A samarium doped metal oxide thin film transistor and its preparation method and application
An oxide thin film and transistor technology, applied in transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of poor bias stress stability, large off-state current, large threshold voltage, etc., and achieve high production efficiency and smoothness. The effect of high degree, excellent electrical performance and stability
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[0027] The present invention provides a method for preparing a samarium-doped metal oxide thin film transistor, which comprises the following steps:
[0028] Step S01. Provide a salt solution containing samarium ions, indium ions and silicon dioxide (SiO 2 ) layer of P-type silicon substrate;
[0029] Step S02. Use acetone, ethanol, etc. to carry out ultrasonic cleaning treatment on the surface of the P-type silicon substrate, so that the surface of the silicon dioxide is clean and free of stains, and use deionized water to remove residual acetone, ethanol, etc. on the surface, and use a protective atmosphere to dry it to avoid Residual moisture, oxidative gas or reducing gas on the silica surface, and finally use a plasma cleaning machine to clean the silica surface to make the silica surface dry and clean;
[0030] Step S03. Coat the salt solution on the surface of silicon dioxide by spin coating to form a samarium-doped metal oxide thin film precursor layer.
[0031] Step...
Embodiment 1
[0046] A samarium-doped metal oxide thin film transistor and a preparation method thereof.
[0047] The preparation method comprises the following steps:
[0048] S11. The indium (III) nitrate [In (NO 3 ) 3 ·xH 2 O] and samarium(III) nitrate hexahydrate [Sm(NO 3 ) 3 ·6H 2 O] dissolved in deionized water, mixed to obtain a mixed solution, control the In 3+ is 0.392mol / L, Sm 3+ is 0.008mol / L.
[0049] S12. Provide a P-type silicon substrate with a silicon dioxide layer, wherein the thickness of the silicon dioxide layer is 100 nm, and acetone and ethanol are used for ultrasonic cleaning in sequence, and ultrasonic cleaning is performed for 15 minutes respectively, and then the residual ethanol on the surface is cleaned with deionized water. , and blow dry with nitrogen gas, and then use a plasma cleaning machine to clean the surface of the silicon substrate and the silicon dioxide layer to obtain a clean and dry silicon dioxide layer.
[0050] S13. Use a syringe to extr...
Embodiment 2
[0054] A samarium-doped metal oxide thin film transistor and a preparation method thereof.
[0055] The preparation method comprises the following steps:
[0056] S21. The indium (III) nitrate [In (NO 3 ) 3 ·xH 2 O] and samarium(III) nitrate hexahydrate [Sm(NO 3 ) 3 ·6H 2 O] dissolved in deionized water, mixed to obtain a mixed solution, control the In 3+ is 0.38mol / L, Sm 3+ is 0.02mol / L.
[0057] S22. Provide a P-type silicon substrate with a silicon dioxide layer, wherein the thickness of the silicon dioxide layer is 100 nm, and acetone and ethanol are used for ultrasonic cleaning in sequence, and ultrasonic cleaning is performed for 15 minutes respectively, and then the residual ethanol on the surface is cleaned with deionized water. , and blow dry with nitrogen gas, and then use a plasma cleaning machine to clean the surface of the silicon substrate and the silicon dioxide layer to obtain a clean and dry silicon dioxide layer.
[0058] S23. Use a syringe to extrac...
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