Epoxy resin micro-nano blended composite material for packaging power electronic high-power device and preparation method thereof

A high-power device, epoxy resin technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of increasing the interface and limiting the conductivity of composite materials, so as to achieve thermal conductivity, promote heat conduction network, and promote Dispersion effect

Active Publication Date: 2020-10-16
ZHEJIANG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the incorporation of nanoparticles increases the interface between the filler and the matrix, limiting the electrical conductivity of the composite

Method used

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  • Epoxy resin micro-nano blended composite material for packaging power electronic high-power device and preparation method thereof
  • Epoxy resin micro-nano blended composite material for packaging power electronic high-power device and preparation method thereof
  • Epoxy resin micro-nano blended composite material for packaging power electronic high-power device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] An epoxy resin micro-nano blend composite material for encapsulation of power electronic high-power devices, according to the parts by mass, the preparation method is as follows:

[0037] 1 Put 45.5 parts of micron aluminum nitride in a vacuum oven at 130°C for drying, put absolute ethanol and distilled water in 34.2 parts: 11.4 parts into a beaker and mechanically stir for 1 minute, then dry the dried micronano aluminum nitride Hydration reaction occurs at 40°C in the ethanol aqueous solution of Granule Road;

[0038] 2 Add 3 parts of silane coupling agent KH560 to the solution, oscillate ultrasonically for 30 minutes, then use a centrifuge to separate the micro-nano aluminum nitride from the solution, put it in a vacuum oven at 130°C for 2 hours, grind and dry to obtain the modified Micronano aluminum nitride particles;

[0039] 3 Put the micro-nano aluminum nitride into 100 parts of epoxy resin, ultrasonically disperse the mixed solution at 40°C for 1 hour, and let ...

Embodiment 2

[0043] An epoxy resin micro-nano blend composite material for encapsulation of power electronic high-power devices, according to the parts by mass, the preparation method is as follows:

[0044] 1 Put micron aluminum nitride and nano aluminum nitride particles in 46 parts: 2.3 parts into a vacuum drying oven at 130°C for drying, and put anhydrous ethanol and distilled water in a beaker according to 36.3 parts: 12.1 parts and mechanically stir for 1 minute, Then, the dried micronano-aluminum nitride particles are hydrated at 40°C in an aqueous ethanol solution;

[0045] 2 Add 3.1 parts of silane coupling agent KH560 to the solution, oscillate ultrasonically for 30 minutes, then use a centrifuge to separate the micro-nano aluminum nitride from the solution, put it in a vacuum oven at 130°C for 2 hours, grind and dry to obtain the modified Micronano aluminum nitride particles;

[0046] 3 Put the micro-nano aluminum nitride into 100 parts of epoxy resin, ultrasonically disperse t...

Embodiment 3

[0050] An epoxy resin micro-nano blend composite material for encapsulation of power electronic high-power devices, according to the parts by mass, the preparation method is as follows:

[0051] 1 Put the micron aluminum nitride and nano aluminum nitride particles in 47.5 parts: 7.1 parts in a vacuum drying oven at 130°C for drying, and put anhydrous ethanol and distilled water in a beaker according to 42 parts: 13 parts and mechanically stir for 1 minute, Then, the dried micronano-aluminum nitride particles are hydrated at 40°C in an aqueous ethanol solution;

[0052] 2 Add 3.5 parts of silane coupling agent KH560 to the solution, oscillate ultrasonically for 30 minutes, then use a centrifuge to separate the micro-nano aluminum nitride from the solution, put it in a vacuum oven at 130°C for 2 hours, grind and dry to obtain the modified Micronano aluminum nitride particles;

[0053] 3 Put the micro-nano aluminum nitride into 100 parts of epoxy resin, ultrasonically disperse t...

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Abstract

The invention discloses an epoxy resin micro-nano blended composite material for packaging a power electronic high-power device and a preparation method thereof, and belongs to the crossing field of high voltage and insulation technologies and composite materials. In the process of preparing the composite material, firstly, nano aluminum nitride, whose surface is modified by a silane coupling agent, is prepared and is served as a heat conduction filler, nano aluminum nitride is evenly dispersed in epoxy resin through ultrasonic waves, and the micro-nano blended composite material is prepared through the processes of vacuum degassing, perfusion molding and the like. The micro-nano blended composite material has excellent thermal conductivity and electrical insulation performance, and can beused as a power electronic high-power device packaging material. The preparation method of the micro-nano blended composite material is simple, easy to operate, low in cost and suitable for industrial production.

Description

technical field [0001] The invention belongs to the intersecting field of high voltage and insulation technology and composite materials, in particular to an epoxy resin micro-nano blended composite material for power electronic high-power device packaging and a preparation method. Background technique [0002] With the development of new energy in the 21st century, the demand for global energy interconnection and the ubiquitous power Internet of Things, power electronics has gradually developed from the first generation of controllable rectifiers (SCRs), through the second generation of bipolar junction transistors (BJTs). ), turn-off transistors (GTO), semiconductor field-effect transistors (MOSFET), third-generation insulated gate bipolar transistors (IGBT) to fourth-generation intelligent integrated circuits and intelligent power module power electronic devices. In just 50 years, power electronics technology has developed by leaps and bounds. The performance of power ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/06C08K3/28C08K9/06C08K9/04C08K9/02H01L23/29
CPCC08K3/28C08K9/02C08K9/04C08K9/06C08K13/06C08K2003/282C08K2201/003C08K2201/011C08L2203/206H01L23/29H01L23/295C08L63/00
Inventor 陈向荣戴超孟繁博江铁刘斌
Owner ZHEJIANG UNIV
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