthalic acid Dibutyl ester, the used solvent is butanone, and the coupling agent is a titanate coupling agent.

Embodiment 3

[0034] In this embodiment, the present invention provides a thermally conductive insulating adhesive tape, which includes a substrate layer, a thermally conductive adhesive layer, and a release film layer arranged in sequence from bottom to top. Wherein the substrate layer is a non-woven fabric substrate; the thermally conductive adhesive layer includes the following raw materials in parts by weight: 115 parts of adhesive, 150 parts of nano thermal conductive filler, 2.5 parts of thermal stabilizer, 3.5 parts of antioxidant, plasticizing 8 parts of agent, 2 parts of coupling agent and 45 parts of solvent, wherein in the present embodiment, the adhesive is polyurethane adhesive, the nano thermally conductive filler is nano ceramic whisker thermally conductive filler, and the plasticizer is phthalate Dimethyl formate, the solvent used is toluene, and the coupling agent is a titanate coupling agent.

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Abstract

The invention relates to a heat conduction insulating adhesive tape and a preparation method thereof. The heat conduction insulating adhesive tape comprises a substrate layer, a heat conduction adhesive layer and a release film layer which are arranged successively from bottom to top, wherein the substrate layer is a non-woven fabric substrate or a composite fiber fabric substrate; and the heat conduction adhesive layer comprises an adhesive, a nanometer heat conduction filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent. As the non-woven cloth or compositefiber cloth is preferred as the material of the substrate layer, and together with the nanometer heat conduction filler used in the heat conduction adhesive layer, high insulation and high thermal conductivity of the adhesive tape are comprehensively realized; when a conventional insulating adhesive tape is replaced by the heat conduction insulating adhesive tape provided by the invention, both the insulation can be ensured and the problem of temperature rise of a device can be solved, the operation stability of a product can be improved, and the service life of the product can be prolonged;and meanwhile, the adhesive tape is simple in preparation method process, short in process procedure, common in use equipment, low in raw material price and applicable to on-batch production and use.

Description

technical field [0001] The invention relates to the technical field of insulating tapes, in particular to a heat-conducting insulating tape and a preparation method thereof. Background technique [0002] With the development of electronic industry technology, electronic devices tend to be miniaturized and thinner. At the same time, the performance and power of electronic components continue to improve, and the heat flux density increases sharply. How to effectively solve the problem of heat dissipation has become a bottleneck for the further development of electronic technology. [0003] There are many heat sources on the printed circuit board (PCB) board, among which the temperature rise of heat-generating devices such as chips and MOS (Metal Oxide Semiconductor) tubes can be effectively solved by means of radiators or heat sinks. For electronic magnetic devices, such as transformers and inductors composed of magnetic cores and coils, the industry has not yet obtained effec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/21C09J7/30C09J183/04C09J133/00C09J175/04C09J11/04
CPCC08K2201/011C09J11/04C09J133/00C09J175/04C09J183/04C09J2400/263C09J7/21C09J7/30C08K13/04C08K7/04C08K5/12
Inventor 任文冯先强
Owner GUANGZHOU SHIYUAN ELECTRONICS CO LTD
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