Preparation method of copper-aluminum layered composite material capable of effectively controlling interface reaction

A layered composite material and interface control technology, applied in the direction of metal layered products, chemical instruments and methods, lamination, etc., can solve the problem that the uniformity of product performance is difficult to be guaranteed, affect the thermal conductivity and electrical conductivity of materials, and the rolling and compounding process Complicated problems, to achieve the integrated design of structure and function, improve the combination of interface reactions, and ensure the effect of thermal conductivity and electrical conductivity

Active Publication Date: 2020-10-23
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rolling composite process is complex and the uniformity of product performance is difficult to guarantee; explosive welding is more serious to environmental pollution, and there are relatively large safety hazards; surface deposition is formed by diffusion deposition in the form of atomic or molecular scale, which is slow in preparation and expensive. High, generally not suitable for the manufacture of large str

Method used

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  • Preparation method of copper-aluminum layered composite material capable of effectively controlling interface reaction
  • Preparation method of copper-aluminum layered composite material capable of effectively controlling interface reaction

Examples

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Example Embodiment

[0026] Example 1

[0027] This embodiment includes the following steps:

[0028] Step 1. Place the Al foil with a size of 50mm×50mm×0.1mm (length×width×thickness) in a NaOH solution with a mass concentration of 5% for cleaning for 5 seconds, and dry it after neutralization to complete the surface pretreatment, and then carry out GO / Al foil is obtained by electrophoretic deposition of graphene oxide, and then placed in a vacuum drying oven for drying treatment; the electrophoretic deposition solution used in the electrophoretic deposition contains GO and Al(NO 3 ) 3 C 2 h 5 OH solution, the content of GO in the electrophoretic deposition solution is 0.75g / L, Al(NO 3 ) 3 content of 0.25g / L, the voltage used for electrophoretic deposition is 120V, and the time of electrophoretic deposition is 20s;

[0029] Step 2. Place the Cu foil with a size of 50mm×50mm×0.04mm (length×width×thickness) in an HCl solution with a mass concentration of 5% for cleaning for 5 seconds, and dry ...

Example Embodiment

[0041] Example 2

[0042] This embodiment includes the following steps:

[0043] Step 1. Place the Al foil with a size of 50mm×50mm×0.1mm (length×width×thickness) in a NaOH solution with a mass concentration of 5% for 10 seconds, and then dry it after neutralization to complete the surface pretreatment, and then carry out GO / Al foil is obtained by electrophoretic deposition of graphene oxide, and then placed in a vacuum drying oven for drying treatment; the electrophoretic deposition solution used in the electrophoretic deposition contains GO and Al(NO 3 ) 3 C 2 h 5 OH solution, the content of GO in the electrophoretic deposition solution is 1.25g / L, Al(NO 3 ) 3 The content is 0.5g / L, the voltage used for electrophoretic deposition is 100V, and the electrophoretic deposition time is 60s;

[0044] Step 2: Place the Cu foil with a size of 50mm×50mm×0.1mm (length×width×thickness) in an HCl solution with a mass concentration of 5% for 10 seconds, and then dry it after neutra...

Example Embodiment

[0047] Example 3

[0048] This embodiment includes the following steps:

[0049] Step 1. Place the Al foil with a size of 50mm×50mm×0.1mm (length×width×thickness) in a NaOH solution with a mass concentration of 5% for 7 seconds, and then dry it after neutralization treatment to complete the surface pretreatment, and then carry out GO / Al foil is obtained by electrophoretic deposition of graphene oxide, and then placed in a vacuum drying oven for drying treatment; the electrophoretic deposition solution used in the electrophoretic deposition contains GO and Al(NO 3 ) 3 C 2 h 5 OH solution, the content of GO in the electrophoretic deposition solution is 0.5g / L, Al(NO 3 ) 3 content of 0.125g / L, the voltage used for electrophoretic deposition is 150V, and the time of electrophoretic deposition is 10s;

[0050] Step 2. Place the Cu foil with a size of 50mm×50mm×0.04mm (length×width×thickness) in an HCl solution with a mass concentration of 5% for cleaning for 7 seconds, and dr...

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Abstract

The invention discloses a preparation method of a copper-aluminum layered composite material capable of effectively controlling interface reaction. The method comprises the following steps: 1, preparing GO/Al foil; 2, sequentially and alternately placing the dried GO/Al foil and the Cu foil subjected to surface pretreatment in an overlapped mode in the direction of a tiled layer, and obtaining a Cu-GO/Al prefabricated body; 3, pressurizing the Cu-GO/Al prefabricated body, then heating, and carrying out heat preservation and pressure maintaining; and 4, cooling and decompressing to obtain the copper-aluminum layered composite material. The preparation method comprises the following steps: stacking GO/Al foil with GO deposited on the surface and Cu foil, and then heating and pressurizing forpressing; the GO between the Cu foil and the Al foil is used for preventing Cu and Al from reacting at the interface to form an intermetallic compound; the Cu-Al interface reaction combination condition in the copper-aluminum layered composite material is improved, meanwhile, the heat conduction performance and the electric conduction performance of the copper-aluminum layered composite materialare guaranteed, and the structural function integrated design of the copper-aluminum layered composite material is achieved.

Description

technical field [0001] The invention belongs to the technical field of sheet metal preparation of layered metal composite materials, and in particular relates to a method for preparing copper-aluminum layered composite materials that effectively controls interface reactions. Background technique [0002] The reality of scarce resources puts forward higher requirements for modern new materials, that is, to realize the integration of structure and function of materials, especially in the field of energy, this demand is particularly urgent. Cu and its alloys are widely used as thermal and electrical conductive structural parts due to their excellent thermal conductivity, electrical conductivity and mechanical properties. However, Cu itself is relatively insufficient in resources, and its price is relatively high. In addition, Cu has a high density and tends to be heavy as a member. Therefore, it is of great engineering significance to seek substitutes for Cu and its alloys. ...

Claims

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Application Information

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IPC IPC(8): B32B37/06B32B37/10B32B15/01B32B15/20C25D13/02
CPCB32B15/017B32B15/20B32B37/06B32B37/10C25D13/02
Inventor 杜岩雷诚心霍望图樊科社沈春豫吴昊董龙龙张伟
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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