Porcelain paste of wet process multilayer chip ceramic capacitor and preparation method thereof

Abstract

The invention belongs to the technical field of multilayer chip ceramic capacitors, and in particular relates to a wet-process porcelain slurry of multilayer chip ceramic capacitors and a preparation method thereof; the slurry preparation process has a high degree of automation, high production efficiency, and a particle size of Uniform distribution and less bubbles enhance the dispersion uniformity and stability of the porcelain paste. The porcelain paste has a long storage time, less organic solvent content and low proportion, less pores during debinding, and the dielectric film of the porcelain paste and the inner electrode shrink during sintering. The ratio is relatively small, which improves the shrinkage matching of sintering debinding and reduces the risk of delamination cracking.

Description

technical field [0001] The invention belongs to the technical field of multilayer chip ceramic capacitors, in particular to a ceramic paste for a wet process multilayer chip ceramic capacitor and a preparation method thereof. Background technique [0002] With the rapid development of some special fields in China, such as electromagnetic pulse weapons, electromagnetic rail guns, oil exploration and other fields. Multilayer chip ceramic capacitors are referred to as chip capacitors. The conventional manufacturing process is to stack the ceramic dielectric diaphragms with printed electrodes (inner electrodes) in a dislocation manner, and form a ceramic chip after one-time high-temperature sintering. Metal layers (external electrodes) are sealed on both ends of the filament to form a monolith-like structure. This process is referred to as dry process. The process equipment cost of this process is relatively high (especially for highly integrated automatic intelligent equipment)...

AI Technical Summary

Problems solved by technology

Multilayer chip ceramic capacitors are referred to as chip capacitors for short. The conventional manufacturing process is to stack the ceramic dielectric diaphragms with printed electrodes (internal electrodes) in a dislocation manner, and form a ceramic chip after one-time high-temperature sintering, and then on the chip. Both ends of the metal layer (external electrode) are sealed to form a structure similar to a monolith. This process is referred to as a dry process. The cost of process equipment for this process is relatively high (especially for highly integrated automatic intelligent equipment) , The dry process contains harmful solvents (toluene), there are many key quality control points before the green body is formed (not easy to control), and delamination is easy to occur during the green body debinding and sintering (especially for large-scale and high-thickness products). If the dry process is used Using porcelain slurry to make high-voltage and high-capacity multilayer ceramic chip capacitors, large pulse power ceramic capacitors and other special multilayer ceramic chip capacitors has problems such as high cost, relatively narrow product series, and easy delamination of products after debinding and sintering. , such as the patent document CN102653469B discloses a kind of chip multilayer ceramic capacitor dielectric slurry and dielectric preparation method

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