Metal patterned transparent photosensitive polyimide film, and preparation method and application thereof

A technology of photosensitive polyimide and polyimide film, applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems of complex manufacturing process, inability to recycle and high cost of flexible circuit boards , to achieve huge economic benefits and environmental protection significance, strong adhesion, fine coating thickness effect

Active Publication Date: 2020-03-27
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the defects of complex manufacturing process of flexible circuit boards in the pr

Method used

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  • Metal patterned transparent photosensitive polyimide film, and preparation method and application thereof
  • Metal patterned transparent photosensitive polyimide film, and preparation method and application thereof
  • Metal patterned transparent photosensitive polyimide film, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] This embodiment provides a transparent photosensitive polyimide resin and its film, the preparation process of which is as follows.

[0102] (1) Weigh 40mmol of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 10mmol of 3,5-diaminobenzoic acid monomer into a three-necked flask with nitrogen protection and mechanical stirring , add 150mL of N,N'-dimethylacetamide, stir under dry nitrogen and room temperature for 30min until the raw material is completely dissolved;

[0103] (2), weigh 50mmol of 4,4'-(hexafluoroisopropylene) diphthalic anhydride monomer, add to the above solution in 4 times, the last addition is less than or equal to half of the previous time; Stir at room temperature for 15 hours to obtain polyamic acid;

[0104] The chemical reaction equation of step (1) and (2) is as shown in [1] formula:

[0105]

[0106] (3) Add 8.5mL of acetic anhydride, pyridine and triethylamine to the above polyamic acid; the concentration of acetic anhydride is 0.6mol / L; the conc...

Embodiment 2

[0136] This embodiment provides a transparent photosensitive polyimide resin and its film, the preparation process of which is as follows.

[0137] (1) Weigh 40mmol of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 10mmol of 3,5-diaminobenzoic acid monomer into a three-necked flask with nitrogen protection and mechanical stirring , add 150mL of N,N'-dimethylacetamide, stir for 30min under dry nitrogen and room temperature, until the solid material is completely dissolved;

[0138] (2) Weigh 50 mmol of 3,3',4,4'-benzophenone tetracarboxylic dianhydride monomer, add it to the above solution in 4 times, and the last addition amount is less than or equal to half of the previous one; After adding, stir at room temperature for 20 hours to obtain polyamic acid;

[0139] The chemical reaction equation of step (1) and (2) is as shown in [1] formula:

[0140]

[0141] (3) Add 8.5mL of acetic anhydride, pyridine and triethylamine to the above polyamic acid; the concentration of acetic...

Embodiment 3

[0156] This embodiment provides a transparent photosensitive polyimide resin and its film, the preparation process of which is as follows.

[0157] (1), Weigh 40mmol of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 10mmol of 3.5-diaminobenzoic acid monomer into a three-necked flask with nitrogen protection and mechanical stirring, add Stir 150mL of N,N'-dimethylacetamide under dry nitrogen and room temperature for 30min until the solid material is completely dissolved;

[0158] (2) Weigh 50 mmol of 4,4'-oxydiphthalic anhydride monomer and add it to the above solution in 4 times. The last addition is less than or equal to half of the previous one; Stir for 20 hours to obtain polyamic acid;

[0159] Step (1) and (2) chemical reaction equation is as shown in [1] formula:

[0160]

[0161] (3) Add 8.5mL of acetic anhydride, pyridine and triethylamine to the above polyamic acid; the concentration of acetic anhydride is 0.6mol / L; the concentration of triethylamine is 0.15mol / L; ...

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Abstract

The invention relates to a metal patterned transparent photosensitive polyimide film, and a preparation method and application thereof. The metal patterned transparent photosensitive polyimide film comprises a polyimide film and a patterned metal coating attached to the surface of the polyimide film. The polyimide resin has a structure as shown in a formula (I) or a formula (II). The metal patterned transparent photosensitive polyimide film provided by the invention has photochromic property, solubility and excellent flexibility, and can be used for preparing a circuit board of flexible electronic equipment; the adhesion between the metal coating and the polyimide surface is strong, the coating surface is smooth and fine, and the coating thickness is uniform; and the polyimide resin and the metal in the coating on the polyimide resin can be recycled after the polyimide resin is dissolved, so that zero waste and full recycling of the flexible circuit substrate and related circuit boardproducts are truly realized after the service life of an electronic circuit product is ended, and huge economic benefits and environmental protection significance are achieved.

Description

technical field [0001] The invention belongs to the technical field of photosensitive resin materials, and in particular relates to a metal patterned transparent photosensitive polyimide film and a preparation method and application thereof. Background technique [0002] With the development of flexible electronics, microelectronic packaging, biochemical sensors and communication technology (5G) towards lightness, miniaturization and high frequency, the substrate material of the device is required to have flexibility, good heat resistance, low dielectric constant, Strong resistance to electromigration, low resistivity of metal plating wiring and other characteristics. Polyimide film has the characteristics of good flexibility, low dielectric constant, high mechanical strength, good bending resistance, high temperature resistance and strong electrical resistance. It is an ideal flexible substrate for electronic packaging and flexible electronic device substrate. It has been ...

Claims

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Application Information

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IPC IPC(8): C23C18/14C08L79/08C08J5/18C08G73/10
CPCC08G73/1007C08G73/1039C08G73/1067C08G73/1071C08G73/1078C08J5/18C08J2379/08C23C18/14
Inventor 容敏智莫伟杰张泽平章明秋
Owner SUN YAT SEN UNIV
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