Fluorinated aliphatic ring structure epoxy resin and preparation method thereof

Abstract

The invention discloses fluorinated aliphatic ring structure epoxy resin and a preparation method thereof. The epoxy resin comprises the following raw materials: an acrylate monomer, fluorinated acrylate, an alicyclic epoxy acrylate compound, glycidyl methacrylate, an initiator and a solvent. The preparation method comprises the following steps of: mixing the acrylate monomer, the fluorinated acrylate, the alicyclic epoxy acrylate compound and the glycidyl methacrylate, dropwise adding the mixture into the solvent, and heating an obtained solution to 70-80 DEG C to obtain a mixture; dropwise adding the initiator into the mixture,carrying out a reaction while performing stirring, and heating to continue the reaction, thereby obtaining the fluorinated aliphatic ring structure epoxy resin. The fluorinated aliphatic ring structure epoxy resin has a UV rapid curing capability; a cured product has a low dielectric constant; and the fluorinated aliphatic ring structure epoxy resin can be widely applied to a super-large-scale integrated circuit process;.

Description

technical field [0001] The invention relates to a fluorinated aliphatic ring structure epoxy resin and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] The integration of integrated circuit components continues to increase, and the feature size continues to shrink, especially when the line width is reduced to sub-micron size. The corresponding signal delay and crosstalk between signals have become the bottleneck problem that limits the overall performance of the integrated circuit. The greatest challenge to connection reliability. In the traditional process, aluminum is used as metal interconnection and SiO 2 The resistance-capacitance interconnection delay brought by the interconnection metal dielectric layer is already greater than the gate delay of the signal itself. The parasitic capacitance effect between metal lines can be reduced by using low dielectric constant materials. Low dielectric constant inte...

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Problems solved by technology

[0003] Epoxy resin refers to a resin containing two or more epoxy groups in its molecule. Due to its good heat resistance, solvent resistance, physical, mechanical and electrical insulation properties, and good adhesion to various materials , Good chemical stability and widely used as adhesives, coatings, resin-based composite materials, widely used in the field of electronic packaging, but its water absorption and dielectric constant are not ideal, the dielectric constant value is 3 to 4, And the usual epoxy resin is bisphenol A type epoxy resin, because UV radiation curing activity is low, and it is difficult to meet the rapid microelectronic packaging field.

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