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Polyimide flexible copper-clad plate

A technology of polyimide flexibility and polyimide, which is applied in the field of polyimide flexible copper clad laminates, can solve the problems that the performance of 2F-FCCL cannot meet the demand, and achieve excellent performance, small size change, and dielectric strength. The effect of low coefficient

Active Publication Date: 2020-06-19
NANJING ZHONGHONG RUNNING ADVANCED MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the performance of the current 2F-FCCL still cannot meet the demand, and there is a large room for improvement

Method used

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  • Polyimide flexible copper-clad plate
  • Polyimide flexible copper-clad plate
  • Polyimide flexible copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The preparation method of low dielectric polyimide comprises the following steps:

[0034] (1) Under nitrogen protection and a certain temperature condition, the compound shown in the formula VI and the compound shown in the formula VII are stirred and reacted in an organic solvent to obtain the intermediate shown in the formula VIII; the organic solvent is N-methyl Pyrrolidone; the reaction temperature is 15°C;

[0035] (2) add dehydrating agent and catalyzer, the intermediate shown in VIII continues stirring reaction at a certain temperature, cleans, filters, dries, obtains the compound shown in formula V; Described dehydrating agent is trifluoroacetic anhydride; Dehydrating agent The molar ratio of the catalyst to the compound VII is 4:1; the catalyst is triethylamine, and the molar ratio of the catalyst to the compound VII is 3:1; the reaction temperature is 50°C.

[0036] Polymer molecular structure evaluation method: Fourier transform infrared spectroscopy (FT-IR...

Embodiment 2

[0039] The preparation method of low dielectric polyimide comprises the following steps:

[0040] (1) Under nitrogen protection and a certain temperature condition, the compound shown in the formula VI and the compound shown in the formula VII are stirred and reacted in an organic solvent to obtain the intermediate shown in the formula VIII; the organic solvent is N, N- Dimethylacetamide; the reaction temperature is 5°C;

[0041] (2) add dehydrating agent and catalyzer, the intermediate shown in VIII continues stirring reaction at a certain temperature, cleans, filters, dries, obtains the compound shown in formula V; Described dehydrating agent is acetic anhydride; Dehydrating agent and compound The molar ratio of VII is 5:1; the catalyst is pyridine, and the molar ratio of catalyst to compound VII is 4:1; the reaction temperature is 40°C.

Embodiment 3

[0043] The preparation method of low dielectric polyimide comprises the following steps:

[0044] (1) Under nitrogen protection and a certain temperature condition, the compound shown in the formula VI and the compound shown in the formula VII are stirred and reacted in an organic solvent to obtain the intermediate shown in the formula VIII; the organic solvent is N, N- Dimethylformyl; the reaction temperature is 25°C;

[0045] (2) add dehydrating agent and catalyzer, the intermediate shown in VIII continues stirring reaction at a certain temperature, washes, filters, dries, obtains the compound shown in formula V; Described dehydrating agent is sulfur oxychloride; Dehydrating agent The molar ratio of the catalyst to the compound VII is 3:1; the catalyst is triethylamine, and the molar ratio of the catalyst to the compound VII is 2:1; the reaction temperature is 60°C.

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Abstract

The invention provides a preparation method of a polyimide flexible copper-clad plate. The method comprises the following steps: adding polyimide and a heat-conducting filler into dimethylformamide, and stirring to uniformly mix so as to obtain a polyimide glue solution; selecting rolled copper foil, and coating the rough surface of one piece of copper foil with the polyimide glue solution under the protection of inert gas; carrying out imidization in a nitrogen protection oven; covering the polyimide glue solution with another copper foil with the same size to obtain a semi-finished product,and heating and laminating the semi-finished product; and putting the semi-finished product glue-free copper-clad plate into a muffle furnace, and treating under the protection of heating inert gas toobtain the polyimide flexible copper-clad plate. The two-layer flexible copper-clad plate provided by the invention is small in size change and stable, the formed polyimide layer and the copper foilare good in cohesiveness, and the polyimide layer is low in moisture absorption rate, low in dielectric coefficient and excellent in performance.

Description

technical field [0001] The invention relates to the field of materials, in particular to a polyimide flexible copper clad laminate. Background technique [0002] Polyimide refers to a class of polymers containing imide rings (-CO-NH-CO-) on the main chain, among which polymers containing phthalimide structures are the most important. Polyimide is one of the organic polymer materials with the best comprehensive performance. It has the advantages of high temperature resistance, low dielectric constant, and corrosion resistance. Its high temperature resistance can reach above 400 ° C, and the long-term use temperature range is -200 ~ 300 ° C , has high insulating properties. As a special engineering material, polyimide has been widely used in aviation, aerospace, microelectronics, nanometer, liquid crystal, separation membrane, laser and other fields, and has become an irreplaceable functional material with excellent comprehensive performance. [0003] Flexible copper clad la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/01B32B15/20B32B7/12C09J179/08C09J11/04C08G73/10
CPCB32B7/12B32B15/01B32B15/20C08G73/1039C08G73/1067C08K2003/2227C08K2003/282C08K2003/385C09J11/04C09J179/08C08K3/22C08K3/28C08K3/38C08K3/34
Inventor 徐勇陈坚汤学妹
Owner NANJING ZHONGHONG RUNNING ADVANCED MATERIAL TECH CO LTD
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