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Active ester compound and curable composition

A curable composition and compound technology, applied in organic chemistry, electrical solid devices, semiconductor/solid device components, etc., can solve problems such as limited use, unsatisfactory elastic modulus, and high melt viscosity

Active Publication Date: 2020-02-14
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the epoxy resin composition described in Patent Document 1, by using bis(α-naphthyl) isophthalate as the epoxy resin curing agent, it is different from the existing type of epoxy resin such as phenol novolak resin. Compared with the case of resin curing agent, the value of dielectric constant and dielectric loss tangent in the cured product is indeed lower, but the elastic modulus under high temperature conditions in the cured product cannot meet the level required in recent years
In addition, due to its high melt viscosity, its use in applications requiring low melt viscosity, such as semiconductor sealing materials, is limited.

Method used

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  • Active ester compound and curable composition
  • Active ester compound and curable composition
  • Active ester compound and curable composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] The manufacture of embodiment 1 active ester compound (1)

[0051] 160 g of 1,6-dihydroxynaphthalene and 1,100 g of toluene were put into a flask equipped with a thermometer, dropping funnel, condenser, fractionating tube, and stirrer, and dissolved while replacing the system with nitrogen under reduced pressure. Next, 218 g of benzoyl chloride was charged and dissolved while substituting nitrogen under reduced pressure in the system. 0.6 g of tetrabutylammonium bromide was added, and 420 g of 20% aqueous sodium hydroxide solution was added dropwise over 3 hours while controlling the inside of the system to 60° C. or lower while purging nitrogen gas. After completion of the dropwise addition, stirring was continued for 1 hour to make it react. After the reaction was completed, the reaction mixture was left to stand for liquid separation, and the water layer was removed. After adding water to the remaining organic layer and stirring for about 15 minutes, the mixture wa...

Embodiment 2

[0052] The manufacture of embodiment 2 active ester compound (2)

[0053] 160 g of 2,7-dihydroxynaphthalene and 1100 g of toluene were put into a flask equipped with a thermometer, a dropping funnel, a condenser tube, a fractionation tube, and a stirrer, and dissolved while replacing the system with nitrogen under reduced pressure. Next, 218 g of benzoyl chloride was charged and dissolved while substituting nitrogen under reduced pressure in the system. 0.6 g of tetrabutylammonium bromide was added, and 420 g of 20% aqueous sodium hydroxide solution was added dropwise over 3 hours while controlling the inside of the system to 60° C. or lower while purging nitrogen gas. After completion of the dropwise addition, stirring was continued for 1 hour to make it react. After the reaction was completed, the reaction mixture was left to stand for liquid separation, and the water layer was removed. After adding water to the remaining organic layer and stirring for about 15 minutes, th...

Embodiment 3、4 and comparative example 1

[0057] Each component was mixed in the ratio shown in the following Table 1, and the curable composition was manufactured. The curable composition was poured into the template, and molded at a temperature of 175° C. for 10 minutes using a press machine. The molded product was taken out from the template, and cured at a temperature of 175° C. for 5 hours to obtain a cured product. The cured product was subjected to an evaluation test according to the procedure described below. The results are shown in Table 1.

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Abstract

The purpose of the present invention is to provide an active ester compound having a low elastic modulus under high-temperature conditions in a cured product, a curable composition containing the active ester compound, a cured product thereof, a semiconductor sealing material, and a printed wiring board. Provided are an active ester compound that is a diesterified product of a dihydroxynaphthalenecompound (a1) and an aromatic monocarboxylic acid or an acid halide thereof (a2), a curable composition containing the active ester compound, a cured product thereof, a semiconductor sealing material, and a printed wiring board. The active ester compound is characterized by having a low elastic modulus under high-temperature conditions in the cured product.

Description

technical field [0001] The present invention relates to an active ester compound having a low elastic modulus under high temperature conditions, a curable composition containing the same, a cured product thereof, a semiconductor sealing material, and a printed wiring board. Background technique [0002] In the technical field of insulating materials used in semiconductors, multilayer printed circuit boards, and the like, the thinning and miniaturization of various electronic components requires the development of new resin materials that meet these market trends. As performance required for a semiconductor sealing material, a low modulus of elasticity under high temperature conditions is required to improve reflow performance. In addition, the heat resistance and moisture absorption resistance of the cured product are of course important. The following items are also important: as a measure for high-speed and high-frequency signals, the dielectric constant and dielectric los...

Claims

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Application Information

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IPC IPC(8): C07C69/78C08G59/42H01L23/29H01L23/31H05K1/03
CPCC07C69/78C08G59/42H01L23/29H01L23/31H05K1/03
Inventor 佐藤泰河崎显人
Owner DIC CORP
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