A kind of heat-conducting adhesive with high glass transition temperature and preparation method thereof
A high-vitrification, thermally conductive adhesive technology, applied in the field of thermally conductive adhesives, can solve the problems of optical fiber ring gradient temperature difference, affecting the accuracy of fiber optic gyroscope, affecting the zero bias stability of fiber optic gyroscope, etc., to reduce temperature difference, reduce curing shrinkage, moisturizing Wet leveling effect
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Embodiment 1
[0035] (1) Preparation of organosilicon epoxy prepolymer A
[0036] 344g terminal hydrogen-containing phenyl silicone oil Add 308.42g of allyl bisphenol A into the flask, add 100ppm platinum catalyst KP36 relative to the total mass, react at a temperature of 120°C for 3 hours, then add 114.14g of allyl glycidyl ether and continue the reaction for 4 hours to obtain the product with a viscosity of 25℃265mpa.s.
[0037] (2) Preparation of organosilicon epoxy prepolymer B
[0038] 208g terminal hydrogen-containing silicone oil Add 308.42g of allyl bisphenol A into the flask, add 150ppm platinum catalyst KP36 relative to the total mass, react at a temperature of 130°C for 2 hours, and then add 124.18g of 4-vinyl-1-cyclohexene-1,2- The epoxy continued to react for 3 hours to obtain a product with a viscosity of 176mpa.s at 25°C.
[0039] (3) Preparation of thermally conductive adhesive
[0040] The mass ratio of the raw materials of each component of the thermal conductive adh...
Embodiment 2
[0043] Step (1) (2) is consistent with embodiment 1.
[0044] (3) Preparation of thermally conductive adhesive
[0045] The mass ratio of the raw materials of each component of the thermal conductive adhesive is: silicone epoxy prepolymer A 4%, silicone epoxy prepolymer B6%, alicyclic epoxy resin UVR-6128 2%, 3-ethyl-3 -Oxetanemethanol 2%, macromolecular polyol PTMG6502%, curing agent Anyhard 1010P 3.52%, antioxidant 1726 0.1%, light stability UV-9 0.1%, thermally conductive filler acicular alumina 10%, thermally conductive filler Spherical alumina 70%, TiloJet 3000 0.08%, coupling agent AL-M (aluminate) 0.2%, the sum of each component meets 100%.
[0046] Weigh the above-mentioned raw materials in proportion, add all materials except curing agent and thermal conductive filler into the mixing tank, and then add thermal conductive filler while stirring. After all the thermal conductive fillers are added, use an ultrasonic processor for 25 minutes, and then wait for the materia...
Embodiment 3
[0048] Step (1) (2) is consistent with embodiment 1.
[0049] (3) Preparation of thermally conductive adhesive
[0050] The mass ratio of the raw materials of each component of the thermal conductive adhesive is: silicone epoxy prepolymer A 30%, silicone epoxy prepolymer B 5%, cycloaliphatic epoxy resin UVR-6128 12%, 3-oxetane Alkanol 12%, macromolecular polyol PCL305 11%, curing agent ICAM-8409 0.5%, defoamer DC-163 0.1%, antioxidant 1010 0.16%, light stability UV-5310.15%, thermally conductive filler graphene 8%, thermal conductive filler spherical boron nitride 20%, TiloJet 3003 0.59%, coupling agent isopropyl triisostearyl titanate 0.5%, the sum of each component meets 100%.
[0051] Weigh the above-mentioned raw materials in proportion, add all materials except curing agent and thermal conductive filler into the mixing tank, and then add thermal conductive filler while stirring. After all the thermal conductive fillers are added, use an ultrasonic processor for 10 minute...
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