Flame-retardant conductive adhesive for electronic packaging and preparation method thereof

Abstract

The invention relates to the field of electronic materials, and provides a flame-retardant conductive adhesive for electronic packaging and a preparation method thereof. The preparation method comprises the following steps of loading silane coupling agent treated copper powder on carbon aerogel, then adding the carbon aerogel into matrix glue, fully and uniformly mixing, and then uniformly mixing with silicon dioxide aerogel loaded with a flame retardant and a curing agent and a plasticizer, so as to obtain the flame-retardant conductive adhesive for electronic packaging. According to the method, superfine copper powder is loaded through carbon aerogel, so that the copper powder is effectively prevented from being oxidized; the silicon dioxide aerogel loaded flame retardant is dispersed in the conductive adhesive, the prepared conductive adhesive has a flame retardant effect, the bonding usability of the conductive adhesive is not affected by loading the flame retardant, meanwhile, the preparation process is simple, the preparation cost is greatly reduced, and the application of the copper powder conductive adhesive in the field of electronic packaging is effectively broadened.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to the preparation of conductive glue, in particular to a flame-retardant conductive glue for electronic packaging and a preparation method. Background technique [0002] In the field of electronic packaging, the environmental pollution caused by tin-lead solder has attracted more and more attention. As a substitute for tin-lead solder, conductive adhesives have attracted widespread interest because of their environmental friendliness, mild processing conditions, and simple process. However, conductive adhesives generally have problems such as low conductivity. Therefore, the development of conductive adhesives with excellent performance and capable of replacing traditional lead-tin solders has become the focus of research. [0003] Conductive adhesive is usually composed of two parts: matrix resin and conductive filler. Among them, the conductive filler is mainly metal powder...

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Problems solved by technology

[0009] Aiming at the defect that the anti-oxidation process of copper powder conductive adhesive widely used at present cannot achieve permanent modification, and at the same time directly adding flame retardants to the conductive adhesive affects the bonding effect, the present invention proposes a flame-retardant conductive adhesive for electronic packaging and the preparation method, on the one hand, the anti-oxidation performance of the conductive adhesive is effectively improved, and at the same time, the conductive adhesive has a flame retardant effect and does not affect the adhesion

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