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Method for welding magnesium oxide target to back plate

A magnesium oxide and target technology, applied in welding equipment, welding/welding/cutting items, auxiliary devices, etc., can solve problems such as insufficient bonding force and unsatisfactory wettability, and achieve increased wettability, enhanced welding quality, and enhanced Effect of Weld Strength

Inactive Publication Date: 2021-02-12
河南东微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to provide a method for welding the magnesium oxide target and the back plate. Through sandblasting and other treatments, the problems of unsatisfactory wettability and insufficient bonding force during the brazing process of the magnesium oxide target and the back plate are solved.

Method used

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  • Method for welding magnesium oxide target to back plate
  • Method for welding magnesium oxide target to back plate
  • Method for welding magnesium oxide target to back plate

Examples

Experimental program
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Effect test

Embodiment example 1

[0037] The steps of brazing a magnesia round target with a diameter of 200mm and a copper backplate are as follows:

[0038] Step 1: Wrap the sputtering surface of the target with high temperature resistant tape to prevent pollution;

[0039] Step 2: Polish the welding surface of the magnesium oxide target and the copper back plate with a steel rinse, then clean with isobutanol to remove oil and impurities, and then blow it off with an air gun;

[0040] Step 3: Select 200-mesh diamond sand grains for sandblasting, and the air pressure range in the sandblasting process is 0.3Mpa. After sand blasting, the welding surface is cleaned and dried with isobutanol again. After sand blasting, a rough layer with an average depth of 3-8 μm is formed on the welding surface of the magnesium oxide target and the back plate.

[0041] Step 4: Put the welding plane of the magnesium oxide target and the copper back plate upward on the heating platform, raise the temperature to 170°C at 4°C / min,...

Embodiment example 2

[0050] The steps of brazing a magnesia round target with a diameter of 300mm and an aluminum back plate are as follows:

[0051] Steps 1 to 3: Same as steps 1 to 3 of Implementation Case 1;

[0052] Step 4: Same as Step 4 of Implementation Case 1; where the heating rate is raised to 180°C at a rate of 3°C / min, and the temperature is kept constant;

[0053] Step 5: Same as Step 5 of Implementation Case 1; wherein the mass fraction of In in the solder is 98.6%, the mass fraction of Sn is 0.8%, and the mass fraction of Ga is 0.6%.

[0054] Step 6: Same as Step 6 of Implementation Case 1;

[0055] Step 7: Same as Step 7 of Implementation Case 1; wherein the heating system is:

[0056] a) Heating: heat at 5°C / min to 100°C for 30 minutes, heat at 3°C / min to 185°C for 60 minutes, and heat at 3°C / min to 210°C for 60 minutes;

[0057] b) Cool down: lower the temperature at 3°C / min to 135°C for 30 minutes, then air cool to room temperature.

[0058] Further, after scraping off excess ...

Embodiment example 3

[0061] The steps for brazing a magnesia rectangular target with a diameter of 300mm and a stainless steel back plate are as follows:

[0062] Steps 1 to 3: Same as steps 1 to 3 of Implementation Case 1;

[0063] Step 4: Same as Step 4 of Implementation Case 1; where the heating rate is raised to 180°C at a rate of 4°C / min, and the temperature is kept constant;

[0064] Step 5: Same as Step 5 of Implementation Case 1; wherein the mass fraction of In in the solder is 97.5%, the mass fraction of Sn is 1.5%, and the mass fraction of Ga is 1%.

[0065] Step 6: Same as Step 6 of Implementation Case 1;

[0066] Step 7: Same as Step 7 of Implementation Case 1; wherein the heating system is:

[0067] a) Heating: heat at 4°C / min to 100°C for 30 minutes, heat at 3°C / min to 180°C for 60 minutes, and heat at 3°C / min to 205°C for 60 minutes;

[0068] b) Cool down: reduce temperature at 3°C / min to 130°C for 30 minutes, then air cool to room temperature.

[0069] Further, after scraping o...

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Abstract

The invention provides a method for welding a magnesium oxide target to a back plate, and relates to the field of sputtering targets. The method comprises the steps of performing cleaning and sand blasting treatment on a target welding face and a back plate welding face; and pouring molten brazing filler metal onto the target welding face and the back plate welding face obtained after sand blasting treatment, and further enabling the brazing filler metal to infiltrate the target welding face and the back plate welding face by using ultrasonic waves to realize welding. According to the method,the welding bonding strength of the brazing filler metal and the welding faces is improved by adding the sand blasting treatment process on the welding faces, the welding quality is enhanced, the method is easy and convenient to operate, and the welding rate can reach 99% or above.

Description

technical field [0001] The invention belongs to the field of target material manufacture, and in particular relates to a magnesium oxide target material welding method. Background technique [0002] Magnesium oxide targets are widely used in integrated circuits, flat panel displays, solar energy and other fields because of their high temperature stability, high dielectric constant, low dielectric loss and transparency to visible light. The magnesium oxide target needs to be connected with the metal back plate to form a target component, which is assembled together on the sputtering base and used as a cathode. The metal back plate plays the role of electrical and thermal conductivity and fixed support. During the sputtering process, the magnesium oxide target is bombarded by high-energy ions and heats up. If the welding bonding strength between the target and the back plate is low, it will cause the target to deform, crack, or even fall off the back plate under heated conditi...

Claims

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Application Information

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IPC IPC(8): B23K3/08B23K103/08
CPCB23K3/085B23K2103/15
Inventor 王永超居炎鹏赵泽良仝红岩王留土郑海强史豪杰陈耘田郭利乐刘占军李伟
Owner 河南东微电子材料有限公司
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