Cleaning treatment method for metal film circuit on ferrite substrate before electroplating

Abstract

The invention discloses a cleaning treatment method for a metal film circuit on a ferrite substrate before electroplating, and belongs to the field of microelectronic device processing. The cleaning treatment method comprises the following steps: carrying out primary spray cleaning on a ferrite substrate by using carbon dioxide snow fluid, carrying out soaking treatment by using an acid solution,carrying out secondary spray cleaning on the ferrite substrate by using the carbon dioxide snow fluid, flushing the ferrite substrate by using pure water and the like. By adopting the method providedby the invention, the processing time is shortened by at least 50% compared with the original processing time, the reliability of an electroplated film layer is improved, and the requirements of circulator / isolator devices on the electroplating process efficiency and reliability are met.

Description

Technical field [0001] The present invention relates to the field of microelectronic device processing, and more particularly to a metal thin film circuit electroplated cleaning treatment method on a ferrite substrate. Background technique [0002] The microwave ferrite loop / isolator is an indispensable key device for various radar systems. It is mainly used to solve the series of problems such as microwave system level isolation, impedance matching, and antenna transceiver sharing, which can greatly improve the tactics of radar systems. performance. [0003] The microwave ferrite loop / isolator microstrip film circuit is generally composed of an adhesive layer, a copper seed layer, a barrier layer, a gold layer. Among them, the adhesion layer and the copper seed layer were prepared from magnetron sputtering, and then the copper seed layer was thickened, copper plated back to the copper plating, and the gold layer was plated. [0004] When electroplating is performed on the co...

AI Technical Summary

Problems solved by technology

Organic solvent cleaning cannot effectively remove all pollutants such as the oxide layer, resulting in low quality of the electroplating layer; although physical scrubbing can remove the oxide layer, it will cause damage to the circuit surface and introduce other pollutants at the same time, and the efficiency is low. Complete treatment at one time It usually takes about 30 minutes

The effect of plasma cleaning is better, but the cleaning time is long, the cost of equipment operation and maintenance is high, and it is difficult to treat the heavily polluted substrate surface, which will pollute the vacuum chamber of the plasma equipment instead.

[0006] Therefore, the prior art cannot fully meet the requirements for the quality and efficiency of the electroplating process in the production of circulators / isolators, and it is urgent to invent a new and more effective cleaning process for metal thin film circuits on ferrite before electroplating.