High thermal conductivity epoxy composite material and its preparation method and application

A composite material and high thermal conductivity technology, which is applied in the direction of epoxy resin glue, non-polymer adhesive additives, adhesive types, etc., can solve the problems of reducing the service life of the device, greatly affecting the effect, and poor thermal conductivity, etc., to achieve Reduced potting viscosity, excellent thermal conductivity, and stable electrical insulation performance

Active Publication Date: 2022-04-12
SUZHOU JUFENG ELECTRICAL INSULATION SYST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The biggest defect in the application of epoxy potting glue is poor thermal conductivity and high viscosity, which reduces the service life of the device. In order to meet the market demand, it is necessary to modify the traditional epoxy potting glue. The modified inorganic micro-nano thermal conductive filler can improve the thermal conductivity of the composite material and ensure its electrical insulation performance
At present, the main way to improve the thermal conductivity of epoxy resin is to add high thermal conductivity fillers, but the dispersion of thermal conductive fillers and the compatibility with organic interfaces have become the key factors affecting the performance of composite materials.
In order to improve the compatibility, dispersibility and thermal conductivity of the filler in the resin matrix, it is usually necessary to modify the surface of the filler, and the modification method has a great influence on the effect, and improper modification will lead to reverse technical effects.

Method used

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  • High thermal conductivity epoxy composite material and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Soak 1Kg of commercially available boron nitride micro-nano flakes (diameter 50 microns) in hydrogen peroxide (30wt%), the hydrogen peroxide is submerged in boron nitride, filter after 2 hours, wash the filter cake with water for 3 times, and then dry to obtain hydrogen peroxide treated nitrogen Boron oxide; add 1Kg hydrogen peroxide treated boron nitride, 20g silane coupling agent (2wt%, composed of 10g KH560 and 10g KH550) into the disperser, disperse at 1200rpm for 3 minutes, stop for 1 minute, then disperse at 1200rpm for 3 minutes, stop for 1 minute Minutes, and then disperse at 1200rpm for 3 minutes for surface treatment to obtain surface-treated boron nitride particles; used for the following experiments.

Embodiment 2

[0021] The distribution of large: medium: small is 10%: 30%: 60%, the diameter of the large ball is 3mm, the diameter of the medium ball is 1.5mm, and the diameter of the small ball is 0.5mm; the revolution speed is 240r / min.

[0022] The specific preparation method is as follows:

[0023] Using the dry ball milling method, put the same amount of boron nitride micro-nano flakes into the four ball milling tanks of the planetary ball mill, and select the ball ratio as large: medium: small (10%: 30%: 60%). In principle, the materials, balls, and grinding space each occupy 1 / 3, the speed is selected as 240r / min, forward rotation for 30min, reverse rotation for 30min, cooling for 5min, forward rotation for 30min, reverse rotation for 30min, cooling for 5min, forward rotation for 30min, Inverted for 30 minutes, cooled, and dried to obtain micro-nano boron nitride particles with high thermal conductivity.

Embodiment 3

[0025] The distribution of large: medium: small is 10%: 30%: 60%, the diameter of the large ball is 3mm, the diameter of the medium ball is 1.5mm, and the diameter of the small ball is 0.5mm; the revolution speed is 220r / min.

[0026] The specific preparation method is as follows:

[0027] Using the dry ball milling method, put the same amount of boron nitride micro-nano flakes into the four ball milling tanks of the planetary ball mill, and select the ball ratio as large, medium and small (10%: 30%: 60%). In principle, the materials, balls, and grinding space each occupy 1 / 3, the speed is selected as 220r / min, forward rotation for 30min, reverse rotation for 30min, cooling for 5min, forward rotation for 30min, reverse rotation for 30min, cooling for 5min, forward rotation for 30min, Inverted for 30 minutes, cooled, and dried to obtain micro-nano boron nitride particles with high thermal conductivity.

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Abstract

The invention discloses a high thermal conductivity epoxy composite material and its preparation method and application. The high thermal conductivity epoxy composite material is obtained by mixing epoxy resin, curing agent and high thermal conductivity micro-nano boron nitride particles and curing; hydrogen peroxide, The boron nitride powder treated by the coupling agent is put into the planetary ball mill, and the ball distribution and speed are adjusted to ball mill the boron nitride particles, thereby greatly increasing the filling amount of the boron nitride powder in the resin matrix and reducing Glue viscosity. In the present invention, the surface-treated boron nitride particles are ball-milled to obtain high-thermal-conductivity micro-nano boron nitride particles, without other steps, and the ball-milling parameters are limited, so that the obtained high-thermal-conductivity micro-nano boron nitride particles and epoxy resin are prepared as a composite insulating material, In the case of excellent thermal conductivity, the potting viscosity is reduced, especially the adhesive force is improved, which can meet the higher requirements of the rapid development of the market for packaging technology.

Description

technical field [0001] The invention relates to a special surface treatment technology for high thermal conductivity micro-nano fillers, in particular to a ball milling treatment technology for surface modification of high thermal conductivity micro-nano filler boron nitride particles, which can be mixed with epoxy resin to prepare high thermal conductivity composite materials. Insulation Materials. Background technique [0002] Epoxy resins are widely used in electrical equipment insulation and microelectronic equipment packaging due to their corrosion resistance, excellent adhesion, excellent dielectric properties, and processability. The prior art relates to a high thermal conductivity epoxy potting glue for dry-type transformers and a preparation method thereof, with a mass ratio of 100:5~10:5~10:5~10:50~100:1~5:100~160 Bisphenol A diglycidyl ether epoxy resin, epoxy resin REDG-80 containing tert-butyl glycidyl ether, multifunctional glycidylamine epoxy resin, active to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04B02C17/10B02C17/20
CPCC09J163/00C09J11/04B02C17/10B02C17/20C08K2003/385C08K2201/011C08L2203/206C08K9/06C08K9/02C08K3/28
Inventor 田付强刘艳婷夏宇
Owner SUZHOU JUFENG ELECTRICAL INSULATION SYST
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