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Preparation method of flexible insulating plate, obtained flexible insulating plate, flexible laminated plate and preparation method and application thereof

A technology for insulating boards and laminates, applied in the field of flexible laminates and their preparation, preparation of flexible insulating boards, and flexible insulating boards, can solve problems such as difficult film formation, high dielectric loss, and complicated processes, and achieve The effect of reducing the difficulty of impregnation, low dielectric loss, and great application prospects

Inactive Publication Date: 2021-03-19
RUISHENG NEW ENERGY DEV CHANGZHOU +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The flexible insulating board substrate of FPC—polyimide (PI) substrate, due to its high water absorption rate, high dielectric loss at high frequency (10GHz), and the need to use adhesive or thermoplastic polyimide resin ( TPI) caused by defects such as complex process, can no longer meet the requirements of flexible printed circuit boards (FPC) such as high frequency, high speed, large capacity storage and transmission
[0004] Liquid crystal polymer substrate (LCP) is not the best choice for FPC because of its difficulty in film formation, poor bending resistance, demanding multilayer lamination process and high cost.
[0005] Fluororesin has excellent dielectric properties and heat resistance, but its strength is low and its CTE is relatively high. It is often necessary to modify it with glass fiber cloth or fillers when it is prepared into copper clad laminates (CCL)

Method used

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  • Preparation method of flexible insulating plate, obtained flexible insulating plate, flexible laminated plate and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] The invention discloses a method for preparing a flexible insulating board, which includes the following process:

[0027] Step S1: Prepare the glue solution of the first fluororesin, immerse the ultra-thin fiber layer with a thickness of 8 μm-25 μm in the glue solution of the first fluororesin, and cure for the first time to obtain a prepreg.

[0028] The ultra-thin fiber layer improves the problem of low fluororesin content due to impregnation difficulties caused by too thick glass fibers in the prior art, avoids glass fiber lines on the surface when it is pressed into CCL, and improves the softness of the insulating board, enabling The insulating board can be applied to a flexible insulating board.

[0029] In a preferred embodiment, the ultra-thin fiber layer is a fiber fabric woven from one or more of glass fibers, quartz fibers and organic fibers. Among them, the ultra-thin fiber layer made of glass fiber can be D-type, S-type, E-type or NE-type electronic glass ...

Embodiment 1

[0064] A flexible laminate 1 was prepared.

[0065] 1) Prepare the first fluororesin glue solution, the first fluororesin glue solution is PTFE resin glue solution, and its solid content is 60%.

[0066] 2) Take an ultra-thin fiber layer (E-type electronic glass fiber cloth) with a thickness of 13 μm, immerse the ultra-thin fiber layer in the first fluororesin glue, and then enter it into an oven for curing through a roller. The curing temperature is 70°C and the drying time is 5 minutes. , remove the water to obtain a prepreg.

[0067] 3) Prepare the second fluororesin glue, the second fluororesin glue is the same as the first fluororesin glue, apply it to both sides of the prepreg by coating, and then enter the oven for curing. The temperature is 70°C, the drying time is 5 minutes, and the water is removed to obtain a semi-finished product.

[0068] 4) Repeat step 3) three times.

[0069] 5) The product obtained in step 4) is transferred to an oven for heat treatment. The...

experiment example 1

[0075] Measure the dielectric constant Dk, dielectric loss coefficient Df, CTE (X), CTE (Y), water absorption, 180 ℃ copper peeling strength and observation surface of the flexible laminates obtained in Examples 1-4 and Comparative Examples 1-5 Whether there is fiberglass texture.

[0076] 1) Measurement method of dielectric constant Dk and dielectric loss coefficient Df

[0077] Based on the JISC2565 test standard, the Dk and Df of the sample were tested using the ADMS01Nc series dielectric constant tester TM mode resonator of the Japanese AET company, and the average value was taken for multiple measurements of the same sample.

[0078] 2) Measurement method of CTE(X) and CTE(Y)

[0079] Based on the standard of IPC TM-6502.4.24.3, the CTE value of each insulating board was measured under the measurement conditions of 25°C to 288°C using TA Q400 equipment of TA Instrument.

[0080] CTE(X) is the coefficient of thermal expansion of the flexible insulating board in the trans...

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Abstract

The invention provides a preparation method of a flexible insulating plate, the obtained flexible insulating plate, a flexible laminated plate and a preparation method and application thereof, the preparation method of the flexible insulating plate comprises the following steps: dipping an ultrathin fiber layer with a thickness of 8-25 [mu] m in a glue solution of a first fluororesin, and carryingout first curing to obtain a prepreg; coating or spraying the glue solution of the second fluororesin to the two sides of the prepreg, curing for the second time, and repeatedly coating or spraying and curing until the total mass percent of the first fluororesin and the second fluororesin is 60%-95% so as to obtain a semi-finished product; carrying out heat treatment on the semi-finished productto obtain a fiber-reinforced fluororesin layer; and laminating and forming one, two or more fiber reinforced fluororesin layers to obtain the flexible insulating plate. The flexible insulating plate and the flexible laminated plate have the characteristics of low dielectric loss, small thickness, good flexibility and the like, and have a greater application prospect in future high-frequency and miniaturized devices.

Description

【Technical field】 [0001] The invention relates to the field of circuit board preparation, in particular to a preparation method of a flexible insulating board, the obtained flexible insulating board, a flexible laminated board, a preparation method thereof, and applications. 【Background technique】 [0002] With the recent trend of miniaturization, high speed and various functional integration of electronic equipment, flexible printed circuit boards (FPC) with excellent dielectric properties, low water absorption, good bending resistance and low coefficient of thermal expansion (CTE) ) has become an indispensable auxiliary product for electronic equipment. [0003] The flexible insulating board substrate of FPC—polyimide (PI) substrate, due to its high water absorption rate, high dielectric loss at high frequency (10GHz), and the need to use adhesive or thermoplastic polyimide resin ( The defects such as complex process caused by TPI) can no longer meet the requirements of f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/04B32B15/08B32B27/08B32B27/20B32B27/28B32B33/00B32B37/10B32B38/08B32B38/18H05K1/03
CPCB32B27/08B32B27/28B32B33/00B32B27/20B32B15/08B32B37/10B32B38/08B32B38/1816H05K1/0366B32B2260/046B32B2260/021B32B2307/546B32B2307/206B32B2457/08
Inventor 王宏远张翼蓝王和志
Owner RUISHENG NEW ENERGY DEV CHANGZHOU
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