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A kind of mica plate and preparation method thereof

Active Publication Date: 2022-05-13
HUBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the condition that mica resources are gradually exhausted, the cost problem is more prominent; secondly, the entire process from mica paper to mica board needs to consume a large amount of high-quality fresh water, electricity, and organic solvents such as toluene, which is not conducive to saving and environmental protection; in addition, mica During the production process of the board, the cutting process of the mica paper will produce a large amount of waste and waste
The most important thing is that the defect of laminating the mica board after gluing the mica paper is that there are two layers of film produced by gluing between the mica paper and the mica paper. When the film is affected by high temperature, the film is easy to bubble and delaminate the mica board. cause quality problems
[0003] At present, the technology of changing the paper and board division production method of the existing technology and adopting mica powder to directly press the mica board is rare in China. The exceptions all use organic solvents and organic glues (such as silicone resins). The production process is not environmentally friendly and also leads to poor heat resistance of mica boards (organic silicone resins decompose at relatively high temperatures and emit smoke). Unable to work normally for a long time at high temperature (such as 300-550°C)

Method used

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  • A kind of mica plate and preparation method thereof
  • A kind of mica plate and preparation method thereof
  • A kind of mica plate and preparation method thereof

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preparation example Construction

[0041] The invention provides a preparation method of a mica board. Using mica flakes / powder that are rarely used or not used in the traditional mica board production process or even recycled waste or leftovers as raw materials, after crushing, rinsing, centrifuge dehydration, drying and fine crushing, it is mixed with self-configured various oxide powders In the pressing mold, the above two powders are layered and intersected according to different mass fractions. After molding, they are placed in a muffle furnace and sintered at a low temperature according to a certain heat treatment system to prepare a variety of oxide mixed powders that are self-configured by the mica board. During the sintering process, it acts as an inorganic binder to firmly combine the cross-laminated mica layers. Since the self-configured various oxide mixed powders and mica flakes / powders are all inorganic materials, they do not exist in traditional mica boards. The interface between mica paper and g...

Embodiment 1

[0046] (1) Raw material preparation: the mica flakes / powder that are rarely used or not used in the traditional mica board production process or even recycled waste or leftovers are rinsed, dehydrated by a centrifuge, dried, and crushed by a crusher before being used;

[0047] (2) Preparation of Batch 1: Send the reserved mica flakes / powder into Raymond Mill for fine grinding and sieving to obtain 60-mesh mica flakes / powder Batch 1.

[0048] (3) Preparation of batch two: the weight percentages of various raw materials are as follows: 22% of silicon dioxide powder, 3% of alumina powder, 25% of boron oxide powder, 20% of barium oxide powder, 16 % zinc oxide powder and 14% calcium fluoride powder were added to a ball mill jar and ball milled for 120 minutes to obtain batch two.

[0049] (4) Lamination: According to the weight ratio of the single-layer layer of batch 1 and batch 2 to maintain a relationship of 7:3, place batch 2 in the mold for laying, and then stack batch 1 on th...

Embodiment 2

[0053] (1) Raw material preparation: the mica flakes / powder that are rarely used or not used in the traditional mica board production process or even recycled waste or leftovers are rinsed, dehydrated by a centrifuge, dried, and crushed by a crusher before being used;

[0054] (2) Preparation of Batch 1: Send the reserved mica flakes / powder into Raymond Mill for fine grinding and sieving to obtain 40-mesh mica flakes / powder Batch 1.

[0055] (3) Preparation of batch two: the weight percentages of various raw materials are as follows: 25% silicon dioxide powder, 5% alumina powder, 30% boron oxide powder, 15% barium oxide powder, 15% % zinc oxide powder and 10% calcium fluoride powder were added to a ball mill jar and ball milled for 150 minutes to obtain batch two.

[0056] (4) Lamination: According to the weight ratio of the single-layer layup of batch 1 and batch 2 to maintain a relationship of 6:4, lay batch 2 in the mold, and then stack batch 1 on the batch For the upper l...

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Abstract

The invention relates to a mica board and a preparation method thereof. Using mica flakes / powder that are rarely used or not used in the traditional mica board production process and self-configured various oxide mixed powders as raw materials, the process is carried out in a pressing mold in the form of a layer of mica powder and a layer of various oxide mixed powders. Layered intersecting cloth, with distilled water added evenly as a temporary binder, the block green body obtained after the cloth powder is laminated is put into a muffle furnace, sintered and solidified according to a certain heat treatment system, and annealed to obtain The mica board proposed by the present invention. The present invention adopts mica flakes / powder direct board forming method, which not only simplifies the production process, but also improves the shortcomings of traditional mica board delamination, foaming and low mechanical strength; and the whole production process does not use organic solvents and resin materials, which is environmentally friendly and at the same time It can also improve the disadvantages of the electrical performance of traditional mica boards that are not resistant to high temperatures, thereby achieving the purpose of reducing the production cost of mica boards and improving the quality of mica boards.

Description

technical field [0001] The invention belongs to the technical field of material processing, and relates to a mica material processing technology, in particular to a mica plate and a preparation method thereof, wherein the mica plate is processed into a mica plate from little or no mica sheets used in the traditional mica plate manufacturing process. Background technique [0002] Because mica has typical high resistance properties, it is preferred as an insulating material. It is widely used in a wide range of fields such as electrical appliances and electromechanical. The finished products of mica materials include mica paper, mica board and mica powder. At present, the production method of traditional mica board is as follows: first, the mica sheets are broken and dissociated into certain fine scales by using a hydraulic pulper, then the mica scales are processed into mica paper by sizing and papermaking after the slurry is diluted, and then mica The paper is coated with or...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B32/00C04B14/20
CPCC04B32/005C04B14/20
Inventor 常鹰魏志顺谌援王莉黄海晟江佳怡郭炜
Owner HUBEI UNIV OF TECH
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