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Circuit material and circuit board comprising same

A circuit and release material technology, applied in electronic equipment, printed circuits, printed circuits, etc., can solve the problems of high dielectric loss, low peel strength, and high curing temperature, and achieve low dielectric loss, high interlayer peel strength, The effect of good film formation

Inactive Publication Date: 2020-06-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] US 5223568A discloses a board prepared by using polybutadiene, polyisoprene and thermoplastic elastomer. The loss of the prepared board is small, but the board has the disadvantages of low peel strength, high curing temperature and high energy consumption
[0005] US 5571609A discloses a board prepared by using unsaturated polybutadiene resin, unsaturated olefin resin and filler. The board is not sticky and has good manufacturability, but the board contains a large amount of filler, and the peel strength of the board Low, high dielectric loss

Method used

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  • Circuit material and circuit board comprising same
  • Circuit material and circuit board comprising same
  • Circuit material and circuit board comprising same

Examples

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Effect test

Embodiment 1-5 and comparative example 1-8

[0094] Embodiments 1-5 and Comparative Examples 1-8 each provide a circuit material, and its preparation method is as follows:

[0095] (1) Prepreg:

[0096] S7136 prepreg, thermosetting hydrocarbon-based substrate material, self-made by Guangdong Shengyi Technology

[0097] Or Synamic6 prepreg, thermosetting hydrocarbon-based substrate material, self-made by Guangdong Shengyi Technology

[0098] (2) Preparation of adhesive layer:

[0099] Dissolve unsaturated polyphenylene ether resin, SBS resin, maleimide resin, initiator, silane coupling agent and flame retardant in xylene, mix at room temperature to obtain glue; Liquid coated on the copper foil, and then baked in an oven at 155° C. for 5 minutes to obtain an adhesive layer (thickness 30 μm).

[0100] (3) Preparation of circuit materials:

[0101] Several sheets of the above-mentioned prepregs and copper foils with adhesive layers were laminated neatly (adhesive layer is between the prepregs and copper foils), laminated...

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Abstract

The invention provides a circuit material and a circuit board comprising the same. The circuit material comprises a conductive metal layer, a dielectric substrate layer, and an adhesive layer arrangedbetween the conductive metal layer and the dielectric substrate layer, wherein a material of the adhesive layer includes an adhesive composition; the adhesive composition comprises a resin componentand a non-resin component, the resin component is composed of unsaturated polyphenyl ether resin, SBS resin and maleimide resin, and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent to the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or obtained by applying the adhesive composition to a release material, partially or completely curing the adhesive composition and then removing the release material. According to the invention, the unsaturated polyphenyl ether resin, the SBS resin and the maleimide resin are matched with one another, so the obtained adhesive layer has good film-forming property, cohesiveness and dielectric property, and the circuit material has relatively high interlayer peel strength and relatively low dielectric loss.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a circuit material and a circuit board containing the same. Background technique [0002] In recent years, with the development of high-performance, high-function, and network-based communication equipment such as computers and mobile phones, in order to transmit high-speed and process large-capacity information, operating signals are becoming high-frequency, and a suitable for high-frequency signal transmission is required. High-performance electrical insulating materials with special characteristics. [0003] In high-frequency circuits, the transmission loss of electrical signals is represented by the sum of dielectric loss, conductor loss, and radiation loss. The higher the frequency of electrical signals, the greater the dielectric loss, conductor loss, and radiation loss. Since the transmission loss will attenuate the electrical signal, destroying...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/02C09J171/12C09J179/08B32B15/04B32B7/12B32B15/20B32B27/06B32B33/00H05K1/02
CPCC09J153/02C09J171/12B32B15/04B32B7/12B32B15/20B32B27/06H05K1/02B32B2307/204B32B2457/00C08L2205/03C08L2203/20C08L79/08C08L71/126C08L53/02C08G65/485H05K3/386H05K2201/012H05K2201/0209C08L9/06C09J11/06C09J179/085C09J2203/326H05K1/0373H05K2201/0158H05K2201/0195
Inventor 殷卫峰霍翠刘锐许永静颜善银
Owner GUANGDONG SHENGYI SCI TECH
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