Chemical palladium plating solution and application thereof, and chemical palladium plating method

A technology of electroless plating and tetraammonia palladium sulfate, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of precious metal palladium waste and increase process cost, etc.

Active Publication Date: 2021-02-02
吉安宏达秋科技有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This results in a waste of precious metal palladium, greatly increasing the cost of the process

Method used

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  • Chemical palladium plating solution and application thereof, and chemical palladium plating method
  • Chemical palladium plating solution and application thereof, and chemical palladium plating method
  • Chemical palladium plating solution and application thereof, and chemical palladium plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Dissolve polyethyleneimine in deionized water to obtain a concentrated solution of polyethyleneimine with a concentration of 100 mg / L;

[0072] 1g tetraammine palladium sulfate, 5g ethylenediamine, 7.5g 2-amino-n-butanol, 7.5g isobutanolamine, 10g methacrylic acid, 10g crotonic acid, 10mL polyethyleneimine with a mass concentration of 100mg / L The concentrated solution, 5g of sodium hypophosphite and 0.5L of deionized water were mixed and stirred to dissolve to obtain a primary mixed solution;

[0073] The primary mixed solution and 0.5L deionized water were mixed and stirred to dissolve to obtain an electroless palladium plating solution; the pH value of the electroless palladium plating solution was adjusted to be 7;

[0074] The printed circuit board is pretreated according to the following steps: the first pickling (100mL / LHDQ-201 acidic detergent solution, 5min) → the first water washing (deionized water, soaking for 30s) → microetching (in the mixed solution Sodiu...

Embodiment 2

[0079] Dissolve polyethyleneimine in deionized water to obtain a concentrated solution of polyethyleneimine with a concentration of 100 mg / L;

[0080] 1g tetraammine palladium sulfate, 3g ethylenediamine, 75g 2-amino-n-butanol, 10g isobutanolamine, 8g methacrylic acid, 12g crotonic acid, 50mL concentration of polyethyleneimine concentrated solution of 100mg / L, 5g of sodium hypophosphite and 0.5L of deionized water were mixed and dissolved with stirring to obtain a primary mixed solution;

[0081] The primary mixed solution and 0.5L deionized water were mixed, stirred and dissolved to obtain an electroless palladium plating solution; the pH value of the electroless palladium plating solution was adjusted to 7.

[0082] The electroless plating layer was prepared according to the method of Example 1, except that the electroless palladium plating solution prepared in Example 2 was used.

Embodiment 3

[0084] Dissolve polyethyleneimine in deionized water to obtain a concentrated solution of polyethyleneimine with a concentration of 100 mg / L;

[0085] 1g tetraammine palladium sulfate, 6g ethylenediamine, 7g 2-amino-n-butanol, 7g isobutanolamine, 8g methacrylic acid, 12g crotonic acid, 50mL concentration of polyethyleneimine concentrated solution of 100mg / L, 5g of sodium hypophosphite and 0.5L of deionized water were mixed and dissolved with stirring to obtain a primary mixed solution;

[0086] The primary mixed solution and 0.5L deionized water were mixed, stirred and dissolved to obtain an electroless palladium plating solution; the pH value of the electroless palladium plating solution was adjusted to 7.

[0087] The electroless plating layer was prepared according to the method of Example 1, except that the electroless palladium plating solution prepared in Example 3 was used.

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Abstract

The invention belongs to the technical field of circuit board surface treatment, and particularly relates to a chemical palladium plating solution and application thereof, and a chemical palladium plating method. The chemical palladium plating solution provided by the invention takes water as a solvent, and comprises the following solutes with the mass concentration: 1-10g / L of tetrammine palladium sulphate, 1-20g / L of sodium hypophosphite, 10-30g / L of a composite complexing agent and 10-30g / L of a composite stabilizer; the composite complexing agent comprises ethylenediamine, 2-amino-n-butylalcohol and 2-amino-2-methyl-1-propanol; and the composite stabilizer comprises methacrylic acid, butenoic acid and polyethyleneimine. The chemical palladium plating solution provided by the inventionhas relatively high activity, and a palladium plating layer with excellent performance can be obtained without cylinder dragging activation. According to the embodiment result, the chemical palladiumplating solution provided by the invention has good stability and relatively long service life; and the palladium plating layer obtained by chemical palladium plating through the chemical palladium plating solution provided by the invention has good corrosion resistance and bonding performance.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of circuit boards, and in particular relates to an electroless palladium plating liquid, an application thereof, and a method for electroless palladium plating. Background technique [0002] A printed circuit board (Print Circuit Board, PCB) is a substrate for assembling electronic components, and is a printed board that forms point-to-point connections and printed components on a general-purpose substrate according to a predetermined design. In order to ensure the solderability of the circuit board in subsequent assembly and use, it is necessary to treat the surface of the circuit. [0003] The currently commonly used surface technology is the electroless nickel immersion gold process, that is, a nickel layer is first deposited on the copper surface of the circuit board, and then a gold layer is plated on the nickel layer through a displacement reaction. Although the electroless nickel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 文明立彭小英杨义华赵超刘光明
Owner 吉安宏达秋科技有限公司
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