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Copper, nickel and manganese alloy brazing filler metal powder and preparation method thereof

A technology for alloy brazing filler metal and alloy powder, which is applied in the field of copper-nickel-manganese alloy brazing filler metal powder and its preparation, can solve the problem that it is difficult to produce alloy brazing filler metal whose composition meets the requirements, the key process technologies and methods are very different, and the composition of alloy elements is very different. Control the deviation from the required value and other problems to achieve the effect of overcoming the instability of chemical composition, reducing the formation of intermediate brittle phases, and improving plasticity

Active Publication Date: 2020-01-31
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the differences in the properties of each alloy itself, the different composition requirements, the control of oxygen content, the control of impurity components, and the requirements of particle size and yield, the key process technologies and methods are very different, and the preparation technology of different alloy materials has not yet been specified. The rules can be followed, and other alloy powder making processes cannot be simply used to produce copper-nickel-manganese alloy solder
In addition, copper-nickel-manganese alloy brazing filler metals contain boron, phosphorus and other elements, which are easily burned during the smelting process, causing the composition control of alloy elements to deviate from the required value, and it is difficult to produce alloy brazing filler metals that meet the requirements.

Method used

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  • Copper, nickel and manganese alloy brazing filler metal powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The chemical composition of the copper-nickel-manganese alloy solder powder of the present embodiment is Cu-28Ni-27Mn-0.6Si-0.8Fe-0.1B-4.0Co-0.08P, which is composed of the following components in mass percentage: nickel 28%, Manganese 27%, cobalt 4.0%, silicon 0.6%, iron 0.8%, boron 0.1%, phosphorus 0.08%, and the balance is copper.

[0027] The preparation method of the copper-nickel-manganese alloy solder powder of the present embodiment may further comprise the steps:

[0028] Step 1. Tamping the magnesia crucible in the vacuum air atomization powder making equipment, and then heating and dehumidifying; the temperature of the heating and dehumidifying is 800° C., and the time is 12 hours;

[0029] Step 2, raw materials 33.79kg of Cu-CATH-2 electrolytic copper plate, 27.1kg of Ni9996 electrolytic nickel plate, 27kg of DJMnD electrolytic manganese, 4.0kg of Co998 electrolytic cobalt plate, 0.8kg of YT3 industrial pure iron, 0.6kg of Si-2 pure silicon and 1kg nickel-b...

Embodiment 2

[0035] The chemical composition of the copper-nickel-manganese alloy solder powder of the present embodiment is Cu-29Ni-28.5Mn-1.0Si-1.2Fe-0.2B-5.0Co-0.14P, and is made up of the composition of following mass percent: nickel 29% , manganese 28.5%, cobalt 5.0%, silicon 1.0%, iron 1.2%, boron 0.2%, phosphorus 0.14%, and the balance is copper.

[0036] The preparation method of the copper-nickel-manganese alloy solder powder of the present embodiment may further comprise the steps:

[0037] Step 1. Tamping the magnesia crucible in the vacuum air atomization powder making equipment, and then heating and dehumidifying; the temperature of the heating and dehumidifying is 850° C., and the time is 11 hours;

[0038] Step 2. The raw materials are 34.23kg of Cu-CATH-2 electrolytic copper plate, 27.6kg of Ni9996 electrolytic nickel plate, 28.5kg of DJMnD electrolytic manganese, 5.0kg of Co998 electrolytic cobalt plate, 1.2kg of YT3 industrial pure iron, 1.0kg Si-2 pure silicon and 1.66k...

Embodiment 3

[0043] The chemical composition of the copper-nickel-manganese alloy solder powder of the present embodiment is Cu-30Ni-30Mn-1.4Si-1.6Fe-0.3B-6.0Co-0.2P, which consists of the following components in mass percentage: 30% nickel, Manganese 30%, cobalt 6.0%, silicon 1.4%, iron 1.6%, boron 0.3%, phosphorus 0.2%, and the balance is copper.

[0044] The preparation method of the copper-nickel-manganese alloy solder powder of the present embodiment may further comprise the steps:

[0045] Step 1. Tamping the magnesia crucible in the vacuum air atomization powder making equipment, and then heating and dehumidifying; the temperature of the heating and dehumidifying is 900° C., and the time is 10 hours;

[0046] Step 2. The raw materials are 29kg of Cu-CATH-2 electrolytic copper plate, 26.55kg of Ni9996 electrolytic nickel plate, 30kg of DJMnD electrolytic manganese, 6.0kg of Co998 electrolytic cobalt plate, 1.6kg of YT3 industrial pure iron, and 1.4kg of Si -2 Pure silicon and 3.75kg...

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Abstract

The invention discloses copper, nickel and manganese alloy brazing filler metal powder which is prepared from the following components in percent by mass: 28-30% of nickel, 27-30% of manganese, 4-6% of cobalt, 0.6-1.4% of silicon, 0.8-1.6% of ferrum, 0.1-0.3% of boron, 0.08-0.2% of phosphorus, less than 0.1% of oxygen, less than 0.05% of sulfur, less than 0.1% of carbon, less than 0.5% of total amount of other impurities and the balance copper. The invention also discloses a method of preparing the copper, nickel and manganese alloy brazing filler metal powder. The method comprises the following steps: uniformly mixing raw materials; putting the raw materials in vacuum induction melting gas atomization powder manufacturing equipment to be smelted to a mixed liquid alloy; and atomizing anddispersing the mixed liquid alloy to obtain the copper, nickel and manganese alloy brazing filler metal powder. The copper, nickel and manganese alloy brazing filler metal powder is small in difference of composition content and generation of an intermediate brittle phase is reduced. The heating and smelting processes and atomization are controlled, so that the copper, nickel and manganese alloy brazing filler metal powder which is uniform and stable in chemical component and low in impurity content is obtained.

Description

technical field [0001] The invention belongs to the technical field of brazing material preparation, and in particular relates to a copper-nickel-manganese alloy solder powder and a preparation method thereof. Background technique [0002] Thousands of parts are involved in an aircraft engine, and the number of parts to be welded is extremely large. Among them, copper-nickel-manganese alloy solder is a commonly used brazing material for various parts. [0003] Since the copper-nickel-manganese alloy solder contains eight elements, the properties of each element vary greatly, and it is easy to form an intermediate brittle phase, resulting in high brittleness of the alloy material itself, which does not have the plasticity required for rolling processing. When used in the field of brazing material, it cannot be prepared into welding wire and welding strip, so the use of brazing filler metal powder is an important way for this alloy to be used in titanium alloy welding. [000...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40B22F1/00B22F9/08C22C1/03C22C9/05C22C9/06
CPCB22F1/0003B22F9/082B23K35/302B23K35/40C22C1/03C22C9/05C22C9/06
Inventor 操齐高郑晶贾志华孟晗琪戎万王金鑫
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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