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System and method for machining nanoscale small holes in hard and brittle materials through conical lens

A technology of hard and brittle materials and processing systems, applied in nanotechnology, metal processing equipment, manufacturing tools, etc., can solve the problems of poor uniformity of small hole structure, difficult to process small holes, etc., to reduce feature size and suppress lateral thermal diffusion , to achieve the effect of high-quality uniform nanohole array processing

Active Publication Date: 2021-03-30
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the existing problems that it is difficult to process small holes below 30nm and the uniformity of the small hole structure is poor when using an axicon lens to prepare small holes on the surface of hard and brittle materials, and to provide a method of using an axicon lens to realize nanoscale A processing system and method for small holes. The system and method compress and shape the femtosecond laser in space through an axicon lens to obtain a spatial beam with a Bessel structure. Through the nonlinear effect of the beam interacting with hard and brittle materials, it can be obtained Nanochannel structure with large aspect ratio (20:1)

Method used

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  • System and method for machining nanoscale small holes in hard and brittle materials through conical lens
  • System and method for machining nanoscale small holes in hard and brittle materials through conical lens
  • System and method for machining nanoscale small holes in hard and brittle materials through conical lens

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Embodiment 1

[0062] Carry out micropore processing on the quartz surface, the laser used in the present invention is the Ti:Sapphire laser independently developed by the Institute of Physics, Chinese Academy of Sciences, the center wavelength is 800nm, the repetition rate is 1kHz, the laser single pulse energy is 1 μ J, and the pulse width is 30fs, and the processing objective lens (ie short-focus objective lens) is a ×50 objective lens with a numerical aperture of 0.6 and a working distance of 10mm. Such as Figure 4 As shown, the processed structure is a "hat-shaped structure" with a disc and a central hole. Among them, for a structure with a large central hole, the diameter of the central hole accounts for 1 / 2 to 1 / 3 of the overall diameter, and the size of the hole is between 100-200nm. For structures with smaller central holes, the diameter of the central hole accounts for 1 / 10 to 1 / 5 of the overall diameter, and the diameter of the central hole is less than 100nm. These structures a...

Embodiment 2

[0065] The laser used in this example is a fiber laser produced by Anyon Laser, with a maximum output power of 20W. The objective lens used in processing is ×50, the repetition frequency is 100Hz, the laser single pulse energy is 1.5μJ, the center wavelength is 1030nm, and the pulse width is 300fs. After frequency doubling, the BBO crystal can generate a femtosecond laser with a center wavelength of 515nm. Compared with the 800nm ​​Ti:Sapphire laser, the 515nm laser pulse has a shorter light wavelength, which is conducive to processing smaller structures. The pulse repetition frequency can be flexibly adjusted through external triggering. With the internal repetition frequency setting of the laser, the repetition frequency of the laser can be flexibly adjusted in a wide range from 1Hz to 5MHz, which is convenient for adjusting the mobile platform to a stable operating speed. By connecting the photodiode to the oscilloscope and observing the waveform, it can be found that the e...

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Abstract

The invention provides a system and method for machining nanoscale small holes in a hard and brittle material through a conical lens. The problems that when small holes are prepared in the surface ofthe hard and brittle material through an existing conical lens, the small holes with the sub-wavelength being 30 nm or below are difficult to machine, and the structural uniformity of the small holesis poor are solved. The processing system comprises a femtosecond laser, a polarization control module, an energy control module, the conical lens, a collimating lens, a micromachining module, a control system, a spherical lens and a spectrum detection module, wherein the polarization control module, the energy control module, the conical lens, the collimating lens and the micromachining module are sequentially arranged along an emergent light path of the femtosecond laser, and the control system controls the spectrum detection module, the femtosecond laser and the micromachining module respectively; the spectrum detection module collects light scattering information of the nanometer small holes through the spherical lens and feeds back the information to the control system, and the control system carries out accurate compensation control and correction on the position of a Bessel light needle in the hard and brittle material according to the information.

Description

technical field [0001] The invention belongs to the field of laser processing, and in particular relates to a processing system and method for realizing nanoscale small holes in hard and brittle materials by using an axicon lens. Prepare sub-30nm pores. Background technique [0002] Femtosecond laser three-dimensional micro-nano processing technology is a new type of extreme light field micro-nano manufacturing technology. This technology has a wide range of applications in the preparation of nano-scale high-precision components in the fields of aviation, biomedicine, new energy, national defense, and environmental monitoring. prospect. The nonlinear multi-photon ionization mechanism of the interaction between femtosecond laser and matter makes the characteristic linewidth of its processing smaller than the optical diffraction limit, that is, w<1.22λ / D, where λ is the laser wavelength and D is the diameter of the light exit. [0003] Based on the two-photon polymerizati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/064B23K26/03B23K26/04B82Y40/00
CPCB23K26/382B23K26/0648B23K26/03B23K26/04B82Y40/00
Inventor 陈烽陆宇杜广庆杨青
Owner XI AN JIAOTONG UNIV
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