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Full-spectrum LED lamp packaging adhesive

A technology for LED lamps and encapsulation adhesives, applied in the direction of adhesives, etc., can solve the problems of easy cracking, poor toughness, and increased hardness of encapsulation adhesives, and achieve the effects of low impurity content, high adhesion, and high thermal stability.

Inactive Publication Date: 2020-06-26
南京智聚科技咨询有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high rigidity of the phenyl silicone system, when working at high temperature for a long time, the hardness will increase significantly and the toughness will deteriorate.
The result shown on the filament is that the encapsulant is easy to crack, which may lead to reduced light efficiency and blue light overflow, or lead to broken gold wires and dead lights.
Therefore, there are fewer reports on the application of phenyl silicones on LED filaments.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A method for preparing an encapsulant for a full-spectrum LED lamp, comprising the following steps:

[0031] (1) Preparation of Compound A: React hydrosilane and epoxyhexylethylene under the action of a Pt catalyst to obtain it; the reaction temperature is 75° C., and the reaction time is 2 hours.

[0032] (2) Preparation of encapsulant: mix compound A, compound B, compound C, and compound D evenly, add distilled water and barium hydroxide monohydrate catalyst as reactants, heat to 75°C, and perform hydrolysis and condensation reaction for 3 hours under stirring conditions, The mass ratio of the reactant and distilled water is 1:1; after the reaction, pressurize and filter to obtain the product.

[0033] The number average molecular weight was 1120, the weight average molecular weight was 1690, and the molecular weight distribution index was 1.468.

[0034] Test its performance: the light transmittance is 93%, the refractive index at 25°C is 1.732, the thermogravimetri...

Embodiment 2

[0036] A method for preparing an encapsulant for a full-spectrum LED lamp, comprising the following steps:

[0037] (1) Preparation of Compound A: React hydrosilane and epoxyhexylethylene under the action of a Pt catalyst to obtain it; the reaction temperature is 60° C., and the reaction time is 3 hours.

[0038] (2) Preparation of encapsulant: mix compound A, compound B, compound C, and compound D evenly, add distilled water and barium hydroxide monohydrate catalyst as reactants, heat to 60°C, and perform hydrolysis and condensation reaction for 4 hours under agitation. The mass ratio of the reactant and distilled water is 1:2; after the reaction, pressurize and filter to obtain the product.

[0039] The number average molecular weight was 1140, the weight average molecular weight was 1680, and the molecular weight distribution index was 1.482.

[0040] Test its performance: the light transmittance is 92%, the refractive index at 25°C is 1.692, the thermogravimetric analysis...

Embodiment 3

[0042] A method for preparing an encapsulant for a full-spectrum LED lamp, comprising the following steps:

[0043] (1) Preparation of Compound A: React hydrosilane and epoxyhexylethylene under the action of a Pt catalyst to obtain it; the reaction temperature is 90° C., and the reaction time is 1 h.

[0044] (2) Preparation of encapsulant: mix compound A, compound B, compound C, and compound D evenly, add distilled water and barium hydroxide monohydrate catalyst as reactants, heat to 90°C, and perform hydrolysis and condensation reaction under stirring conditions for 2 hours, The mass ratio of the reactants to distilled water is 3:2; after the reaction, pressurize and filter to obtain the product.

[0045] The number average molecular weight was 1150, the weight average molecular weight was 1710, and the molecular weight distribution index was 1.501.

[0046] Test its performance: the light transmittance is 92%, and the refractive index at 25°C is 1.687. The thermogravimetri...

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Abstract

The invention provides a full-spectrum LED lamp packaging adhesive. The organic silicon packaging adhesive prepared according to the invention has the characteristics of high light transmittance, highrefractive index, high thermal stability, high cohesiveness and the like, and is simple in preparation process, good in repeatability, controllable in product quality, low in product impurity contentand suitable for industrial production.

Description

technical field [0001] The invention belongs to the field of lighting materials, in particular to a packaging glue for full-spectrum LED lamps. Background technique [0002] Semiconductor lighting technology is one of the most promising high-tech fields in the 21st century, and Light Emitting Diode (hereinafter referred to as LED) is its core technology. LED is a kind of light-emitting element that can directly convert electric energy into light energy. It has low working voltage, low power consumption, high luminous efficiency, extremely short luminous response time, pure light color, firm structure, impact resistance and vibration resistance. , stable and reliable performance, light weight, small volume and low cost and a series of characteristics. LED lighting has the characteristics of small size, high brightness, and low energy consumption. It is expected to replace incandescent fluorescent lamps and become the mainstream indoor lighting source. Therefore, it has been ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C08G77/18
CPCC08G77/18C09J183/06
Inventor 孙琴徐福祥丁洋洋
Owner 南京智聚科技咨询有限公司