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circuit board

A circuit substrate and dielectric technology, applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problems of circuit substrate signal transmission line performance differences, increase signal transmission heat loss, and circuit substrates are prone to deformation, etc., to achieve The effect of stable dielectric constant, low dielectric loss, and stable dielectric loss

Active Publication Date: 2022-07-01
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, many current circuit substrates use glass fiber cloth as a reinforcing material, and the Dk of glass fiber cloth is about 6.0, which will greatly increase the Dk value of the circuit substrate, and will also produce a glass fiber braiding effect, resulting in a signal loss of the entire circuit substrate. The performance of the transmission line is different, and at the same time, the circuit substrate composited with glass fiber cloth is prone to deformation during transportation or handling
However, the current circuit substrates without glass fiber cloth reinforcement use fillers with poor thermal conductivity to improve the dielectric properties. As a result, although the circuit substrates have good dielectric performance stability, they have poor thermal conductivity and heat dissipation performance, which will eventually increase signal transmission. heat loss in process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Add 10 parts of absolute ethanol to 100 parts of pure water, slowly add 0.1 part of KH550 coupling agent dropwise, and stir at high speed for 1 hour to prepare a clear aqueous solution. Add 25 parts of silica (D 50 1 μm) and 25 parts of zinc oxide whiskers (2 μm in diameter, 8:1 in length-diameter ratio), stir at high speed for 1 hour to form a uniform mixture, bake the mixture in an oven at 110 °C for 24 hours, crush and sieve to obtain Modified silica and zinc oxide whiskers.

[0033] Add 50 parts of polytetrafluoroethylene powder (D 50 1.5μm) and 10 parts of auxiliary oil, mixed for 0.5h. Add the modified silica and zinc oxide whiskers into the mill in three batches, and mix for 0.5h each time. The dielectric layer is obtained by pressure cold pressing. Finally, copper foil is covered on both sides of the dielectric layer, and the circuit substrate is obtained by pressing with a high temperature press.

Embodiment 2

[0035] Add 10 parts of absolute ethanol to 100 parts of pure water, slowly add 0.1 part of KH550 coupling agent dropwise, and stir at high speed for 1 hour to prepare a clear aqueous solution. Add 20 parts of silica (D 50 1 μm) and 25 parts of alumina whiskers (3 μm in diameter, 10:1 aspect ratio), stir at high speed for 1 hour to form a uniform mixture, bake the mixture in an oven at 110 °C for 24 hours, crush and sieve to obtain Modified silica and alumina whiskers.

[0036] Add 75 parts of polytetrafluoroethylene powder (D 50 2.5μm) and 10 parts of auxiliary oil, mixed for 0.5h. Add the modified silica and alumina whiskers into the mill in 3 times, and mix for 0.5h each time. The dielectric layer is obtained by pressure cold pressing. Finally, copper foil is covered on both sides of the dielectric layer, and the circuit substrate is obtained by pressing with a high temperature press.

Embodiment 3

[0038] Add 10 parts of absolute ethanol to 100 parts of pure water, slowly add 0.1 part of KH550 coupling agent dropwise, and stir at high speed for 1 hour to prepare a clear aqueous solution. Add 15 parts of silica (D50 0.5 μm) and 25 parts of boron nitride whiskers (3 μm in diameter, 15:1 in length-diameter ratio), stir at high speed for 1 hour to form a uniform mixture, bake the mixture in a 110°C oven for 24 hours, crush and pass through Sieve to obtain modified silica and boron nitride whiskers.

[0039] Add 80 parts of polytetrafluoroethylene powder (D 50 2 μm) and 10 parts of auxiliary oil, mixed for 0.5h. Add the modified silica and boron nitride whiskers into the mill in 3 times, and mix for 0.5h each time. pressure cold pressing to obtain the dielectric layer. Finally, copper foil is covered on both sides of the dielectric layer, and the circuit substrate is obtained by pressing with a high temperature press.

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Abstract

The invention relates to a circuit substrate, comprising a dielectric layer and a conductive layer disposed on at least one surface of the dielectric layer, wherein the material of the dielectric layer is a composition, including mixed fillers and fluorine-containing resin powder , the mixed filler includes a dielectric filler and whiskers, the mixed filler is modified by a coupling agent, the dielectric layer has a dielectric constant of 3.0-3.2 at 10 GHz, and the range of the dielectric constant is small equal to 0.04, the dielectric loss of the dielectric layer is less than or equal to 0.002, and the thermal conductivity is greater than or equal to 1 W / m·K. Therefore, the circuit substrate of the present invention has stable dielectric constant and ultra-low dielectric loss at the millimeter wave frequency, and also has good thermal conductivity and heat dissipation performance.

Description

technical field [0001] The present invention relates to the technical field of the electronic industry, in particular to a circuit substrate. Background technique [0002] At mmWave frequencies, even a small change in the dielectric constant (Dk) of a circuit substrate can cause changes in electrical properties, such as signal delay and transmission line phase differences. Therefore, millimeter-wave circuits have special requirements for the performance of high-frequency circuit substrates, and need to achieve stable dielectric constant and ultra-low loss. At the same time, with the development of printed circuit boards (PCBs) in the direction of high integration, high density, miniaturization and thinning, the heat flux density per unit area increases sharply. Stability, reliability and other properties must be managed to dissipate the heat generated in time, which requires the circuit substrate to have high thermal conductivity and heat dissipation performance. [0003] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L27/18C08K9/06C08K3/36C08K7/08C08K7/04H05K1/03
CPCC08K9/06C08K3/36C08K7/08C08K7/04H05K1/0373C08K2201/003C08K2201/016C08L27/18
Inventor 何亮董辉任英杰卢悦群吴业文何双竺永吉
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD