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Diamond-reinforced silicon carbide substrate, preparation method thereof and electronic product

A diamond reinforced, silicon carbide substrate technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of limited size and low density

Inactive Publication Date: 2020-08-04
北京科技大学广州新材料研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to address the problems of limited size and low density of traditional diamond / silicon carbide substrates, and provide a method for preparing diamond-reinforced silicon carbide substrates, so that the size of the prepared diamond-reinforced silicon carbide substrates can be controlled. And high density

Method used

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  • Diamond-reinforced silicon carbide substrate, preparation method thereof and electronic product
  • Diamond-reinforced silicon carbide substrate, preparation method thereof and electronic product

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preparation example Construction

[0025] see figure 1 , a method for preparing a diamond-reinforced silicon carbide substrate in one embodiment, comprising the following steps:

[0026] Step S110: performing wet ball milling on diamond, graphite, dispersant, binder, plasticizer and solvent to obtain cast slurry.

[0027] Wherein, the dispersant is selected from one of triethyl phosphate and castor oil. The dispersant can uniformly disperse each raw material in the solvent.

[0028] The binder is polyvinyl butyral (PVB). The binder is capable of binding the raw materials together.

[0029] The plasticizer is dioctyl phthalate. Adding a binder and a plasticizer to the raw material can increase the strength of the casting billet, improve the toughness and ductility of the casting billet, so as to facilitate separation from the substrate material.

[0030] The solvent is one of isopropanol / toluene, ethanol / ethyl acetate, ethanol / methyl ethyl ketone, trichloroethylene / methyl ethyl ketone and ethanol / water. It...

Embodiment 1

[0058] The preparation process of the diamond-reinforced silicon carbide substrate of this embodiment is as follows:

[0059] (1) Add diamond, graphite, dispersant (triethyl phosphate) and solvent (ethanol and ethyl acetate azeotropic liquid) in the polytetrafluoroethylene ball mill jar according to the ratio of 50g, 5g, 3.3g and 21.7g, and ball mill After 6 hours, 6.5 g of binder (PVB) and 6.5 g of plasticizer (dioctyl phthalate) were added thereto to continue ball milling for 6 hours, and finally a casting slurry with a viscosity of about 8000 mPaS was obtained.

[0060] (2) The casting slurry prepared in step (1) was subjected to vacuum defoaming for 30 minutes under a negative pressure environment of -87.5KPa, and then filtered.

[0061] (3) Tape cast the cast slurry processed in step (2) with a tape casting machine, control the height of the scraper to be 1.3mm, and the casting speed to be 0.02m / min, the first, second and third drying Zone temperatures were set to 40° C....

Embodiment 2

[0067] The preparation process of the diamond-reinforced silicon carbide substrate of this embodiment is as follows:

[0068] (1) Add diamond, graphite, dispersant (triethyl phosphate) and solvent (ethanol and ethyl acetate azeotropic liquid) in the polytetrafluoroethylene ball mill jar according to the ratio of 50g, 10g, 3.3g and 21.7g, and ball mill After 6 hours, 6.5 g of binder (PVB) and 6.5 g of plasticizer (dioctyl phthalate) were added thereto to continue ball milling for 6 hours, and finally a casting slurry with a viscosity of about 8210 mPaS was obtained.

[0069] (2) The casting slurry prepared in step (1) was subjected to vacuum defoaming for 30 minutes under a negative pressure environment of -87.5KPa, and then filtered.

[0070] (3) Tape cast the cast slurry processed in step (2) with a tape casting machine, control the height of the scraper to be 1.3mm, and the casting speed to be 0.02m / min, the first, second and third drying Zone temperatures were set at 40°C,...

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Abstract

The invention relates to a diamond-reinforced silicon carbide substrate, a preparation method thereof and an electronic product. The preparation method of the diamond-reinforced silicon carbide substrate comprises the following steps: carrying out wet ball milling on diamond, graphite, a dispersant, a binder, a plasticizer and a solvent to obtain tape casting slurry; carrying out tape casting on the tape casting slurry to obtain a tape casting blank with the thickness of 0.3-0.55 mm; and carrying out gas-phase infiltration on the casting blank and silicon powder to obtain the diamond reinforced silicon carbide substrate. According to the preparation method of the diamond-reinforced silicon carbide substrate, the prepared diamond-reinforced silicon carbide substrate can be controllable in size, high in density and good in thermal conductivity.

Description

technical field [0001] The invention relates to the field of ceramic materials, in particular to a diamond-reinforced silicon carbide substrate, a preparation method thereof, and electronic products. Background technique [0002] The comprehensive performance of high thermal conductivity electronic packaging substrate materials is a key factor restricting the integration of the microelectronics industry. In recent years, with the development of the microelectronics industry towards miniaturization, high power, and high integration, higher requirements have been placed on the performance of packaging substrate materials. As a third-generation electronic packaging material, diamond / silicon carbide has been widely studied due to its excellent properties such as high thermal conductivity, high hardness, and low thermal expansion coefficient. At present, methods such as hot isostatic pressing (HIP) and high-temperature and high-pressure sintering (HIHP) are mostly used for the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/532C04B35/622C04B35/65H01L23/15H01L23/373
CPCC04B35/532C04B35/622C04B35/65C04B2235/425C04B2235/427C04B2235/428C04B2235/614C04B2235/656C04B2235/6565C04B2235/6567H01L23/15H01L23/3731H01L23/3732
Inventor 何新波刘鹏飞沈学为吴茂
Owner 北京科技大学广州新材料研究院