Micro thermal array based on heterogeneous driving unit and preparation method thereof

Abstract

The invention discloses a micro thermal array based on a heterogeneous driving unit and a preparation method thereof. The micro thermal array based on the heterogeneous driving unit comprises a substrate, a plurality of micro-actuators arranged in an array mode are arranged on the substrate, each micro-actuator comprises a thin-film resistance heater and a heat conduction silicon column which arearranged on the surface of the substrate, a polymer driving structure layer is arranged on the surface of each thin-film resistance heater, and each heat conduction silicon column is embedded in the corresponding polymer driving structure layer. According to the invention, the internal thermal field distribution uniformity and transmission speed can be improved, the thermal driving efficiency is effectively improved, the uniformity of temperature field distribution in the polymer can be remarkably improved, the advantage of large thermal expansion coefficient of the polymer is fully played, the driving efficiency is improved to the maximum extent, the tail end response displacement of the driving structure is improved, and accurate regulation / correction of machining errors or out-of-planedeformation of a typical micro electro mechanical system structure (such as a thin plate) can be realized.

Description

technical field [0001] The invention relates to the technical field of micro-electromechanical systems, in particular to a micro thermal array based on a heterogeneous drive unit and a preparation method thereof. Background technique [0002] Commonly used active control technologies for microelectromechanical systems (MEMS) devices include electrostatic drive, piezoelectric drive, and thermal drive. Electrostatic control technology can control the deformation of MEMS devices, but its application is restricted due to electrostatic attraction and dynamic adjustment range limitations. Piezoelectric drive is a very common driving method, but the large working voltage becomes the bottleneck of the application. Relatively speaking, the thermal drive method has the characteristics of large static displacement, strong driving force, and easy integration. [0003] At present, the common method is to adjust the displacement of the flat plate structure by arranging micro-actuators o...

AI Technical Summary

Problems solved by technology

Therefore, when the polymer of epoxy resin glue with a large expansion coefficient is selected as the driving material, although it has significant advantages such as low driving voltage and large driving displacement, the problems of slow thermal conductivity and uneven temperature field distribution limit its further application.

Especially when the size of the polymer drive unit is large, the heat is conducted from the end of the heat source to the end of the actuator. Due to reasons such as low thermal conductivity or large heat capacity, the thermal response time is relatively long, and the driving effect cannot be fully exerted and the heat at the end of the actuator. The displacement is small, and it takes a long time to reach a steady state, so this will greatly affect the driving effect of the design

Images