Browning method for improving interlayer bonding force of printed circuit board
A printing circuit and bonding force technology, which is applied in the field of browning to improve the bonding force between layers of printed circuit boards, and can solve problems such as air bubbles and low bonding force between layers
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0033] This embodiment provides a browning method for improving the bonding force between layers of printed circuit boards, comprising the following steps:
[0034] S1: Cleaning: Soak the copper foil in cleaning solution Ⅰ at room temperature for 3 minutes, then add cleaning solution Ⅱ, the mass ratio of cleaning solution Ⅰ to cleaning solution Ⅱ is 1:2, continue to soak at room temperature for 3 minutes, and then place in hydrogen peroxide and Soak in ethanol at room temperature for 2 minutes, then blow dry with nitrogen;
[0035] S2: Pre-soaking: Put the cleaned copper foil in the pre-soaking solution, ultrasonically vibrate for 3 minutes, and the frequency is 40KHZ;
[0036] S3: browning: browning the pre-impregnated copper foil in a browning tank containing browning solution;
[0037] S4: Washing with water: place the browned copper foil in deionized water, wash with water, and blow dry with nitrogen.
[0038] The cleaning solution I is made of the following components i...
Embodiment 2
[0042] This embodiment provides a browning method for improving the bonding force between layers of printed circuit boards, comprising the following steps:
[0043] S1: Cleaning: Soak copper foil in cleaning solution Ⅰ at room temperature for 4 minutes, then add cleaning solution Ⅱ, the mass ratio of cleaning solution Ⅰ to cleaning solution Ⅱ is 1:2, continue to soak at room temperature for 4 minutes, and then place in hydrogen peroxide and Soak in ethanol at room temperature for 3 minutes, then blow dry with nitrogen;
[0044] S2: Pre-soaking: Put the cleaned copper foil in the pre-soaking solution, ultrasonically vibrate for 4 minutes, and the frequency is 40KHZ;
[0045] S3: browning: browning the pre-impregnated copper foil in a browning tank containing browning solution;
[0046] S4: Washing with water: place the browned copper foil in deionized water, wash with water, and blow dry with nitrogen.
[0047] The cleaning solution I is made of the following components in pa...
Embodiment 3
[0051] This embodiment provides a browning method for improving the bonding force between layers of printed circuit boards, comprising the following steps:
[0052] S1: Cleaning: Soak the copper foil in cleaning solution Ⅰ at room temperature for 5 minutes, then add cleaning solution Ⅱ, the mass ratio of cleaning solution Ⅰ to cleaning solution Ⅱ is 1:2, continue to soak at room temperature for 5 minutes, and then place it in hydrogen peroxide and Soak in ethanol at room temperature for 3 minutes, then blow dry with nitrogen;
[0053] S2: Pre-soaking: Put the cleaned copper foil in the pre-soaking solution, ultrasonically vibrate for 3 minutes, and the frequency is 40KHZ;
[0054] S3: browning: browning the pre-impregnated copper foil in a browning tank containing browning solution;
[0055] S4: Washing with water: place the browned copper foil in deionized water, wash with water, and blow dry with nitrogen.
[0056] The cleaning solution I is made of the following component...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Peel strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com