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Composite material applied to electronic equipment and production method thereof

A composite material and electronic equipment technology, applied in the field of composite materials, can solve the problems of reducing the toughness of composite materials, low wear resistance and corrosion resistance, unfavorable processing and production, etc. High abrasion resistance and corrosion resistance, easy processing effect

Inactive Publication Date: 2021-01-05
惠州市国鹏科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electronic equipment refers to equipment composed of integrated circuits, transistors, electronic tubes and other electronic components, which use electronic technology software to play a role, including electronic computers and robots controlled by electronic computers, numerical control or program control systems, etc. General electronic equipment requires composite materials Processing and assembly; the composite material of traditional electronic equipment uses silicon as raw material, directly chemical compound processing, which reduces the toughness of the composite material of electronic equipment, low wear resistance and corrosion resistance, extremely unstable performance, and the processing process It pollutes a lot and is not conducive to protecting the environment. At the same time, the raw materials of composite materials for traditional electronic equipment are cheap and expensive, and the processing is troublesome, which increases production costs and is not conducive to processing and production. In view of these defects, composite materials and their production for electronic equipment are designed method is necessary

Method used

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  • Composite material applied to electronic equipment and production method thereof
  • Composite material applied to electronic equipment and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Composite materials used in electronic equipment, the formula includes: epoxy resin, graphite, silicon carbide, aluminum oxide, potassium permanganate, deionized water, ethylene acrylic acid copolymer, styrene, hydrogen peroxide, initiator and diluent, each The mass percentages of the components are: 16% epoxy resin, 20% graphite, 25% silicon carbide, 10% aluminum oxide, 4% potassium permanganate, 10% deionized water, 2% ethylene acrylic acid copolymer, Styrene 8%, hydrogen peroxide 1%, initiator 1% and thinner 3%.

[0033] The production method of the composite material applied to the electronic equipment includes the following steps: Step 1, raw material selection; Step 2, mixed precipitation; Step 3, centrifugal electric shock; Step 4, sintering and shaping; Step 5, packaging and storage;

[0034] Wherein the above step 1, according to the mass percentage of each component is: epoxy resin 16%, graphite 20%, silicon carbide 25%, aluminum oxide 10%, potassium permangan...

Embodiment 2

[0049] Composite materials used in electronic equipment, the formula includes: epoxy resin, graphite, silicon carbide, aluminum oxide, potassium permanganate, deionized water, ethylene acrylic acid copolymer, styrene, hydrogen peroxide, initiator and diluent, each The mass percentages of the components are: 16% epoxy resin, 25% graphite, 20% silicon carbide, 10% aluminum oxide, 4% potassium permanganate, 10% deionized water, 2% ethylene acrylic acid copolymer, Styrene 8%, hydrogen peroxide 1%, initiator 1% and thinner 3%.

[0050] The production method of the composite material applied to the electronic equipment includes the following steps: Step 1, raw material selection; Step 2, mixed precipitation; Step 3, centrifugal electric shock; Step 4, sintering and shaping; Step 5, packaging and storage;

[0051] Wherein the above step 1, according to the mass percentage of each component is: epoxy resin 16%, graphite 25%, silicon carbide 20%, aluminum oxide 10%, potassium permanganat...

Embodiment 3

[0066] Composite materials used in electronic equipment, the formula includes: epoxy resin, graphite, silicon carbide, aluminum oxide, potassium permanganate, deionized water, ethylene acrylic acid copolymer, styrene, hydrogen peroxide, initiator and diluent, each The mass percentages of the components are: 16% epoxy resin, 30% graphite, 15% silicon carbide, 10% aluminum oxide, 4% potassium permanganate, 10% deionized water, 2% ethylene acrylic acid copolymer, Styrene 8%, hydrogen peroxide 1%, initiator 1% and thinner 3%.

[0067] The production method of the composite material applied to the electronic equipment includes the following steps: Step 1, raw material selection; Step 2, mixed precipitation; Step 3, centrifugal electric shock; Step 4, sintering and shaping; Step 5, packaging and storage;

[0068] Wherein the above step 1, according to the mass percentage of each component is: epoxy resin 16%, graphite 30%, silicon carbide 15%, aluminum oxide 10%, potassium permangan...

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Abstract

The invention discloses a composite material applied to electronic equipment and a production method of the composite material, and the formula of the composite material comprises the following components in percentage by mass: 15-25% of epoxy resin, 20-30% of graphite, 15-25% of silicon carbide, 10-20% of aluminum oxide, 2-4% of potassium permanganate, 10-20% of deionized water, 1-3% of an ethylene-acrylic acid copolymer, 5-10% of styrene, 0.5-1% of hydrogen peroxide, 0.5-1% of an initiator and 1-3% of a diluent, the composite material is safe and reliable, graphite, silicon carbide, aluminumoxide, an ethylene-acrylic acid copolymer and styrene are adopted as raw materials, centrifugal electric shock is conducted to prepare a composite material raw material, then epoxy resin is smeared,sintering is conducted, the toughness, abrasion resistance and corrosion resistance of the composite material of the electronic equipment are improved, the performance is more stable, and the machining process is free of pollution, and environmental protection is facilitated.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a composite material applied to electronic equipment and a production method thereof. Background technique [0002] Electronic equipment refers to equipment composed of integrated circuits, transistors, electronic tubes and other electronic components, which use electronic technology software to play a role, including electronic computers and robots controlled by electronic computers, numerical control or program control systems, etc. General electronic equipment requires composite materials Processing and assembly; the composite material of traditional electronic equipment uses silicon as raw material, directly chemical compound processing, which reduces the toughness of the composite material of electronic equipment, low wear resistance and corrosion resistance, extremely unstable performance, and the processing process It pollutes a lot and is not conducive to pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/565C04B41/83C04B35/64C04B35/622
CPCC04B35/565C04B41/83C04B41/4853C04B35/64C04B35/622C04B2235/425C04B2235/3217C04B2235/3268
Inventor 刘瑞富
Owner 惠州市国鹏科技有限公司
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