Method for recovering precious metal from brazing precious metal residual targets
A precious metal and residual target technology, applied in the direction of improving process efficiency, can solve problems such as non-recycling and waste, and achieve the effects of preventing corrosion of the target material, increasing the reaction rate, and low energy consumption
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Embodiment 1
[0025] Take the XL Quantum high-purity gold target for Varian machine as an example: the purity of the high-purity gold target surface is 99.996% (>4N), the finished product weight is 4207.034g, the sputtering consumption after use is 841.407g, and the theoretical remaining weight of the target surface is 3365.627g; figure 1 Described schematic flow sheet, carry out noble metal recovery process:
[0026] S1) Heat the indium solder XL Quantum high-purity gold residual target at 210°C to melt the indium solder and separate the high-purity gold target surface from the back plate;
[0027] S2) Immerse the high-purity gold target surface in a nitric acid solution with a volume fraction of 50% and a temperature of 60°C for 60 s and twice for 60 s. After each acid immersion, wipe the welding surface with a dust-free cloth to remove the indium solder from the high-purity gold Target separation;
[0028] S3) Rinse the precious metal target surface in tap water first, then rinse in abs...
Embodiment 2
[0031] Take XL Quantum high-purity silver target for Varian machine as an example: high-purity silver target surface purity 99.994% (>4N) finished product weight 6863.465g, sputtering consumption after use 1372.693g, target surface theoretical residual weight 5490.772g;
[0032] S1) Heat the indium soldering XL Quantum high-purity silver residual target at 210°C to melt the indium solder and separate the high-purity silver target surface from the back plate;
[0033] S2) Immerse the high-purity silver target surface in a sulfuric acid solution with a volume fraction of 35% and a temperature of 45°C for 10 seconds and 3 times of acid leaching. After each acid immersion, wipe the welding surface with a dust-free cloth to remove the indium solder from the high-purity silver Target separation;
[0034] S3) Rinse the high-purity silver target surface in tap water first, then rinse it in absolute ethanol and then blow it dry to obtain high-purity silver without impurities, and the p...
Embodiment 3
[0037] Take the XL Quantum high-purity platinum target for Varian as an example: the purity of the high-purity platinum target surface is 99.998% (>4N), the weight of the finished product is 4417.978g, the weight consumed by sputtering after use is 883.596g, and the theoretical residual weight of the target surface is 3534.382g;
[0038] S1) Heat the indium soldering XL Quantum high-purity platinum residual target at 210°C to melt the indium solder and separate the high-purity platinum target surface from the back plate;
[0039] S2) Immerse the high-purity platinum target surface in a nitric acid solution with a volume fraction of 50% and a temperature of 65°C for 60 seconds, once for 60 seconds, and wipe the welding surface with a dust-free cloth after acid leaching to prevent indium solder from high Pure platinum target surface separation;
[0040] S3) Rinse the high-purity platinum target surface in tap water first, then rinse it in absolute ethanol and then dry it to obta...
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