Polyimide film and preparation method thereof

A technology of polyimide film and polyamic acid is applied in the field of thermal conductive materials, which can solve the problems of incomplete thermal imidization and uneven thickness, and achieve the effects of no structural defects, good uniformity and reduction of defects.

Active Publication Date: 2021-02-26
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the application provides a polyimide film and its preparation method, which can effectively solve the uneven thickness of the existing polyimide film , Technical defects of incomplete thermal imidization

Method used

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  • Polyimide film and preparation method thereof
  • Polyimide film and preparation method thereof
  • Polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The embodiment of the present application provides the first polyimide film, and the specific preparation method includes:

[0039] 1. Dry the 500ml three-neck flask equipped with mercury seal, nitrogen inlet tube, drying tube and bottle stopper in the blast dryer, take it out after drying, and add 5g of BZD (4,4 '-biphenylenediamine), and rinse the funnel with 80 g of dimethylacetamide. Then add 5.45g of biphenyltetracarboxylic dianhydride (BPDA) in 2-3min through another dry powder funnel under vigorous stirring, then after rinsing with 14g of dimethylacetamide, replace the powder funnel with a stopper, and The three-necked flask was placed in ice water at -15°C, mixed and stirred for 6 hours to prepare the first polyamic acid solution, which was stored in a closed and dry flask, and placed in an environment of -15°C for defoaming for later use.

[0040] 2. Take out the polyamic acid after static defoaming at low temperature to room temperature environment, put it in...

Embodiment 2

[0045] The embodiment of the present application provides the second polyimide film, and the specific preparation method includes:

[0046]1. Dry the 500ml three-neck flask equipped with mercury seal, nitrogen inlet tube, drying tube and bottle stopper in the blast dryer, take it out after drying, and add 5g of 4,4'- Diaminobenzoyl anilide, and rinse the funnel with 80 g of N-methylpyrrolidone. Then add 5.50 g of hexafluorodianhydride within 3 minutes through another dry powder funnel under vigorous stirring, and then rinse with 15 g of N-methylpyrrolidone, replace the powder funnel with a stopper, and place the three-neck flask on ice at -15 ° C. Mix and stir in water for 3 hours to prepare the first polyamic acid solution, store it in a closed and dry flask, and place it in an environment of -15° C. for future use.

[0047] 2. Take out the polyamic acid after static defoaming at low temperature to room temperature, put it into a vacuum container, vacuumize the container, an...

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Abstract

The invention belongs to the technical field of heat conduction materials, and particularly relates to a polyimide film and a preparation method thereof. The invention provides a polyimide film preparation method, which comprises: 1, dissolving a diamine monomer and a dianhydride monomer in an aprotic polar solution under a protection atmosphere, and stirring at a low temperature to prepare a first polyamide acid solution; 2, sequentially carrying out low-temperature standing defoaming and vacuum defoaming treatment on the precursor polyamic acid solution to obtain a second polyamide acid solution; and 3, coating the second polyamide acid solution on a base material, drying, carrying out a thermal imidization reaction, and separating the polyimide film from the base material to prepare thepolyimide film. The invention provides the polyimide film and a preparation method thereof. The technical defects that an existing polyimide film is uneven in thickness and incomplete in thermal imidization can be effectively overcome.

Description

technical field [0001] The application belongs to the technical field of thermally conductive materials, and in particular relates to a polyimide film and a preparation method thereof. Background technique [0002] With the rapid development of the information industry and portable electronic products, the integration scale of microelectronic components and power equipment will become smaller and smaller, and the working environment of high current and high heat flux will also put forward higher requirements on the heat dissipation performance of thermal conductive materials. Become a technical bottleneck for the sustainable development of the electronics industry. Graphite film material has excellent electrical and thermal conductivity. The thermal conductivity of microcrystalline graphite sheet can reach more than 2000W / (m·K). High thermal conductivity graphite film basically uses polyimide film as a precursor. [0003] At present, Japan is in a leading position in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1067C08G73/1007C08G73/1039C08J5/18C08L79/08C08J2379/08
Inventor 王启民陈子豪张腾飞
Owner GUANGDONG UNIV OF TECH
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