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Polyimide modified epoxy resin composite conductive adhesive and preparation method thereof

A composite conductive and epoxy resin technology, applied in the direction of epoxy resin glue, conductive adhesive, adhesive, etc., can solve the problems of high water absorption, low mechanical strength, poor high temperature resistance, etc., to improve flexibility, Excellent overall performance and enhanced flexibility

Inactive Publication Date: 2020-11-03
NORTH & SOUTH BROTHER PHARMACY INVESTMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve at least one of the problems of low mechanical strength, poor high temperature resistance and high water absorption of existing epoxy conductive adhesives. For this reason, the present invention combines long side chain diamine, hydroxyl diamine with Alicyclic dianhydride polycondensation has obtained a new type of soluble active polyimide, because the polyimide has excellent solubility, so the polyimide can be dissolved in a high amount of epoxy resin conductive adhesive, used After modifying the epoxy resin, a composite conductive adhesive with excellent comprehensive performance can be obtained

Method used

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  • Polyimide modified epoxy resin composite conductive adhesive and preparation method thereof
  • Polyimide modified epoxy resin composite conductive adhesive and preparation method thereof
  • Polyimide modified epoxy resin composite conductive adhesive and preparation method thereof

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preparation example Construction

[0031] The preparation method of the composite conductive agent will be described in detail below.

[0032] The operation of each step will be described in detail below.

[0033] (1) Soluble active polyimide

[0034] In the present invention, the preparation of the soluble reactive polyimide can be carried out by methods known in the art, preferably a two-step method.

[0035] According to some embodiments of the present invention, the preparation of the solvent-reactive polyimide can be carried out according to the method described in CN1927908A.

[0036] The solvent-reactive polyimide is obtained by chemical dehydration using a two-step process.

[0037] Specifically, the preparation of the soluble active polyimide includes:

[0038] After reacting long side chain diamine, hydroxyl diamine and alicyclic dianhydride in a strong polar aprotic organic solvent under nitrogen protection at 0°C-30°C for 3-12 hours, transparent and viscous polyhydroxyl Amic acid solution, where...

Embodiment approach

[0042] According to some embodiments of the present invention, the long side chain diamine monomer is 5-(4-(dodecyloxy)phenoxy)benzene-1,3-diamine (DPBDA), the structure of which is :

[0043]

[0044] According to some embodiments of the present invention, the hydroxydiamine is 4,6-diamino-1,3-resorcinol (DADHB), 2,2-bis(3-amino-4-hydroxyl-1,1 , 13,3,3-hexafluoropropane (BAHPFP), 2,2-bis(3-amino-4-hydroxyphenyl)propane (BAHPP), 3,3'-diamine-4,4-dihydroxydi Phenyl ether (DAHDPE), 3,3'-diamino-4,4-dihydroxydiphenyl sulfide (DAHDPS), 3,3'-diamino-4,4-dihydroxybiphenyl (DAOHBP), 3, At least one of 3'-diamino-4,4-dihydroxydiphenylmethane (DAHDPM) and 3,3'-diamino-4,4-dihydroxydiphenylsulfone (DAHDPS).

[0045] In some embodiments, the hydroxydiamine is 4,6-diamino-1,3-resorcinol, 2,2-bis(3-amino-4-hydroxyl-1,1,13,3, 3-hexafluoropropane, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3'-diamino-4,4-dihydroxydiphenyl ether, 3,3'-diamino- 4,4-dihydroxydiphenylsulfide, 3,3'-diamino...

Embodiment 1-9

[0085] According to the amount of each component in Table 3, in terms of mass percentage, bisphenol A type epoxy resin, alicyclic epoxy resin 3,4-epoxycyclohexylcarboxylate-3',4'-epoxy Cyclohexyl methyl ester and soluble agent active polyimide are added into the organic solvent, stirred and dissolved at 50°C, then added with amine curing agent and accelerator and stirred and mixed, finally added coupling agent and conductive filler, continued to stir and mix evenly, and obtained Composite conductive adhesive.

[0086] table 3

[0087]

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Abstract

The invention discloses a composite conductive adhesive and a preparation method thereof. Specifically, the invention provides a composite conductive adhesive prepared by modifying an epoxy resin adhesive with soluble active polyimide. The soluble active polyimide is obtained by polycondensation of long side chain diamine, hydroxyl diamine and alicyclic dianhydride, and the long side chain diamineis 5-(4-(dodecyloxy)phenoxy)benzene-1,3-diamine. The alicyclic dianhydride and the long side chain diamine can endow polyimide with excellent dissolving performance, so that the polyimide can be dissolved in the epoxy resin conductive adhesive with high content, and the composite conductive adhesive obtained by modification has low water absorption, high shear strength, low volume resistivity andexcellent comprehensive performance.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a composite conductive adhesive of polyimide modified epoxy resin and a preparation method thereof. Background technique [0002] With the miniaturization of electronic devices and the high density of printed circuit boards, the use of conductive adhesives is becoming wider and wider. Compared with tin-lead solder, the superiority of conductive adhesives is manifested in the following aspects: (1) Lead-free and environmentally friendly; (2) lower curing temperature, suitable for heat-sensitive materials and non-solderable materials; (3) can provide finer pitch capabilities; (4) can be widely used in high density and miniaturization (5) Good maintainability. For thermoplastic conductive adhesives, components can be easily replaced after re-local heating; for thermosetting conductive adhesives; Realize component replacement. Therefore, the application of conductive a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J179/08C09J9/02C09J11/08C08G73/10
CPCC08G73/1039C08G73/1042C08G73/1078C08K2003/0806C08K2201/001C08L2201/08C08L2205/025C08L2205/03C08L2205/05C09J9/02C09J11/08C09J163/00C08L63/00C08L79/08C08K3/08C08K5/5435
Inventor 覃鹏玉
Owner NORTH & SOUTH BROTHER PHARMACY INVESTMENT CO LTD
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