Cleaning treatment method for metal film circuit on ferrite substrate before electroplating

A technology of metal thin film and treatment method, applied in the direction of cleaning method using liquid, cleaning method using gas flow, cleaning method and utensils, etc., can solve the problem that the quality of the electroplating layer is not high and cannot fully meet the electroplating requirements of circulator/isolator devices Process quality and efficiency requirements, circuit surface damage and other issues, to achieve the effect of shortening the pre-plating treatment time, meeting the requirements of electroplating process efficiency and reliability, and improving reliability

Inactive Publication Date: 2021-03-09
中国电子科技集团公司第九研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Organic solvent cleaning cannot effectively remove all pollutants such as the oxide layer, resulting in low quality of the electroplating layer; although physical scrubbing can remove the oxide layer, it will cause damage to the circuit surface and introduce other pollutants at the same time, and the efficiency is low. Complete treatment at one time It usually takes about 30 minutes
The effect of plasma cleaning is better, but the cleaning time is long, the cost of equipment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Pre-plating treatment method for metal thin film circuit on a ferrite substrate, including the following steps:

[0030] (1) The ferrite substrate of 25 pieces of 50.8 × 50.8 × 0.4 mm sputter film circuit is placed in a flower basket;

[0031] (2) The "carbon dioxide snow" cleaning device is used for injection cleaning, the control pressure is 0.3 MPa, and the injection cleaning time is 5 minutes;

[0032] (3) Configure a 5L volume concentration of 30% oxalate, 5L volume concentration of 5% dilute hydrochloric acid solution, both 1: 1 mixed, put the flower basket in the solution tank for 3 minutes;

[0033] (4) Taking the "carbon dioxide snow" cleaning device for injection cleaning, the control pressure is 0.1 MPa, and the injection cleaning time is 2 minutes;

[0034] (5) Rinse the flower basket in the pure water flush tank for 3 minutes;

[0035] Through the above-mentioned electroplated pre-plated cleaning treatment method, the entire treatment time is 13 minutes, the su...

Embodiment 2

[0037] Pre-plating treatment method for metal thin film circuit on a ferrite substrate, including the following steps:

[0038] (1) The ferrite substrate of 25 pieces of 50.8 × 50.8 × 0.4 mm sputter film circuit is placed in a flower basket;

[0039] (2) Injection cleaning is performed using the "carbon dioxide snow" cleaning device, the control pressure is 0.2 MPa, and the injection cleaning time is 5 minutes;

[0040] (3) Configure a 5L volume concentration of 20% oxalate solution, 5L volume concentration of 2% dilute sulfuric acid solution, both 1: 1 mix, placed the flower basket in the solution tank for 3 minutes;

[0041] (4) Injection cleaning is performed using the "carbon dioxide snow" cleaning device, the control pressure is 0.15 MPa, and the injection cleaning time is 2 minutes;

[0042] (5) Rinse the flower basket in the pure water flush tank for 3 minutes;

[0043] Through the above-mentioned electroplated pre-plated cleaning treatment method, the entire treatment time...

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PUM

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Abstract

The invention discloses a cleaning treatment method for a metal film circuit on a ferrite substrate before electroplating, and belongs to the field of microelectronic device processing. The cleaning treatment method comprises the following steps: carrying out primary spray cleaning on a ferrite substrate by using carbon dioxide snow fluid, carrying out soaking treatment by using an acid solution,carrying out secondary spray cleaning on the ferrite substrate by using the carbon dioxide snow fluid, flushing the ferrite substrate by using pure water and the like. By adopting the method providedby the invention, the processing time is shortened by at least 50% compared with the original processing time, the reliability of an electroplated film layer is improved, and the requirements of circulator/isolator devices on the electroplating process efficiency and reliability are met.

Description

Technical field [0001] The present invention relates to the field of microelectronic device processing, and more particularly to a metal thin film circuit electroplated cleaning treatment method on a ferrite substrate. Background technique [0002] The microwave ferrite loop / isolator is an indispensable key device for various radar systems. It is mainly used to solve the series of problems such as microwave system level isolation, impedance matching, and antenna transceiver sharing, which can greatly improve the tactics of radar systems. performance. [0003] The microwave ferrite loop / isolator microstrip film circuit is generally composed of an adhesive layer, a copper seed layer, a barrier layer, a gold layer. Among them, the adhesion layer and the copper seed layer were prepared from magnetron sputtering, and then the copper seed layer was thickened, copper plated back to the copper plating, and the gold layer was plated. [0004] When electroplating is performed on the co...

Claims

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Application Information

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IPC IPC(8): B08B5/02B08B3/08C25D5/54H01P1/38H01P1/36
CPCB08B3/08B08B5/02C25D5/54H01P1/36H01P1/38
Inventor 林亚宁陈学平倪经周俊李光东李林玲徐德超邹延珂张羽黄河陈彦吴燕辉
Owner 中国电子科技集团公司第九研究所
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