Porcelain paste of wet process multilayer chip ceramic capacitor and preparation method thereof

A multi-layer chip, wet process technology, applied in the direction of laminated capacitors, capacitors, fixed capacitors, etc., can solve the problems of easy delamination of products, high cost of process equipment, narrow product series, etc. The risk of delamination and cracking, the improvement of shrinkage matching, the effect of less organic solvent content

CN112142480BActive Publication Date: 2022-06-21CHINA ZHENHUA GRP XINYUN ELECTRONICS COMP ANDDEV CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2022-06-21

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Abstract

The invention belongs to the technical field of multilayer chip ceramic capacitors, and in particular relates to a wet-process porcelain slurry of multilayer chip ceramic capacitors and a preparation method thereof; the slurry preparation process has a high degree of automation, high production efficiency, and a particle size of Uniform distribution and less bubbles enhance the dispersion uniformity and stability of the porcelain paste. The porcelain paste has a long storage time, less organic solvent content and low proportion, less pores during debinding, and the dielectric film of the porcelain paste and the inner electrode shrink during sintering. The ratio is relatively small, which improves the shrinkage matching of sintering debinding and reduces the risk of delamination cracking.
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Description

technical field

[0001] The invention belongs to the technical field of multilayer chip ceramic capacitors, in particular to a ceramic paste for a wet process multilayer chip ceramic capacitor and a preparation method thereof. Background technique

[0002] With the rapid development of some special fields in China, such as electromagnetic pulse weapons, electromagnetic rail guns, oil exploration and other fields. Multilayer chip ceramic capacitors are referred to as chip capacitors. The conventional manufacturing process is to stack the ceramic dielectric diaphragms with printed electrodes (inner electrodes) in a dislocation manner, and form a ceramic chip after one-time high-temperature sintering. Metal layers (external electrodes) are sealed on both ends of the filament to form a monolith-like structure. This process is referred to as dry process. The process equipment cost of this process is relatively high (especially for highly integrated automatic intelligent equipment)...

Examples

Embodiment 1

[0020] 1. The composition of the ceramic paste of the multi-layer chip ceramic capacitor is calculated as: 85% of the ceramic powder, 1.5% of the organic additive, and 13.5% of the organic solvent.

[0021] Further, the organic additive is composed of a dispersant and a binder in a mass ratio of 3:2; wherein, the dispersant is formed by mixing phosphate ester and ethyl cellulose type A in a mass ratio of 6:4; The binder is composed of ethyl cellulose type B, ethyl cellulose type C, ethyl cellulose type D and polyvinyl butyral in a mass ratio of 1:1:1:4.

[0022] Further, the organic solvent is composed of solvent A type and solvent B type in a mass ratio of 1:1; wherein, solvent A type is formed by mixing terpinolene and cineol in a mass ratio of 1:5 ; Solvent B is made by mixing terpinolene and α-terpineol in a mass ratio of 1:6.

[0023] 2. A method for preparing a ceramic paste for a multilayer chip ceramic capacitor, comprising the following steps:

[0024] (1) Pre-dispe...

Embodiment 2

[0032] 1. The composition of the ceramic paste of the multi-layer chip ceramic capacitor is calculated as: 80% of ceramic powder, 2% of organic additives, and 18% of organic solvent.

[0033] Further, the organic additive is composed of a dispersant and a binder in a mass ratio of 3:2; wherein, the dispersant is formed by mixing phosphate ester and ethyl cellulose type A in a mass ratio of 6:4; The binder is composed of ethyl cellulose type B, ethyl cellulose type C, ethyl cellulose type D and polyvinyl butyral in a mass ratio of 1:1:1:4.

[0034] Further, the organic solvent is composed of solvent A type and solvent B type in a mass ratio of 1:1; wherein, solvent A type is formed by mixing terpinolene and cineol in a mass ratio of 1:5 ; Solvent B is made by mixing terpinolene and α-terpineol in a mass ratio of 1:6.

[0035] 2. A method for preparing a ceramic paste for a multilayer chip ceramic capacitor, comprising the following steps:

[0036] (1) Pre-dispersion: add an o...

Embodiment 3

[0043] 1. The composition of the ceramic paste of the multi-layer chip ceramic capacitor is calculated as: 77% of ceramic powder, 7% of organic additives, and 16% of organic solvent.

[0044]Further, the organic additive is composed of a dispersant and a binder in a mass ratio of 2:1; wherein, the dispersant is formed by mixing phosphate ester and ethyl cellulose type A in a mass ratio of 4:3; The binder is composed of ethyl cellulose type B, ethyl cellulose type C, ethyl cellulose type D, and polyvinyl butyral in a mass ratio of 1:1:1:3.

[0045] Further, the organic solvent is formed by mixing alcohol and toluene in a mass ratio of 1:1, and both alcohol and toluene are electronic grades.

[0046] 2. A method for preparing a ceramic paste for a multilayer chip ceramic capacitor, comprising the following steps:

[0047] (1) Pre-dispersion: add organic solvent, dispersant and porcelain powder into the mixing tank, and stir for 35 minutes at 200 rpm stirring speed to obtain pre...