Monocrystal diamond wafer double-faced chemico-mechanical polishing method

Abstract

The invention provides a monocrystal diamond wafer double-faced chemico-mechanical polishing method and belongs to the field of the ultra-precision machining technology. The method comprises the roughpolishing stage and the fine polishing stage, wherein at the rough polishing stage, polyurethane polishing pads are adopted; at the fine polishing stage, lint polishing pads are adopted; during roughpolishing and fine polishing, polishing solutions at different formulas are added dropwise, and different polishing parameters are set; and the polishing solution for rough polishing or fine polishing mainly comprises abrasive particles such as boron carbide and cerium oxide, and chemical regents such as ursolic acid, iodine tincture and kerosene. Through the monocrystal diamond wafer double-faced chemico-mechanical polishing method provided by the invention, a monocrystal diamond wafer material can be quickly removed, ultralow damage and super-smoothness of polished surfaces are ensured, andthe developed polishing solution is green and friendly to environment.

Description

technical field [0001] The invention belongs to the field of ultra-precision machining of superhard materials, and in particular relates to a double-sided chemical mechanical polishing method of a single crystal diamond wafer. Background technique [0002] Diamond materials have excellent optical, thermal, electrical and other physical properties, among which single crystal diamond has the best performance, and is widely used in ultra-precision machining, aerospace, semiconductor and other fields, such as ultra-precision machining tools, semiconductor microelectronic substrates, optical components And other parts materials can choose single crystal diamond wafer. The diamond wafer with flat and smooth surface and low damage layer thickness helps to improve the service performance and service life of parts. [0003] Common processing methods for single crystal diamond wafers include mechanical grinding, thermochemical polishing, chemical mechanical polishing, and electric sp...

AI Technical Summary

Problems solved by technology

[0004] The double-sided chemical mechanical polishing method of a kind of single crystal diamond wafer provided by the present invention, by preparing the polishing fluid that is main component with environment-friendly reagents such as ursolic acid, iodine, kerosene, carries out coarse polishing and polishing to the single crystal diamond wafer Fine polishing, to solve the problem of many scratches and large damage layer in traditional mechanical polishing, and the problem of environmental pollution caused by the use of strong acid and strong alkali polishing liquid in traditional chemical mechanical polishing

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