Electromagnetic shielding adhesive tape and preparation method of hexagonal-boron-nitride-nanosheet-modified double-sided conductive adhesive tape layer thereof

A technology of hexagonal boron nitride and conductive tape, applied in the direction of conductive adhesives, film/sheet adhesives, adhesives, etc., can solve the problem of increasing product weight, inevitable gaps and openings in shielding frames, and affecting shielding covers Conductivity and integrity and other issues, to achieve the effect of improving flexibility and conductivity, improving adhesion and reducing fluidity

Inactive Publication Date: 2021-02-12
飞悦科技(东莞)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional metal shields are generally made of nickel-nickel-nickel copper or nickel-nickel copper into a shielding frame that is easy to bend and stretch. However, the inevitable gaps and openings in the shielding frame affect the conductivity and integrity of the shielding case. Increased product weight

Method used

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  • Electromagnetic shielding adhesive tape and preparation method of hexagonal-boron-nitride-nanosheet-modified double-sided conductive adhesive tape layer thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Add the hexagonal boron nitride powder into the tetrahydrofuran solution, stir, ultrasonically disperse at 800W for 1-2h, centrifuge at 10000r / min for 15-30min, take the supernatant, dry and grind to obtain the size Hexagonal boron nitride nanosheet material with a thickness of 0.4-0.7 μm and a thickness of 0.9-2 nm.

[0027] (2) Add dopamine hydrochloride into the buffer solution, stir evenly, according to the mass ratio of dopamine hydrochloride and hexagonal boron nitride nanosheet material is 1:2.5, add hexagonal boron nitride nanosheet material, at 35 ℃ Heating and pre-reacting for 2 hours to obtain a polydopamine-modified hexagonal boron nitride nanosheet solution.

[0028] (3) According to the mass ratio of butyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and polydopamine-modified hexagonal boron nitride nanosheets as 90:15:3:2:8, butyl acrylate , methyl methacrylate, acrylic acid and hydroxyethyl acrylate were added to a weak alkalin...

Embodiment 2

[0032] (1) Add the hexagonal boron nitride powder into the tetrahydrofuran solution, stir, ultrasonically disperse at 1000W for 2h, centrifuge at 11000r / min for 30min, take the supernatant, dry and grind to obtain a size of 0.4-0.7 μm, hexagonal boron nitride nanosheet material with a thickness of 0.9-2nm.

[0033] (2) Add dopamine hydrochloride into the buffer solution, stir evenly, according to the mass ratio of dopamine hydrochloride and hexagonal boron nitride nanosheet material is 1:3, add hexagonal boron nitride nanosheet material, at 40 ℃ Pre-react by heating for 4 hours to obtain a polydopamine-modified hexagonal boron nitride nanosheet solution.

[0034] (3) According to the mass ratio of butyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and polydopamine-modified hexagonal boron nitride nanosheets as 100:20:5:4:10, butyl acrylate , methyl methacrylate, acrylic acid, and hydroxyethyl acrylate were added to a weak alkaline solvent, heated and emuls...

Embodiment 3

[0038] (1) Add the hexagonal boron nitride powder into the tetrahydrofuran solution, stir, ultrasonically disperse at 900W for 1.5h, centrifuge at 10500r / min for 20min, take the supernatant, dry it, and grind it to obtain a solution with a size of 0.4- 0.7μm, hexagonal boron nitride nanosheet material with a thickness of 0.9-2nm.

[0039] (2) Add dopamine hydrochloride into the buffer, stir evenly, according to the mass ratio of dopamine hydrochloride and hexagonal boron nitride nanosheet material is 1:2.8, add hexagonal boron nitride nanosheet material, at 38 ℃ Heating and pre-reacting for 3 hours to obtain a polydopamine-modified hexagonal boron nitride nanosheet solution.

[0040] (3) According to the mass ratio of butyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and polydopamine-modified hexagonal boron nitride nanosheets as 95:18:4:3:9, butyl acrylate , methyl methacrylate, acrylic acid, and hydroxyethyl acrylate were added to a weak alkaline solv...

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Abstract

The invention provides an electromagnetic shielding adhesive tape and a preparation method of a hexagonal-boron-nitride-nanosheet-modified double-sided conductive adhesive tape layer. The electromagnetic shielding adhesive tape comprises a release layer, a double-sided conductive adhesive tape layer based on hexagonal boron nitride nanosheet modification and a metal layer, the preparation method of the double-sided conductive adhesive tape layer comprises the following steps: adding dopamine hydrochloride into a buffer solution, and performing stirring; adding a hexagonal boron nitride nanosheet material, and performing heating for pre-reaction to obtain a polydopamine-modified hexagonal boron nitride nanosheet solution; dropwise adding an initiator and the polydopamine-modified hexagonalboron nitride nanosheet solution into an acrylate emulsifier at the same time, continuing to react after dropwise adding is completed, and dropwise adding the initiator to react to obtain a hexagonal-boron-nitride-nanosheet-modified self-repairing pressure-sensitive adhesive; and finally, uniformly stirring the modified self-repairing pressure-sensitive adhesive, graphene, a curing agent and a dispersing agent, performing defoaming, coating the upper surface and the lower surface of the polymer base film with the mixture, performing drying and curing to obtain the double-sided conductive adhesive tape layer based on hexagonal boron nitride nanosheet modification.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic shielding tapes, and in particular relates to an electromagnetic shielding tape and a method for preparing a double-sided conductive tape layer modified based on hexagonal boron nitride nanosheets. Background technique [0002] With the rapid development of electronic materials, the calculation speed of electronic products is getting faster and faster, the resolution is getting higher and higher, and the functions are getting more and more. Therefore, the density of high-speed components in electronic products is increasing, and the problem of electromagnetic interference It's also getting worse. At present, the electromagnetic radiation interference on electronic products is mostly hundreds of megahertz, and a good conductor below 0.2mm can have a good electromagnetic shielding effect. [0003] Traditional metal shields are generally made of nickel-nickel-nickel copper or nickel-nickel-n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29C09J7/38C09J9/02C09J133/08C09J11/04
CPCC08K2003/385C08K2201/001C08K2201/011C09J9/02C09J11/04C09J133/066C09J2400/163C09J2423/046C09J2423/106C09J2433/00C09J2467/006C09J2479/086C09J7/29C09J7/385C08K9/08C08K7/00C08K3/38C08K3/042
Inventor 李锦云
Owner 飞悦科技(东莞)有限公司
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