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Modified polyimide precursor resin, photosensitive resin composition and application thereof

A polyimide precursor and photosensitive resin technology, which is applied in the field of photolithography, can solve the problems of improving peel strength and mechanical properties, and achieve the effects of improving bonding reliability, reducing spillage, and reducing outgassing

Pending Publication Date: 2020-10-30
BEIJING ETERNAL MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In the above-mentioned patents, cross-linking agents have been used to increase the molecular weight of the resin and form a network structure to improve its physical properties. However, there are high content of small molecule volatiles, and the thermal stability of the photoresist, peel strength and It is difficult to improve the mechanical properties, and this problem has also become an urgent problem to be solved by those skilled in the art

Method used

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  • Modified polyimide precursor resin, photosensitive resin composition and application thereof
  • Modified polyimide precursor resin, photosensitive resin composition and application thereof
  • Modified polyimide precursor resin, photosensitive resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0082] Synthesis of hydroxyl-containing dianhydride monomer 1:

[0083]

[0084] Under the protection of nitrogen, 21.6g (0.1mol) of 3.3'-dihydroxybenzidine was dissolved in 100g of γ-butyrolactone (solution 1), cooled to -15°C, and then 44.2g of 1, 2,4-Trimellitic anhydride acid chloride was dissolved in 100 g of -butyrolactone, and added dropwise to solution 1, keeping the reaction temperature below -5°C. After the dropwise addition, the reaction was continued for 4 hours.

[0085] After concentrating the reaction product with a rotary evaporator, the concentrate was poured into 1 L of toluene to obtain a hydroxyl-containing dianhydride monomer 1 .

[0086] Structural characterization: method: Fourier transform infrared spectroscopy, characteristic peak: 1850cm -1 The characteristic peak of acid anhydride group is at 3400cm -1 The characteristic peak of -OH is at 1650cm -1 is the characteristic peak of the amide group.

preparation example 2

[0088] Synthesis of hydroxyl-containing dianhydride monomer 2:

[0089]

[0090] The difference from Preparation Example 1 is that 3,3'-dihydroxybenzidine is replaced by 5,5'-(1,4-phenylene bis(oxo))bis(2-aminophenol ), to obtain the hydroxyl-containing dianhydride monomer 2.

[0091] Structural characterization: method: Fourier transform infrared spectroscopy, characteristic peak: 1850cm -1 The characteristic peak of acid anhydride group is at 3400cm -1 The characteristic peak of -OH is at 1650cm -1 is the characteristic peak of the amide group.

preparation example 3

[0093] Synthesis of hydroxyl-containing dianhydride monomer 3:

[0094]

[0095] Synthesis method: The difference from Preparation Example 1 is that 3,3'-dihydroxybenzidine is replaced by 5,5'-(1,4-phenylene bis(oxo))bis(2 -aminobenzene-1,3-diphenol) to obtain the hydroxyl-containing dianhydride monomer 3.

[0096] Structural characterization: method: Fourier transform infrared spectroscopy, characteristic peak: 1850cm -1 The characteristic peak of acid anhydride group is at 3400cm -1 The characteristic peak of -OH is at 1650cm -1 is the characteristic peak of the amide group.

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Abstract

The invention discloses modified polyimide precursor resin, a photosensitive resin composition and application thereof. The modified polyimide precursor resin comprises at least one structural unit Aand at least one structural unit B, optionally, the modified polyimide precursor resin further comprises at least one structural unit C; the photosensitive resin composition is prepared from the following components in percentage by mass: 4wt.% to 30wt.% of modified polyimide precursor resin, 0.4 wt.% to 8wt.% of diazonaphthoquinone sulfonate, 0.01 wt.% to 0.5 wt.% of auxiliary agents and 61.5 wt.% to 95wt.% of solvents, the photosensitive resin composition is used for an OLED display panel. The polyimide precursor can greatly improve the chemical resistance, stripping resistance, thermal stability, mechanical strength and other properties of the photoresist, and can effectively reduce film layer gas overflow and reduce the coefficient of thermal expansion.

Description

technical field [0001] The invention relates to the technical field of photolithography, in particular to a modified polyimide precursor resin, a photosensitive resin composition and applications thereof. Background technique [0002] Polyimide materials have good thermal stability, mechanical properties, electrical properties, and chemical corrosion resistance, and are often used in photosensitive compositions. In a typical process, the photoresist film is usually formed by spin coating or slit coating. In order to obtain good coating properties, such as suitable film thickness and no bubbles, etc., the photoresist combination Generally, the viscosity of the product should not be too high. Therefore, the resin in the composition usually has a low molecular weight, and in the subsequent process, the crosslinking reaction is carried out by means of heat, radiation, etc., to increase its molecular weight and form a network structure, so as to Improve its physical performance ...

Claims

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Application Information

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IPC IPC(8): C08G73/10G03F7/004
CPCC08G73/1042C08G73/1067C08G73/1064C08G73/106C08G73/1075C08G73/1082G03F7/004
Inventor 韩红彦王晓伟刘永祥王旭李青松
Owner BEIJING ETERNAL MATERIAL TECH
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