Boron-silicon phenolic resin suitable for hot-melt preimpregnation process, composite material and preparation methods of boron-silicon phenolic resin and composite material

Abstract

The invention provides boron-silicon phenolic resin suitable for a hot-melt preimpregnation process, a composite material and preparation methods of the boron-silicon phenolic resin and the compositematerial, wherein the boron-silicon phenolic resin comprises the following preparation raw materials in parts by mole: 50-150 parts of phenol, 50-200 parts of aldehyde, 2-150 parts of a boron-containing compound and 1-80 parts of silicate ester; raw materials for preparing the borosilicate phenolic resin further comprise a modifier and a flexibilizer. the dosage relationship among the modifier, the toughening agent and the phenol comprises 100 parts by weight of the phenol, 0-50 parts by weight of the modifier and 0-50 parts by weight of the toughening agent. Compared with a boron-silicon phenolic resin solution, the boron-silicon phenolic resin suitable for the hot-melt preimpregnation process has the advantages of good storage stability, good fiber adhesion, low porosity of a composite material, high mechanical strength and good ablation resistance, and compared with the boron-silicon phenolic resin, Si-O bonds with high bond energy are introduced, so the heat resistance of the boron-silicon phenolic resin is further improved, and the interlayer strength and ablation scouring performance of the composite material product taking the boron-silicon phenolic resin as a base materialare greatly improved.

Description

technical field [0001] The invention belongs to the technical field of thermosetting resin materials, and in particular relates to a borosilicate phenolic resin suitable for a hot-melt prepreg process, a composite material and a preparation method thereof. Background technique [0002] The production process of thermosetting resin prepreg mainly includes solution impregnation process and hot melt prepreg process. A large number of solvents in the resin used in the solution impregnation process are likely to pollute the environment and endanger human health. It is difficult to accurately control the resin content of prepregs, high volatile content, poor batch stability, and the product has high porosity, and the quality and performance are affected. influences. Compared with the solution impregnation process, the hot melt prepreg process has a lower degree of environmental pollution, and the resin content of the prepreg has high control precision, low volatile matter content...

AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is to provide a borosilicate phenolic resin suitable for the hot melt prepreg process, a composite material and a preparation method thereof, which can solve the problem of poor storage stability of the borosilicate phenolic resin solution in the solution impregnation process and adhesion to fibers. The problem of poor performance, as well as the problems of high porosity, low mechanical strength, and poor ablation resistance of composite materials, and compared with boron phenolic resin, the Si-O bond with higher bond energy is introduced, which makes borosilicate phenolic resin resistant. The thermal performance is further improved, and the interlayer strength and ablation and erosion performance of composite products based on it are greatly improved

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