Flexible outer electrode of chip component and manufacturing method thereof

A manufacturing method and technology of flexible electrodes, which are applied in electrical components, cable/conductor manufacturing, circuits, etc., can solve the problems of difficult monitoring of the underfill process, high material and equipment costs, poor quality stability, etc., to improve anti-vibration and Bending resistance, easy handling, low cost effect

Active Publication Date: 2020-02-25
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the improvement effect of this method is better, it needs to add high material and equipment costs, and the production efficiency is low and the cycle is long. The bottom filling process is not easy to monitor constantly, and the quality stability is poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] A method for manufacturing a flexible external electrode of a chip component, comprising the following steps:

[0051] Step 1: Preparation of organic vehicle

[0052] Under the constant temperature condition of 70°C, 8 grams of thermoplastic acrylic resin was dissolved in 42 grams of terpineol and 6 grams of diethylene glycol ethyl ether acetate, and filtered to obtain an organic vehicle.

[0053] Step 2: Prepare silver powder mixture

[0054] Add 6 grams of spherical silver powder (0.2-1.2 μm) and 32 grams of flake silver powder (1.2-6.0 μm) into 15 grams of the above-mentioned organic carrier, add 0.1 gram of oxidized polyethylene wax dispersant, and mix well to obtain a silver powder mixed solution .

[0055] Step 3: Mix the silver powder mixture and organic vehicle

[0056] Add 1.4 grams of polyacrylamide thickener and 0.1 gram of oxidized polyethylene wax dispersant to the silver powder mixed solution, and mix evenly in a planetary mixer. The flexible electrode...

Embodiment 2

[0062] A method for manufacturing a flexible external electrode of a chip component, comprising the following steps:

[0063] Step 1: Preparation of organic vehicle

[0064] Under the constant temperature condition of 78° C., 10 grams of thermoplastic acrylic resin was dissolved in 46 grams of terpineol and 8 grams of diethylene glycol ethyl ether acetate, and filtered to obtain an organic vehicle.

[0065] Step 2: Prepare silver powder mixture

[0066] Add 8 grams of spherical silver powder (0.2 to 1.2 μm) and 36 grams of flake silver powder (1.2 to 6.0 μm) into 15 grams of the above-mentioned organic carrier, add 0.2 grams of oxidized polyethylene wax dispersant, and mix well to obtain a silver powder mixed solution .

[0067] Step 3: Mix the silver powder mixture and organic vehicle

[0068] Add 1.6 grams of polyacrylamide thickener and 0.2 grams of oxidized polyethylene wax dispersant to the silver powder mixed solution, and mix evenly in a planetary mixer. The flexibl...

Embodiment 3

[0074] A method for manufacturing a flexible external electrode of a chip component, comprising the following steps:

[0075] Step 1: Preparation of organic vehicle

[0076] Under the constant temperature condition of 88° C., 12 grams of thermoplastic acrylic resin was dissolved in 48 grams of terpineol and 7 grams of diethylene glycol ethyl ether acetate, and filtered to obtain an organic vehicle.

[0077] Step 2: Prepare silver powder mixture

[0078] Add 12 grams of spherical silver powder (0.2 to 1.2 μm) and 54 grams of flake silver powder (1.2 to 6.0 μm) into 22 grams of the above-mentioned organic carrier, add 0.3 grams of oxidized polyethylene wax dispersant, and mix well to obtain a silver powder mixed solution .

[0079] Step 3: Mix the silver powder mixture and organic vehicle

[0080] Add 2.2 grams of polyacrylamide thickener and 0.6 grams of oxidized polyethylene wax dispersant to the silver powder mixed solution, mix well in the planetary mixer, after passing t...

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Abstract

The invention discloses a flexible outer electrode of a chip component and a manufacturing method thereof. The manufacturing method comprises the following steps of: mixing thermoplastic polymer spiral resin with silver powder, an organic solvent, a thickening agent and a dispersing agent to prepare flexible electrode slurry, coating the flexible electrode slurry on an extraction electrode part ofa chip component, drying and curing to prepare an outer electrode, and plating a metal layer to prepare the integral flexible outer electrode with weldability. The manufactured flexible outer electrode can effectively eliminate damage and cracking of a chip component body, an electrode and a welding spot of the chip component under bending, vibration or stress impact of a substrate, is remarkablein effect, free of pollution, low in cost, high in efficiency and easy to operate, and meets various chip component products.

Description

technical field [0001] The invention relates to a chip component, in particular to a flexible external electrode of a chip component and a manufacturing method thereof. Background technique [0002] With the development of electronic machines towards lightness, thinness, miniaturization, high reliability and high technology, leadless chip electronic components (resistors, capacitors, inductors) have also developed rapidly, and the development of science and technology and the level of electronic technology have continued to improve. Next, chip electronic components have comprehensive performances such as small size, light weight, high installation density, good high-frequency characteristics, and high reliability, and have been widely used in communications, computers, vehicles, aerospace, aviation, navigation, electronics, weapons, etc. field. When used in the field of high reliability, the product is required to have higher anti-vibration and anti-bending capabilities to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B5/14H01B13/00
CPCH01B1/22H01B5/14H01B13/0026
Inventor 杨日章王清华
Owner SHENZHEN SUNLORD ELECTRONICS
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