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Chamfering abrasive wheel, preparation method thereof and wafer machining device

A grinding wheel and chamfering technology, applied in metal processing equipment, grinding/polishing equipment, manufacturing tools, etc., can solve problems such as diamond coating damage

Inactive Publication Date: 2020-02-07
XIAN ESWIN MATERIAL TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, since the material of the chamfering grinding wheel is composed of iron elements, and iron elements can promote the oxidation reaction of diamond under high temperature conditions, the reaction is shown in formula 1-1, which further causes damage to the diamond coating

Method used

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  • Chamfering abrasive wheel, preparation method thereof and wafer machining device
  • Chamfering abrasive wheel, preparation method thereof and wafer machining device
  • Chamfering abrasive wheel, preparation method thereof and wafer machining device

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Effect test

preparation example Construction

[0036] figure 1 It is a schematic diagram of the preparation process of the existing chamfering grinding wheel, such as figure 1 As shown, the manufacturing method of the existing chamfering grinding wheel comprises: step a, making the chamfering grinding wheel base 1; step b, opening the grinding groove 2 on the side of the chamfering grinding wheel according to the shape requirements of use; step c, adding a certain proportion of diamond particles 3. Fill the grinding groove 2 with adhesive, and combine it with the chamfering grinding wheel base 1 through high-temperature sintering; step d, use a dressing wheel 4 with a certain shape to grind off the excess diamond particles 3 to form a grinding groove of the desired shape 2.

[0037] However, due to the high interfacial energy and chemical inertness of diamond, the bonding performance between the diamond coating of the existing chamfering grinding wheel and the substrate 1 of the chamfering grinding wheel is very poor. , ...

Embodiment 1

[0052] Metal Mo is used as the transition metal layer, such as image 3 Shown, the preparation technology of chamfering grinding wheel comprises the following steps:

[0053] Step a. making the chamfering grinding wheel base 1;

[0054] Step b. Open the grinding groove 2 on the side of the chamfering grinding wheel according to the shape requirements;

[0055] Step c. Prepare a metal molybdenum layer in the grinding tank 2 as the transition metal layer 5 by magnetron sputtering. Specifically, a Mo plate with a purity of 99.999% can be used as the sputtering target, and argon gas is used as the shielding gas , the deposition temperature is 800°C, the chamber pressure is 0.8Pa, and the deposition time is 60min;

[0056] Step d. Deposit a layer of diamond coating 6 on the transition metal layer 5 using hot filament plasma chemical vapor deposition (HFCVD), specifically CH 4 and H 2 As a plasma reactive gas, CH 4 and H 2 The ratio is 4%, CH 4 and H 2 The flow rates are 16scc...

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Abstract

The invention provides a chamfering abrasive wheel, a preparation method thereof and a wafer machining device, and belongs to the technical field of semiconductors. The preparation method of the chamfering abrasive wheel comprises the steps that a chamfering abrasive wheel base body is provided, wherein at least two grooves in the circumferential direction of the chamfering abrasive wheel base body are formed in the outer circumferential surface of the chamfering abrasive wheel base body; a transition metal layer is formed in each groove; and then diamond coatings are formed on the transitionmetal layers through a chemical vapor deposition method.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chamfering grinding wheel, a preparation method thereof, and wafer processing equipment. Background technique [0002] As the most basic material in the semiconductor field, wafers can be processed into various circuit element structures and become integrated circuit products with specific electrical functions. The wafer is processed and shaped through multiple processes such as Growing, Slicing, Edge Grinding, Lapping, Polishing, Cleaning, etc., and finally the flatness and roughness are obtained. required surface. In the wafer production process, the edge treatment of silicon wafers is very important, because small cracks or cracks on the edge will generate mechanical stress on the silicon wafer, thereby generating dislocations, resulting in the accumulation and shedding of harmful contaminants. In addition, edge dislocations It will also cause edge dislocation growt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B9/06B24D7/18B24D18/00C23C14/16C23C14/35C23C16/27
CPCB24D7/18B24D18/009B24B9/065C23C16/271C23C14/35C23C14/165
Inventor 李亮亮
Owner XIAN ESWIN MATERIAL TECH CO LTD
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