Polyimide film and flexible display device cover substrate by using same

A technology of polyimide film and flexible display device, which is applied in the field of covering substrate of flexible display device, can solve the problem that infrared heating process cannot be used, and achieve the effects of improving yellowish phenomenon, increasing production rate and shortening baking time.

Active Publication Date: 2020-10-13
MICROCOSM TECH
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the introduction of fluorine-containing functional groups and alicyclic structures for transparency prevents polyimide from absorbing in the infrared region, making it impossible to use infrared heating processes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide film and flexible display device cover substrate by using same
  • Polyimide film and flexible display device cover substrate by using same
  • Polyimide film and flexible display device cover substrate by using same

Examples

Experimental program
Comparison scheme
Effect test

experiment example

[0059] In order to prove that the polyimide film of the present invention has good performance, the following experiment example is specially made.

[0060] Prepare polyimide solution

Synthetic example 1

[0062] 8.97g (0.028mole) of 2,2'-bis(trifluoromethyl)benzidine (TFMB), 2.40g (0.012mole) of 4,4'-diaminodiphenyl ether (ODA) and 100g of Dimethylacetamide (DMAc) was placed in a three-necked flask. After stirring at 30°C until completely dissolved, add 8.8g (0.02mole) of 2,2'-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 5.88g (0.02mole) The biphenyltetracarboxylic dianhydride (BPDA) was continuously stirred and reacted at 25° C. for 24 hours to obtain a polyamic acid solution. Thereafter, 7.46 g (0.06 mole) of pyridine and 12.252 g (0.12 mole) of acetic anhydride were added, followed by continuous stirring and reaction at room temperature for 24 hours. After the reaction, polyimide was precipitated with methanol / water (volume ratio 1:2), and the powder was collected by filtration and dried to obtain polyimide powder. Finally, the powder was dissolved in dimethylacetamide solvent to form a 20 wt% polyimide solution.

[0063] Preparation of polyimide film...

Embodiment 1

[0065] Get 100 grams of polyimide solution of synthesis example 1 and add 0.86 gram of cesium tungsten oxide CsWO 3 (particle size 50nm, dispersed in dimethylacetamide, concentration 5wt%), after stirring and mixing for 30 minutes, apply a doctor blade on a glass substrate and place it in an oven for surface drying. The surface drying temperature is 100°C. Then, the polyimide film is obtained by heating and baking at an infrared wavelength of 800 nm to 3000 nm for 10 minutes under a nitrogen atmosphere.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
thicknessaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to view more

Abstract

A polyimide film and a flexible display device cover substrate by using same, wherein the polyimide film including polyimide and a blue infrared absorber; the blue infrared absorber including cesium tungsten oxide, tungsten oxide, prussian blue or tin antimony oxide. The blue infrared absorbent has the effects of infrared absorption and photothermal conversion, so that the surface temperature of the polyimide resin can be increased through infrared irradiation, and the baking time is shortened.

Description

【Technical field】 [0001] The present invention relates to a polyimide film and a flexible display device cover substrate using the same, and in particular to a polyimide film containing a blue infrared absorber and a flexible display device cover using the same substrate. 【Background technique】 [0002] With the development of displays, thinning, lightening, and even flexing are the current development directions of displays. How to make glass substrates thinner, lighter, or even replace glass substrates with plastic substrates is an important direction for the industry to consider. [0003] Polyimide polymer is a plastic material with thermal stability, high mechanical strength and chemical resistance. However, due to the molecular structure, it is easy to cause intra-molecular and inter-molecular charge transfer, resulting in a yellow color of the polyimide film, which limits its application. In order to reduce the phenomenon of charge transfer, linkage groups can genera...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/22C08K3/28C08J5/18G09F9/30
CPCC08J5/18G09F9/301C08J2379/08C08K2003/2258C08K3/28C08K2201/005
Inventor 赖柏宏颜智德黄堂杰
Owner MICROCOSM TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap