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Polyamide molding composition as well as preparation method and application thereof

A polyamide molding and composition technology, applied in the field of engineering plastics, can solve the problems of poor air tightness, decreased mechanical strength, and fast crystallization rate of parts, and achieves good air tightness, improved air tightness, and slow crystallization rate. Effect

Active Publication Date: 2021-05-04
KINGFA SCI & TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the existing PA6T copolymer-based materials have a slow crystallization rate, their water absorption rate is high. After the material absorbs water, it will cause dimensional changes and a decrease in mechanical strength, resulting in poor air tightness of the parts; while PA10T copolymers The material as the matrix, although the water absorption rate is low, but its crystallization temperature is high, the crystallization rate is fast, and the crystallization is rapid during injection molding, which is prone to problems of under-injection and glue shortage, resulting in poor air tightness of the parts

Method used

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  • Polyamide molding composition as well as preparation method and application thereof
  • Polyamide molding composition as well as preparation method and application thereof
  • Polyamide molding composition as well as preparation method and application thereof

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preparation example Construction

[0037]The preparation method of polyamide resin: add diamine and diacid according to the ratio in Table 1 in the autoclave equipped with magnetic coupling stirring, condenser, gas phase port, feeding port and pressure explosion-proof port; then add benzoic acid, catalyst sodium hypophosphite and deionized water; the amount of benzoic acid is 2.5% of the total amount of diamine and diacid, and the weight of sodium hypophosphite is 0.1% of the weight of other feeds except deionized water, and the weight of deionized water is 30% of the total weight of feed. %; Vacuumize and fill high-purity nitrogen as a protective gas, heat up to 220°C within 2 hours under stirring, stir the reaction mixture for 1 hour, and then raise the temperature of the reactant to 240°C under stirring; react at a constant temperature Continue under constant pressure for 2 hours, keep the pressure constant by removing the formed water, discharge the material after the completion of the reaction, and vacuum d...

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Abstract

The invention discloses a polyamide molding composition as well as a preparation method and application thereof. The polyamide molding composition comprises the following components: 100 parts of polyamide resin; 4-10 parts of hyperbranched polyamide; 0-100 parts of a reinforcing filler; the polyamide resin is selected from any one of PA10T or PA10T / 10I. The polyamide molding composition with low crystallization temperature, low crystallization speed and low water absorption is prepared by adding a specific amount of amino-terminated hyperbranched polyamide into a polyamide material. The polyamide molding composition disclosed by the invention can delay the cooling rate of a material in a mold and improve the mold filling fluidity of the material under the condition of cold mold forming with multiple mold cavities, so that the material can better copy the mold structure, the problems of insufficient injection and insufficient glue are avoided, the air tightness of a workpiece is further improved, the method is suitable for the field of LED display screen reflection supports.

Description

technical field [0001] The invention relates to the technical field of engineering plastics, in particular to a polyamide molding composition and its preparation method and application. Background technique [0002] Because of its good mechanical properties, wear resistance, chemical resistance, self-lubricating properties, and low coefficient of friction, polyamide is widely suitable for reinforcement and modification with glass fiber and other fillers. However, ordinary polyamides such as PA6 and PA66 usually have a melting point below 260°C and lack high temperature resistance, so they cannot be used in areas with high operating temperatures. In recent years, semi-aromatic polyamides have been mainly developed due to their low water absorption and high temperature resistance. [0003] LED reflective brackets need to undergo high-temperature processing such as reflow soldering process, which requires materials with high heat distortion temperature and melting point; a ser...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08L77/00
CPCC08L77/06C08L2205/02C08L2203/20C08K2003/2241C08L77/00
Inventor 阎昆黄险波叶南飚姜苏俊曹民杨汇鑫蒋智强
Owner KINGFA SCI & TECH CO LTD
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